JP2005139501A - 耐熱性に優れた銅合金およびその製法 - Google Patents
耐熱性に優れた銅合金およびその製法 Download PDFInfo
- Publication number
- JP2005139501A JP2005139501A JP2003376122A JP2003376122A JP2005139501A JP 2005139501 A JP2005139501 A JP 2005139501A JP 2003376122 A JP2003376122 A JP 2003376122A JP 2003376122 A JP2003376122 A JP 2003376122A JP 2005139501 A JP2005139501 A JP 2005139501A
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- JP
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- Prior art keywords
- copper alloy
- annealing
- cold rolling
- rolling
- heat resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 238000005097 cold rolling Methods 0.000 claims abstract description 51
- 238000000137 annealing Methods 0.000 claims abstract description 47
- 239000013078 crystal Substances 0.000 claims abstract description 28
- 238000005098 hot rolling Methods 0.000 claims abstract description 22
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 abstract description 15
- 238000005096 rolling process Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 15
- 230000007423 decrease Effects 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000013507 mapping Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001887 electron backscatter diffraction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Conductive Materials (AREA)
- Metal Rolling (AREA)
Abstract
【解決手段】 Feを含み、500℃で1分間焼鈍した後のCube方位の方位密度が50%以下であり、且つ更に500℃で1分間焼鈍した後の平均結晶粒径が30μm以下である耐熱性に優れた銅合金であり、この様な銅合金は、Feを含む銅合金を熱間圧延したのち冷間圧延して冷延銅合金を製造する際に、熱間圧延と最終冷間圧延の間に冷間圧延と焼鈍を少なくとも2回ずつ実施すると共に、1回当りの冷間圧延を50〜80%の加工率で行い、最終冷間圧延時の加工率を30〜85%とすることによって製造できる。
Description
下記表1に示す化学成分の銅合金を各々コアレス炉で溶製し、半連続鋳造法で造塊して厚さ50mm×幅200mm×長さ500mmの鋳塊を得た。得られた各鋳塊を加熱してから厚さ12mmにまで熱間圧延したのち面削し、更に冷間圧延と焼鈍を繰返し、最後に最終圧延を行って厚さ約0.2mmの銅合金板を得た。
Claims (4)
- Feを含み、500℃で1分間焼鈍した後のCube方位の方位密度が50%以下であることを特徴とする耐熱性に優れた銅合金。
- Feを含み、500℃で1分間焼鈍した後のCube方位の方位密度が50%以下であり、且つ更に500℃で1分間焼鈍した後の平均結晶粒径が30μm以下であることを特徴とする耐熱性に優れた銅合金。
- Fe含量が0.01〜4質量%である請求項1または2に記載の銅合金。
- Feを含む銅合金を熱間圧延したのち冷間圧延して冷延銅合金を製造するに当り、熱間圧延と最終冷間圧延の間に冷間圧延と焼鈍を少なくとも2回ずつ実施すると共に、1回当りの冷間圧延を50〜80%の加工率で行い、最終冷間圧延時の加工率を30〜85%とすることを特徴とする耐熱性に優れた銅合金の製法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003376122A JP4041452B2 (ja) | 2003-11-05 | 2003-11-05 | 耐熱性に優れた銅合金の製法 |
US10/976,818 US20050092404A1 (en) | 2003-11-05 | 2004-11-01 | Softening-resistant copper alloy and method of forming sheet of the same |
CN200410090355.0A CN1614052A (zh) | 2003-11-05 | 2004-11-04 | 耐热性优良的铜合金及铜合金板的制法 |
DE102004053346.6A DE102004053346B4 (de) | 2003-11-05 | 2004-11-04 | Verfahren zum Bilden eines erweichungsbeständigen Kupferlegierungsbleches |
KR1020040089127A KR20050043655A (ko) | 2003-11-05 | 2004-11-04 | 내열성이 우수한 구리 합금 및 구리 합금판의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003376122A JP4041452B2 (ja) | 2003-11-05 | 2003-11-05 | 耐熱性に優れた銅合金の製法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007004680A Division JP4280287B2 (ja) | 2007-01-12 | 2007-01-12 | 耐熱性に優れた電気・電子部品用銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005139501A true JP2005139501A (ja) | 2005-06-02 |
JP4041452B2 JP4041452B2 (ja) | 2008-01-30 |
Family
ID=34544313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003376122A Expired - Fee Related JP4041452B2 (ja) | 2003-11-05 | 2003-11-05 | 耐熱性に優れた銅合金の製法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050092404A1 (ja) |
JP (1) | JP4041452B2 (ja) |
KR (1) | KR20050043655A (ja) |
CN (1) | CN1614052A (ja) |
DE (1) | DE102004053346B4 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008010378A1 (en) | 2006-07-21 | 2008-01-24 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheets for electrical/electronic part |
EP1882751A1 (en) | 2006-07-28 | 2008-01-30 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength and high softening resistance |
WO2009019990A1 (ja) | 2007-08-07 | 2009-02-12 | Kabushiki Kaisha Kobe Seiko Sho | 銅合金板 |
EP2056056A1 (en) | 2007-10-23 | 2009-05-06 | Kobelco & Materials Copper Tube, Ltd. | Copper alloy tube for heat exchanger excellent in fracture strength |
JP2010126783A (ja) * | 2008-11-28 | 2010-06-10 | Nippon Mining & Metals Co Ltd | 電子材料用銅合金板又は条 |
JP4608025B1 (ja) * | 2010-06-03 | 2011-01-05 | 三菱伸銅株式会社 | 放熱性及び樹脂密着性に優れた電子機器用銅合金条材 |
JP2011176260A (ja) * | 2010-01-30 | 2011-09-08 | Mitsubishi Shindoh Co Ltd | Ledチップとリードフレームとの接合方法 |
JP2011208271A (ja) * | 2010-03-11 | 2011-10-20 | Mitsubishi Shindoh Co Ltd | 樹脂密着性に優れた電子機器用Cu−Fe−P系銅合金条材 |
US8063471B2 (en) | 2006-10-02 | 2011-11-22 | Kobe Steel, Ltd. | Copper alloy sheet for electric and electronic parts |
JP2012177153A (ja) * | 2011-02-25 | 2012-09-13 | Kobe Steel Ltd | 銅合金 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4441467B2 (ja) * | 2004-12-24 | 2010-03-31 | 株式会社神戸製鋼所 | 曲げ加工性及び耐応力緩和特性を備えた銅合金 |
US20090116996A1 (en) * | 2005-06-08 | 2009-05-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.) | Copper alloy, copper alloy plate, and process for producing the same |
EP1918390B1 (en) | 2005-07-07 | 2012-01-18 | Kabushiki Kaisha Kobe Seiko Sho | Process for producing copper alloy plate with high strength and excellent processability in bending |
EP2048251B1 (en) * | 2006-05-26 | 2012-01-25 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength, high electric conductivity and excellent bending workability |
JP2009179864A (ja) * | 2008-01-31 | 2009-08-13 | Kobe Steel Ltd | 耐応力緩和特性に優れた銅合金板 |
CN106029929B (zh) | 2014-03-31 | 2019-03-22 | 古河电气工业株式会社 | 轧制铜箔、轧制铜箔的制造方法、柔性带状电缆、柔性带状电缆的制造方法 |
JP6172368B1 (ja) * | 2016-11-07 | 2017-08-02 | 住友電気工業株式会社 | 被覆電線、端子付き電線、銅合金線、及び銅合金撚線 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3522112A (en) * | 1967-06-26 | 1970-07-28 | Olin Corp | Process for treating copper base alloy |
JP4329967B2 (ja) * | 2000-04-28 | 2009-09-09 | 古河電気工業株式会社 | プラスチック基板に設けられるピングリッドアレイ用icリードピンに適した銅合金線材 |
JP2002226929A (ja) * | 2001-01-30 | 2002-08-14 | Nippon Mining & Metals Co Ltd | 高周波回路用銅合金箔 |
JP3798260B2 (ja) * | 2001-05-17 | 2006-07-19 | 株式会社神戸製鋼所 | 電気電子部品用銅合金及び電気電子部品 |
JP3962291B2 (ja) * | 2001-07-17 | 2007-08-22 | 日鉱金属株式会社 | 銅張積層板用圧延銅箔およびその製造方法 |
-
2003
- 2003-11-05 JP JP2003376122A patent/JP4041452B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-01 US US10/976,818 patent/US20050092404A1/en not_active Abandoned
- 2004-11-04 DE DE102004053346.6A patent/DE102004053346B4/de not_active Expired - Fee Related
- 2004-11-04 CN CN200410090355.0A patent/CN1614052A/zh active Pending
- 2004-11-04 KR KR1020040089127A patent/KR20050043655A/ko active Search and Examination
Cited By (18)
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US9631260B2 (en) | 2006-07-21 | 2017-04-25 | Kobe Steel, Ltd. | Copper alloy sheets for electrical/electronic part |
US9644250B2 (en) | 2006-07-21 | 2017-05-09 | Kobe Steel, Ltd. | Copper alloy sheet for electric and electronic part |
EP2339038A2 (en) | 2006-07-21 | 2011-06-29 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheet for electric and electronic part |
EP2339039A2 (en) | 2006-07-21 | 2011-06-29 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheet for electric and electronic part |
WO2008010378A1 (en) | 2006-07-21 | 2008-01-24 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheets for electrical/electronic part |
EP1882751A1 (en) | 2006-07-28 | 2008-01-30 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength and high softening resistance |
US8063471B2 (en) | 2006-10-02 | 2011-11-22 | Kobe Steel, Ltd. | Copper alloy sheet for electric and electronic parts |
WO2009019990A1 (ja) | 2007-08-07 | 2009-02-12 | Kabushiki Kaisha Kobe Seiko Sho | 銅合金板 |
EP2695956A2 (en) | 2007-08-07 | 2014-02-12 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheet |
EP2695958A2 (en) | 2007-08-07 | 2014-02-12 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheet |
EP2695957A2 (en) | 2007-08-07 | 2014-02-12 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheet |
EP2056056A1 (en) | 2007-10-23 | 2009-05-06 | Kobelco & Materials Copper Tube, Ltd. | Copper alloy tube for heat exchanger excellent in fracture strength |
JP2010126783A (ja) * | 2008-11-28 | 2010-06-10 | Nippon Mining & Metals Co Ltd | 電子材料用銅合金板又は条 |
JP2011176260A (ja) * | 2010-01-30 | 2011-09-08 | Mitsubishi Shindoh Co Ltd | Ledチップとリードフレームとの接合方法 |
JP2011208271A (ja) * | 2010-03-11 | 2011-10-20 | Mitsubishi Shindoh Co Ltd | 樹脂密着性に優れた電子機器用Cu−Fe−P系銅合金条材 |
JP2011252215A (ja) * | 2010-06-03 | 2011-12-15 | Mitsubishi Shindoh Co Ltd | 放熱性及び樹脂密着性に優れた電子機器用銅合金条材 |
JP4608025B1 (ja) * | 2010-06-03 | 2011-01-05 | 三菱伸銅株式会社 | 放熱性及び樹脂密着性に優れた電子機器用銅合金条材 |
JP2012177153A (ja) * | 2011-02-25 | 2012-09-13 | Kobe Steel Ltd | 銅合金 |
Also Published As
Publication number | Publication date |
---|---|
CN1614052A (zh) | 2005-05-11 |
US20050092404A1 (en) | 2005-05-05 |
KR20050043655A (ko) | 2005-05-11 |
DE102004053346B4 (de) | 2017-12-28 |
DE102004053346A1 (de) | 2005-07-21 |
JP4041452B2 (ja) | 2008-01-30 |
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