CN1579791A - 光源装置 - Google Patents

光源装置 Download PDF

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CN1579791A
CN1579791A CNA2004100766394A CN200410076639A CN1579791A CN 1579791 A CN1579791 A CN 1579791A CN A2004100766394 A CNA2004100766394 A CN A2004100766394A CN 200410076639 A CN200410076639 A CN 200410076639A CN 1579791 A CN1579791 A CN 1579791A
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light
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水由明
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Fujifilm Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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Abstract

本发明公开一种光源装置，该光源装置具有排列成行的LED的发光元件阵列安装到与散热片集成一体的支架上。支架的安装表面形成V形凹槽，作为用于提高照明效率的反射平面。阵列与印刷电路板分离，通过导线与印刷电路板相连接。阵列放置在凹槽的底面。印刷电路板放置在形成于凹槽壁上的阶梯上。由于阵列与具有低热导率的含树脂的印刷电路板分离，可以获得高效率的热辐射。此外，由于阵列靠近壁设置，可以防止LED的光强分布的不均匀性扩大。

Description

光源装置
技术领域
本发明涉及一种包括多个排列成行的发光元件的光源装置。
背景技术
已知包括发光元件阵列的光源装置，在该阵列中，多个发光元件(例如，LED)排成一行(参见日本已公开专利No.6-225080)。例如，发光元件阵列这样设置，将发光元件并排安装在印制有连接到电源的电路图案的印刷电路板上。各个发光元件的电极用导线焊接法电连接到电路图案。
因为可以在发光元件阵列的纵向方向获得均匀的照度分布，这种光源装置开始用作扫描仪和复印机的原图像照明光源，替代了常规使用的线性荧光灯。当该光源装置用作原图像照明光源时，设置原图像宽度方向(扫描方向)，使其与发光元件阵列的纵向一致。
此外，考虑将上述光源装置作为在具有光学定影特性的热敏记录纸上用于光学定影的光源。在这种情况下，与原图像照明光源的情况相比较需要更高的照度。因而，采用具有更高照度的发光元件。与此同时，设计发光元件阵列，使得其两端都设有在纵向方向延伸的反射平面。与此同时，在追求高功率时，热量值变大，这样，就需要根据测得热量值来调节热量。
在常规发光元件阵列中，各个发光元件和通过导线焊接法与其连接的电路图案安装在一个单独的印刷电路板上。尽管树脂通常用作印刷电路板的材料，但其热导系数比金属的热导系数低。考虑到该因素，采用金属替代树脂来制成印刷电路板。金属为铝等等。但是，与树脂板相比铝板的单位成本高。此外，蚀刻等加工成本高。因此，存在成本增加的问题。
在发光元件阵列的纵向方向上，发光元件的每一侧设置有电路图案。从而，电路图案位于发光元件和反射平面之间。因此，不可能使发光元件和反射平面之间的间隔缩短。当间隔大时，在纵向方向(扫描方向)上将产生强度分布的不均匀性变大的问题。该问题是因为发光元件阵列从微观上看只不过是点光源(发光元件)的集合，虽然该阵列在宏观上被看作线性光源。因此，与各个发光元件的排列间隔有关，在扫描方向上会产生微小的光强分布的不均匀性。当发光元件和发光平面之间的间隔变大时光强分布的不均匀性扩大并加重。
发明内容
本发明的主要目的是提供一种光源装置，该光源装置包括热辐射特性得到改善而不增加成本的发光元件阵列。
本发明的第二个目的是提供一种光源装置，该光源装置包括防止光强分布的不均匀性扩大的发光元件阵列。
为了实现上述和其它目的，根据本发明的光源装置包括具有排成一行的发光元件的发光元件阵列，和安装该元件阵列的固定架。光源装置包括与阵列分开设置并且其上印制有电路图案的印刷电路板。电路图案通过导线与阵列焊接。固定架上设有大致为V形截面的凹槽，将反射平面设置在位于凹槽底面上的阵列的纵向方向。凹槽的一部分侧壁设置成阶梯形用于放置印刷电路板。
发光元件阵列可以通过在板或薄片上安装发光元件的形式安装到固定架上。或者，可以不用板或薄片直接安装该阵列。同时，凹槽可以用由金属和电介质制成的反射涂层覆盖。
当采用具有平行六面体形的芯片型元件作为发光元件时，优选将各个元件的排列角倾斜设置，以防止平行的各个元件的侧面彼此接触。
顺便提一句，优选将固定架与散热片集成一体。此外，根据该目的，可以提供至少两种发光元件阵列以发射不同波长。
根据本发明，可以缩短发射平面和发光元件之间的间隔。因此，可以防止光强分布的不均匀性扩大。此外，由于发光元件阵列与印刷电路板分离，可以无需采用昂贵的具有良好热辐射特性的印刷电路板而达到改善热辐射特性的目的。
附图说明
图1为采用用于光学定影的集成光源的彩色热敏打印机的结构示意图；
图2为光学定影单元的分解透视图；
图3A和3B为芯片型LED的图解说明；
图4A和4B为发光元件阵列和印刷电路板的图解说明；
图5为固定架的侧视图；
图6为排列角度倾斜的LED的图解说明；
图7为形成于凹槽上并且具有高热导率的涂层的图解说明；
图8为注入凹槽中的透明树脂的图解说明；
图9为直接安装在固定架上的LED的图解说明；
图10为形成为阶梯状的凹槽壁；
图11A和11B为芯片型LED的图解说明；
图12A、12B和12C为在上下表面设有电极的LED的图解说明；
图13为设在侧表面上的进气风扇的图解说明。
具体实施方式
图1示出了采用本发明光源装置作为用于光学定影的光源的彩色热敏打印机10。彩色热敏打印机10在向前和向后方向往复传递彩色热敏记录纸11。在往复传递的过程中，进行热记录全色图像并且光学定影已经进行热记录的记录纸11。
众所周知，彩色热敏记录纸11包括黄色、品红和青色三层热敏彩色层，这三层热敏彩色层从最上层以该顺序形成于支撑体上。该记录纸11的黄色热敏彩色层作为最上层具有最高的热敏感度，青色热敏彩色层作为最下层具有最低的热敏感度。
黄色和青色热敏彩色层中的每一层具有对于特定波段光线响应的光学定影特性，以防止在较低彩色层受热时上面的彩色层的非彩色部分着色。在热记录图像后，各个彩色层通过辐射特定波段的光线光学定影。通过用发光峰值的波长约为420nm的蓝紫色光线辐射黄色定影层，使得黄色热敏彩色层失去其变色能力。通过用发光峰值的波长约为365nm的近紫外光线辐射青色定影层，使得青色热敏彩色层失去其变色能力。
热头12和滚筒13设置在记录纸11的通道上。滚筒13设置在热头12的相对位置上以从其背面支撑记录纸11。众所周知，热头12包括在扫描方向(记录纸的宽度方向)排列成行的很多加热元件构成的加热元件阵列12a。各个加热元件根据像素密度来产生热量。加热元件阵列12a向记录纸11挤压并且加热各个热敏彩色层以热记录黄色、品红和青色的图像。
辊子对14和光学定影单元16设置在热头12向前方向的下游侧。光学定影单元16为用于光学定影的光源。辊子对14夹住进给记录纸11以在垂直于扫描方向的副扫描方向上传输记录纸。在传输过程中，记录纸11通过热头12和光学定影单元16进行热记录和光学定影。光学定影单元16通过导线(未示出)连接到电源供给电路17。附图标记15表示安装在光学定影单元16上的散热风扇。
如图2所示，光学定影单元16包括发射黄色和品红光的发光元件阵列18和19、印刷电路板20和21、固定架22、侧板23和辐照板24。例如，用透明丙烯酸板作为辐照板24，以传播从各个发光元件阵列18和19发射的光。设置光学定影单元16以使辐照板24面对记录纸11。侧板23为光屏蔽板，用于防止光泄漏到侧面。
黄色发光元件阵列18包括多个排列成行的黄色LED(发光二极管)。品红发光元件阵列19包括多个排列成行的品红LED(发光二极管)。设置光学定影单元16以使阵列18和19的纵向方向与扫描方向一致。
LED26和27分别具有与黄色定影光线和品红定影光线相应的发光波长。黄色发光元件阵列18设置为单行。相反，品红发光元件阵列19设置为双行。由于品红热敏彩色层的敏感度低于黄色热敏彩色层，因而，品红定影光比黄色定影光需要更高的照度。
图3A为LED26和27上表面的平面视图，图3B为其侧表面的侧视图。LED26和27采用没有用于导线连接的头部的芯片型LED。LED26和27中的每一个具有平行六面体形状，并且其上表面设有p(阳极)和n(阴极)电极31和32。两个电极的结采用MQW(多量子阱)型。MQW型芯片与同质结和双异质结芯片相比具有更高的能量效率。芯片基底33采用例如蓝宝石为基底。在蓝宝石基底上，用GaN(氮化镓)基的氮化物半导体材料形成各层。LED26和27分别从上表面和侧面发光。
由于蓝宝石基底在镓基材料的沉积作用方面极佳，该基底大量用于蓝色LED发射紫外线和蓝光。可以使用其它采用磷化镓、砷化镓、磷化铟、SiC(碳化硅)、GaN等作为基底材料的芯片代替以蓝宝石为基底的芯片。也可以使用采用这些材料的混合物的芯片。
LED26和27分别排列成行并且安装在带状薄板34上。各个LED26和27通过用粘结剂将芯片基底33的下表面连接到板34的上表面来安装。此时，采用具有良好热导率的粘结剂。采用例如具有良好热导率的铜板作为板34。可以采用薄片代替板。
如图4A所示，黄色发光元件阵列18为一行，这样，正侧和负侧的印刷电路板20依次设置。与此同时，如图4B所示，品红发光元件阵列19为两行，这样，总共设有三块印刷电路板。换句话说，两块板21设置在两行的正侧，并且一块板21设置在其负侧。负侧的印刷电路板21用作两个阵列21的公共板。不必说，印刷电路板21可以设置在各个负侧。
各个阵列18和19与各个印刷电路板20和21分离。用于电连接阵列和电源供给电路17的电路图案37印制在各个电路板20和21上。各个阵列18和19通过导线36焊接到电路图案37以保证导电。电路图案37包括连接到各个LED26和27的p电极或者n电极的焊接点38，和电连接到焊接点38的导电区39。导电区39包括一个焊接点，导线从该焊接点串接到电源供给电路17。在该实施方案中，通过采用电路图案37，各个LED26和27五个一组地连接。五个LED组成一组，各组平行连接。当然，可以改变连接的方式，还可以以其它的方式进行连接。
采用低成本的树脂作为印刷电路板20和21的材料。由于印刷电路板20和21与阵列18和19分离，因此，无需由于热辐射而采用高成本金属作为印刷电路板20和21的材料。
图5所示的固定架22由铜、铝等热辐射特性高的金属制成。固定架22与散热片41集成为一体。通过集成固定架和散热片，不再需要用于粘结的粘结剂，并且还改善了热辐射特性。顺便提一句，在该实施方案中，铜、铝等金属用作固定架的材料。但是，当需要精确性以不受热张力的影响时，可以采用氧化铝、氮化铝等陶瓷制品。与此同时，当想要以损害热辐射特性为代价减少部件成本时，可以采用具有良好热导率的塑料。
固定架22的固定表面形成具有V形截面的凹槽46-48。发光元件阵列18和19依次设置在凹槽46-48的底面。形成各个凹槽46-48以改善阵列18和19的照射效率。凹槽46-48的侧壁51、52、53用作向记录纸11反射从阵列18和19发射的光的反射平面。如上所述，LED26和27同样从侧面发射光。从侧面发射的光的总量大于从上表面发射的光。因此，在LED26和27的两侧提供反射平面非常有效。
为了提高反射平面的反射系数，可以用金属和电介质在各个凹槽46-48的表面上形成反射涂层。金属为金、银、铝等。电介质为二氧化硅、氧化钛、氧化钽、氧化锡、氧化铟等。可以采用混合材料而不是单一材料形成反射涂层。根据使用的LED的发光波长适当地选择反射涂层的材料。顺便提一句，为了改善发光元件阵列18和19的粘附度，可以电镀镍等材料。
在放置黄色阵列18的凹槽46的各个侧壁51a和51b的中间部分形成放置印刷电路板20的阶梯56。由此，避免在LED26和反射平面之间设置印刷电路板20，这样，可以缩短LED26和侧壁51之间的间隔。从而，可以防止各个LED26光强分布的不均匀性扩大。
凹槽47和48上放置品红阵列19，在位于两个凹槽47和48整体的两侧的侧壁52a和53a的中间部分形成阶梯57和58。正侧的印刷电路板21放置在阶梯57和58上。与此同时，形成作为凹槽47和48的隔离壁的侧壁52b和53b，使其高度T1低于整个凹槽的高度T0。负侧的印刷电路板21放置在隔离壁的上表面59上。可以缩短LED27与作为反射平面的侧壁之间的间隔。因而，与黄色发光元件阵列18类似，可以防止光强分布的不均匀性的扩大。
通过采用挤压成形的方法形成包括散热片和各个凹槽的固定架22，以防止加工成本增加。
上述实施方案为一个实例，并且可以作出各种改进。在上述实施方案中，相邻LED设置为其侧面彼此平行。但是，如图6所示，LED的排列角度可以倾斜。因为LED的侧面为发光表面，如果LED的侧面相互接触，发光效率很可能会下降。通过倾斜排列角度可以防止侧面相互接触。因此，可以防止发光效率下降。顺便提一句，优选将LED26的四个侧面以同样的方式与反射平面(凹槽侧壁)接触。换句话说，排列角度的倾斜优选为45度。
如图7所示，可以在凹槽46-48的侧壁形成涂层61。涂层由热导率比固定架22更好的材料制成。因此，热量被有效地辐射。此外，如图8所示，可以将硅树脂和环氧树脂的透明树脂62注入到凹槽中，以密封各个阵列18和19。在这种情况下，各个阵列和印刷电路板被稳固地安装。
如图9所示，可以不使用板，将LED26和27直接安装在凹槽46-48的底面。在这种情况下，优选用具有良好热导率的粘结剂粘结LED26和27。当不使用板安装LED26和27时，很可能存在与使用板的情况相比组装时间和成本增加的缺点。但是，其优点在于可以获得高热辐射特性。
如图10所示，凹槽63的侧壁63a具有一个较低的部分，该部分靠近光发射元件阵列64并且以阶梯状形成。从阵列64向记录纸发射并且被记录纸的表面反射的光，再次被侧壁63a的较低部分向记录纸反射。
如图11所示，芯片型LED71可以直接在板74上安装LED71的p和n电极72和73。在这种情况下，需要提供用于电连接各个电极72和73与印刷电路板77的导电部分76。通过采用芯片型LED71，可以防止例如导线短路的问题。这是因为可以减少用于将发光元件阵列连接到印刷电路板77的导线36。
可以采用图12所示LED83。LED83的上表面和下表面分别设有p和n电极81和82。在这种情况下，负侧的印刷电路板86具有连接到n电极82的导电部分84。电路板86还可以用作安装LED83的板。因此，放置正侧的印刷电路板88的阶梯94仅仅形成于固定架87的凹槽91-93中的每一个上。在该实施方案中，由于导电部分84用作负侧的公共电极，各个LED平行连接。
例如图13中所示，光学定影单元101可以设有用于将空气传递到每个凹槽102的进气风扇103。根据凹槽102的数量设置风扇103。排气口106形成于板的一侧，与设有进气风扇103的板的另一侧相对。当然，可以设置排气风扇而不是进气风扇。在这种情况下，排气口用作进气口。
在上述实施方案中，本发明的光源装置用作用于光学定影的光源，但是，也可以用作读取原图像的另一个光源。在这种情况下，根据所需用途适当地选择发光波长。此外，在上述实施方案中，LED用作发光元件。但是，LED并不是唯一的。还可以使用从表面发射光的各种半导体激光器件等发光元件。
尽管本发明已经通过参照附图以优选实施方案的方式进行了详尽的描述，但是，各种变化和改进对于本领域技术人员来说是显而易见的。因此，除非这些改变和改进背离本发明的范围，应当认为他们包含在本发明保护范围内。

Claims (11)

1.一种光源装置，包括：
至少一个具有多个排列成行的发光元件的发光元件阵列；
与所述发光元件阵列分开设置，并且具有通过导线与所述发光元件阵列连接的印刷电路图案的印刷电路板；和
安装所述发光元件阵列和所述印刷电路板的固定架，所述固定架具有用于放置所述发光元件阵列的基本上为V形截面的凹槽，并且所述凹槽的侧壁设置为所述发光元件阵列的纵向方向的反射平面；
其中，所述发光元件阵列放置在所述凹槽的底面，并且所述印刷电路板放置在形成于所述凹槽的所述侧壁的一部分上的阶梯上。
2.根据权利要求1的光源装置，其中，所述发光元件阵列具有用于安装所述发光元件的板或者薄片，并且所述发光元件阵列通过所述板或者薄片中的一个安装到所述固定架上。
3.根据权利要求1的光源装置，其中，所述发光元件直接安装在所述凹槽的所述底面。
4.根据权利要求1的光源装置，其中，所述凹槽涂覆金属和电介质形成的反射涂层。
5.根据权利要求1的光源装置，其中，所述发光元件为具有平行六面体形状的芯片型元件，并且设置各个发光元件，以防止相邻发光元件的侧面相互接触。
6.根据权利要求1的光源装置，其中，所述固定架与散热片集成为一体。
7.根据权利要求6的光源装置，其中，所述散热片上安装风扇。
8.根据权利要求1的光源装置，其中，提供至少两种所述发光元件阵列，以发射具有不同波长的光线。
9.根据权利要求1的光源装置，其中，所述发光元件阵列用注入到所述凹槽中的透明树脂密封。
10.根据权利要求1的光源装置，其中，所述发光元件为发光二极管。
11.根据权利要求1的光源装置，还包括：
用于将空气传递到所述凹槽中的进气风扇，所述进气风扇安装在所述固定架在所述纵向方向的一个侧面；和
形成于所述固定架在所述纵向方向的另一个侧面的排气口。
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