CN1556253A - 一种复合镀层材料的制备方法及设备 - Google Patents
一种复合镀层材料的制备方法及设备 Download PDFInfo
- Publication number
- CN1556253A CN1556253A CNA200410015650XA CN200410015650A CN1556253A CN 1556253 A CN1556253 A CN 1556253A CN A200410015650X A CNA200410015650X A CN A200410015650XA CN 200410015650 A CN200410015650 A CN 200410015650A CN 1556253 A CN1556253 A CN 1556253A
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- China
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- preparation
- anode
- composite plating
- electrolyzer
- electrolytic solution
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002131 composite material Substances 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 title claims description 27
- 238000002360 preparation method Methods 0.000 title claims description 11
- 238000005253 cladding Methods 0.000 title description 2
- 239000002245 particle Substances 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims description 31
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 239000008151 electrolyte solution Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- 239000013528 metallic particle Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 239000008139 complexing agent Substances 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000003756 stirring Methods 0.000 abstract description 2
- 239000003792 electrolyte Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 7
- 241000080590 Niso Species 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000004913 activation Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000001117 sulphuric acid Substances 0.000 description 6
- 235000011149 sulphuric acid Nutrition 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000001509 sodium citrate Substances 0.000 description 3
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 3
- 229940038773 trisodium citrate Drugs 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410015650XA CN100390326C (zh) | 2004-01-06 | 2004-01-06 | 一种复合镀层材料的制备方法及设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410015650XA CN100390326C (zh) | 2004-01-06 | 2004-01-06 | 一种复合镀层材料的制备方法及设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1556253A true CN1556253A (zh) | 2004-12-22 |
CN100390326C CN100390326C (zh) | 2008-05-28 |
Family
ID=34351446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB200410015650XA Expired - Lifetime CN100390326C (zh) | 2004-01-06 | 2004-01-06 | 一种复合镀层材料的制备方法及设备 |
Country Status (1)
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CN (1) | CN100390326C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103290458A (zh) * | 2013-07-11 | 2013-09-11 | 南京工程学院 | 凹凸棒土改性镍基纳米陶瓷颗粒复合镀层的制备方法 |
CN103952747A (zh) * | 2014-04-15 | 2014-07-30 | 株洲冶炼集团股份有限公司 | 一种铅炭复合材料电沉积装置 |
CN109342234A (zh) * | 2018-11-26 | 2019-02-15 | 杨凌美畅新材料股份有限公司 | 一种氨基磺酸镍体系镀液电沉积层硬度的检测方法 |
CN110565125A (zh) * | 2019-08-05 | 2019-12-13 | 宣城金诺模塑科技有限公司 | 一种汽车饰件用镀镍溶液及其电镀方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6199694A (ja) * | 1984-10-19 | 1986-05-17 | Nippon Kokan Kk <Nkk> | 金属ストリツプの電気めつき方法 |
DE3509388C2 (de) * | 1985-03-15 | 1993-12-09 | Held Kurt | Verfahren und Vorrichtung zur galvanischen Beschichtung von Pressbändern |
CN1074493A (zh) * | 1992-10-29 | 1993-07-21 | 昆明冶金研究所 | 一种复合镀层电镀方法 |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
CN1094995C (zh) * | 1996-08-20 | 2002-11-27 | 上海工业大学科技园区 | 用于氢镍电池的合金粉末电镀方法及其装置 |
US5893966A (en) * | 1997-07-28 | 1999-04-13 | Micron Technology, Inc. | Method and apparatus for continuous processing of semiconductor wafers |
KR19990064747A (ko) * | 1999-05-06 | 1999-08-05 | 이종구 | Ni-Fe 합금 박판 제조방법 및 그 장치 |
CN1142320C (zh) * | 2001-07-18 | 2004-03-17 | 浙江大学 | 含有无机类富勒烯结构的纳米材料的复合镀层及制备方法 |
WO2003018875A1 (en) * | 2001-08-27 | 2003-03-06 | Surfect Techologies, Inc. | Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles |
CN1382833A (zh) * | 2002-02-17 | 2002-12-04 | 余泽玲 | 一种挂具旋转的电镀方法 |
CN1265029C (zh) * | 2002-06-29 | 2006-07-19 | 重庆阿波罗机电技术开发公司 | 一种纳米复合镀浆料及其电镀方法 |
CN1174121C (zh) * | 2002-07-06 | 2004-11-03 | 重庆阿波罗机电技术开发公司 | 一种获得高耐磨、减摩纳米复合功能镀层的工艺 |
-
2004
- 2004-01-06 CN CNB200410015650XA patent/CN100390326C/zh not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103290458A (zh) * | 2013-07-11 | 2013-09-11 | 南京工程学院 | 凹凸棒土改性镍基纳米陶瓷颗粒复合镀层的制备方法 |
CN103290458B (zh) * | 2013-07-11 | 2015-12-09 | 南京工程学院 | 凹凸棒土改性镍基纳米陶瓷颗粒复合镀层的制备方法 |
CN103952747A (zh) * | 2014-04-15 | 2014-07-30 | 株洲冶炼集团股份有限公司 | 一种铅炭复合材料电沉积装置 |
CN109342234A (zh) * | 2018-11-26 | 2019-02-15 | 杨凌美畅新材料股份有限公司 | 一种氨基磺酸镍体系镀液电沉积层硬度的检测方法 |
CN110565125A (zh) * | 2019-08-05 | 2019-12-13 | 宣城金诺模塑科技有限公司 | 一种汽车饰件用镀镍溶液及其电镀方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100390326C (zh) | 2008-05-28 |
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Owner name: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTIO Free format text: FORMER NAME OR ADDRESS: WEIAN THERMOELECTRIC MATERIAL CO LTD, SHANGHAI |
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Address after: Shanghai City, Siping Road No. 710 715Z Patentee after: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. Address before: Room 201, No. 401 Jinqiao Road, Shanghai Patentee before: Shanghai Wayon Thermo-Electro Materials Co.,Ltd. |
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Owner name: SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO., L Free format text: FORMER NAME: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTION CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee after: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. Address before: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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Addressee: Du Linxue Document name: Notification of Passing Examination on Formalities |
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Address after: 200083 806, floor 8, No. 125, Liuying Road, Hongkou District, Shanghai Patentee after: Shanghai Wei'an Electronic Co.,Ltd. Address before: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee before: Shanghai Wei'an Electronic Co.,Ltd. |
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Granted publication date: 20080528 |