CN1555666A - 激光钻孔,尤其是采用孔板的激光钻孔方法 - Google Patents
激光钻孔,尤其是采用孔板的激光钻孔方法 Download PDFInfo
- Publication number
- CN1555666A CN1555666A CNA028180399A CN02818039A CN1555666A CN 1555666 A CN1555666 A CN 1555666A CN A028180399 A CNA028180399 A CN A028180399A CN 02818039 A CN02818039 A CN 02818039A CN 1555666 A CN1555666 A CN 1555666A
- Authority
- CN
- China
- Prior art keywords
- hole
- diameter
- laser beam
- laser
- orifice plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10145184A DE10145184B4 (de) | 2001-09-13 | 2001-09-13 | Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske |
DE10145184.9 | 2001-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1555666A true CN1555666A (zh) | 2004-12-15 |
CN100342760C CN100342760C (zh) | 2007-10-10 |
Family
ID=7698925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028180399A Expired - Fee Related CN100342760C (zh) | 2001-09-13 | 2002-09-04 | 激光钻孔,尤其是采用孔板的激光钻孔方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6649864B2 (zh) |
EP (1) | EP1425947B1 (zh) |
JP (1) | JP2005502476A (zh) |
CN (1) | CN100342760C (zh) |
DE (2) | DE10145184B4 (zh) |
WO (1) | WO2003026367A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101218063B (zh) * | 2005-06-07 | 2010-05-26 | 日酸田中株式会社 | 激光穿孔方法及加工装置 |
CN102759799A (zh) * | 2011-04-29 | 2012-10-31 | 昆山思拓机器有限公司 | 激光光束整型方法和激光光束整型装置 |
CN104582317A (zh) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | 印制电路板制作方法 |
CN108436308A (zh) * | 2018-03-16 | 2018-08-24 | 中国电子科技集团公司第三十八研究所 | 一种用于微波陶瓷基板上微孔的co2激光加工方法 |
CN111390380A (zh) * | 2019-01-01 | 2020-07-10 | 达航科技股份有限公司 | 印刷电路板的激光加工方法及其激光加工机 |
CN114682934A (zh) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | 多脉宽复合的印制电路板激光加工装置 |
CN114682932A (zh) * | 2022-04-14 | 2022-07-01 | 强一半导体(苏州)有限公司 | 一种适用于生瓷片的激光加工通孔的方法 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10136507A1 (de) * | 2001-07-17 | 2003-04-03 | Zeiss Carl | Geometrischer Strahlteiler und Verfahren zu seiner Herstellung |
DE10209617C1 (de) * | 2002-03-05 | 2003-08-07 | Siemens Ag | Laserbeschriftungsverfahren |
US20040112881A1 (en) * | 2002-04-11 | 2004-06-17 | Bloemeke Stephen Roger | Circle laser trepanning |
JP2004066327A (ja) * | 2002-08-09 | 2004-03-04 | Tdk Corp | レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法 |
US6802445B2 (en) * | 2002-10-24 | 2004-10-12 | St Assembly Test Services Pte. Ltd. | Cost effective substrate fabrication for flip-chip packages |
JP2004243404A (ja) * | 2003-02-17 | 2004-09-02 | Internatl Business Mach Corp <Ibm> | 穴形成方法および穴形成装置 |
JP2007507870A (ja) * | 2003-09-30 | 2007-03-29 | 日立ビアメカニクス株式会社 | ガスレーザー装置の動作方法 |
JP4729883B2 (ja) * | 2003-10-31 | 2011-07-20 | セイコーエプソン株式会社 | 基板の加工方法、マイクロレンズシートの製造方法、透過型スクリーン、プロジェクタ、表示装置並びに基板の加工装置 |
WO2005051591A1 (de) * | 2003-11-27 | 2005-06-09 | Hitachi Via Mechanics, Ltd. | Vorrichtung zur materialbearbeitung mittels eines durch eine piezoelektrische ablenkplätchen aufweisende ablenkeinheit geführten laserstrahls |
DE102004008256B3 (de) * | 2004-02-19 | 2005-09-08 | Siemens Ag | Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren |
DE102004042556B4 (de) * | 2004-09-02 | 2008-05-08 | Hitachi Via Mechanics, Ltd., Ebina | Laserlichtquelle, Verfahren zum Bearbeiten von Werkstücken mittels gepulster Laserstrahlung |
US7487834B2 (en) * | 2005-04-19 | 2009-02-10 | Uchicago Argonne, Llc | Methods of using a laser to perforate composite structures of steel casing, cement and rocks |
US7538296B2 (en) * | 2005-09-06 | 2009-05-26 | Pratt & Whitney Canada Corp. | High speed laser drilling machine and method |
JP4951282B2 (ja) * | 2006-07-11 | 2012-06-13 | 株式会社ディスコ | レーザー加工装置 |
JP2008186870A (ja) * | 2007-01-26 | 2008-08-14 | Disco Abrasive Syst Ltd | ビアホールの加工方法 |
US8171634B2 (en) | 2007-07-09 | 2012-05-08 | Pratt & Whitney Canada Corp. | Method of producing effusion holes |
US8390795B2 (en) * | 2008-01-10 | 2013-03-05 | Orbotech Ltd. | Multiple mirror calibration system |
US8362392B2 (en) | 2008-02-05 | 2013-01-29 | Pratt & Whitney Canada Corp. | Method for drilling holes according to an optimized sequence |
US9061369B2 (en) * | 2009-11-03 | 2015-06-23 | Applied Spectra, Inc. | Method for real-time optical diagnostics in laser ablation and laser processing of layered and structured materials |
EP2138422A1 (de) * | 2008-06-27 | 2009-12-30 | Teich Aktiengesellschaft | Platine zum Verschliessen eines Bechers |
KR20120086688A (ko) * | 2009-10-13 | 2012-08-03 | 미쓰비시 마테리알 가부시키가이샤 | 전극판의 통기공 형성 방법 |
US9289858B2 (en) * | 2011-12-20 | 2016-03-22 | Electro Scientific Industries, Inc. | Drilling holes with minimal taper in cured silicone |
CN105345094B (zh) * | 2015-11-13 | 2018-09-07 | 中北大学 | 基于激光探测原理的深孔加工在线纠偏装置 |
JP7325194B2 (ja) * | 2019-02-19 | 2023-08-14 | 三菱重工業株式会社 | 溶接物製造方法、溶接物製造システム及び溶接物 |
KR102448183B1 (ko) * | 2021-04-20 | 2022-09-30 | (주) 대명테크놀러지 | 반도체용 세라믹 기판 천공 장치 |
CN114193007A (zh) * | 2022-01-21 | 2022-03-18 | 武汉元禄光电技术有限公司 | 多头fpc紫外激光钻孔装置及方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3799657A (en) * | 1972-06-05 | 1974-03-26 | Photon Sources Inc | Optical drilling head for lasers |
US4328410A (en) | 1978-08-24 | 1982-05-04 | Slivinsky Sandra H | Laser skiving system |
US4461947A (en) * | 1982-08-24 | 1984-07-24 | Allied Corporation | Rotating laser beam with coincident gas jet |
EP0164564A1 (de) * | 1984-05-18 | 1985-12-18 | Siemens Aktiengesellschaft | Anordnung zur Sacklocherzeugung in einem laminierten Aufbau |
US4959119A (en) * | 1989-11-29 | 1990-09-25 | E. I. Du Pont De Nemours And Company | Method for forming through holes in a polyimide substrate |
TW207588B (zh) * | 1990-09-19 | 1993-06-11 | Hitachi Seisakusyo Kk | |
US5535019A (en) * | 1994-09-15 | 1996-07-09 | Xerox Corporation | Error diffusion halftoning with homogeneous response in high/low intensity image regions |
US5585019A (en) | 1995-03-10 | 1996-12-17 | Lumonics Inc. | Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams |
JPH09107168A (ja) * | 1995-08-07 | 1997-04-22 | Mitsubishi Electric Corp | 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器 |
US5910255A (en) | 1996-11-08 | 1999-06-08 | W. L. Gore & Associates, Inc. | Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation |
US6362454B1 (en) * | 1999-10-01 | 2002-03-26 | Matsushita Electric Industrial Co., Ltd. | Method for drilling circular holes with a laser beam |
JP2002066780A (ja) * | 2000-08-30 | 2002-03-05 | Canon Inc | レーザ加工装置 |
-
2001
- 2001-09-13 DE DE10145184A patent/DE10145184B4/de not_active Expired - Fee Related
-
2002
- 2002-02-19 US US10/076,301 patent/US6649864B2/en not_active Expired - Fee Related
- 2002-09-04 DE DE50211848T patent/DE50211848D1/de not_active Expired - Lifetime
- 2002-09-04 EP EP02774301A patent/EP1425947B1/de not_active Expired - Lifetime
- 2002-09-04 CN CNB028180399A patent/CN100342760C/zh not_active Expired - Fee Related
- 2002-09-04 WO PCT/DE2002/003266 patent/WO2003026367A1/de active IP Right Grant
- 2002-09-04 JP JP2003529827A patent/JP2005502476A/ja active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101218063B (zh) * | 2005-06-07 | 2010-05-26 | 日酸田中株式会社 | 激光穿孔方法及加工装置 |
CN102759799A (zh) * | 2011-04-29 | 2012-10-31 | 昆山思拓机器有限公司 | 激光光束整型方法和激光光束整型装置 |
CN104582317A (zh) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | 印制电路板制作方法 |
CN108436308A (zh) * | 2018-03-16 | 2018-08-24 | 中国电子科技集团公司第三十八研究所 | 一种用于微波陶瓷基板上微孔的co2激光加工方法 |
CN111390380A (zh) * | 2019-01-01 | 2020-07-10 | 达航科技股份有限公司 | 印刷电路板的激光加工方法及其激光加工机 |
CN114682932A (zh) * | 2022-04-14 | 2022-07-01 | 强一半导体(苏州)有限公司 | 一种适用于生瓷片的激光加工通孔的方法 |
CN114682932B (zh) * | 2022-04-14 | 2024-02-09 | 强一半导体(苏州)股份有限公司 | 一种适用于生瓷片的激光加工通孔的方法 |
CN114682934A (zh) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | 多脉宽复合的印制电路板激光加工装置 |
CN114682934B (zh) * | 2022-06-01 | 2022-09-20 | 杭州凌像科技有限公司 | 多脉宽复合的印制电路板激光加工装置 |
Also Published As
Publication number | Publication date |
---|---|
DE50211848D1 (de) | 2008-04-17 |
DE10145184B4 (de) | 2005-03-10 |
EP1425947B1 (de) | 2008-03-05 |
WO2003026367A1 (de) | 2003-03-27 |
DE10145184A1 (de) | 2003-04-03 |
US20030047544A1 (en) | 2003-03-13 |
EP1425947A1 (de) | 2004-06-09 |
JP2005502476A (ja) | 2005-01-27 |
US6649864B2 (en) | 2003-11-18 |
CN100342760C (zh) | 2007-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI VIA MACHINE CO., LTD. Free format text: FORMER OWNER: SIEMENS AG Effective date: 20060623 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20060623 Address after: Kanagawa Applicant after: Hitachi VIA Mechanics Ltd. Address before: Munich, Germany Applicant before: Siemens AG |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071010 Termination date: 20100904 |