CN1540750A - 表面安装型高频模块 - Google Patents
表面安装型高频模块 Download PDFInfo
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Abstract
本发明的表面安装型高频模块是具有BGA封装IC1,和安装该BGA封装IC的印刷基板、将芯材6构成的内层与构成内层的外侧的由组合层5构成的外层层叠而成的多层基板作为印刷基板的表面安装型高频模块。安装BGA封装IC1的安装部分的印刷基板(芯材6)上表面形成为低于外层(组合层5)的上表面。在芯材6与BGA封装IC1的间隙充填密封树脂3。
Description
技术领域
本发明涉及具有安装BGA(Ball Grid Array,球栅阵列)封装IC的印刷基板的表面安装型高频组件。
背景技术
至今,在装有作为无线通信用器件而使用的高频模块的移动电话、PDA及笔记本电脑等电子设备中,越来越要求必须实现小型化(要求轻而薄)。因此,近年来这些电子设备中使用的高频模块主要是以能够表面安装的模块为主流。
图2所示为以往的表面安装型高频模块的立体图。在该表面安装型高频模块中,为了抑制来自表面安装型高频模块本体的不需要的辐射电波,有的情况下还安装了屏蔽盖(未图示)。
作为将表面安装型高频模块进行表面安装的手段,是在形成表面安装型高频模块的印刷基板21的侧面,形成表面安装型高频模块的电信号输入输出端作为端面通孔22,而且构成表面安装型高频模块的片状电阻器、片状电容器、片状电感器及层叠滤波器等电子元器件23全部安装在印刷基板21的一个表面,在另一个表面不安装电子元器件23,将该不安装电子元器件23的印刷基板21的表面与电子设备本体一侧的基板相向进行安装,通过进行焊接,能够对电子设备本体进行表面安装。
但是,在无线通信中的两台及两台以上的电子设备之间,要将微型计算机能够处理的基带信号变换为高频信号进行通信。在必须具有进行该基带信号及高频信号的调制解调功能的高频模块中,必须安装具有调制解调功能的无线收发IC24。该高频模块必须薄而小型。因此,作为适于对要安装的无线收发IC24进行高密度安装的封装,则广泛采用称为BGA封装的这种形式的IC。该BGA封装IC的输入输出端是通过在IC的背面形成焊接凸点而制成的。
图3所示为在表面安装型高频模块的印刷基板31上安装BGA封装IC32的部分的剖视图。
通过将印刷基板31上形成的导体构成的焊盘34与BGA封装IC32上形成的焊接凸点35进行焊接,将BGA封装IC32安装在印刷基板31上,使该BGA封装IC32与印刷基板31电气连接。
然而,在使用BGA封装IC32时,存在下述的问题。BGA封装IC32内使用的基板33与高频模块使用的印刷基板31在热膨胀系数方面有差异,所以随着温度变化而产生的各基板的收缩程度因BGA封装IC32一侧的基板33与高频模块一侧的印刷基板31而有差异。
其结果,在BGA封装IC32的焊接凸点35与各基板的焊接接合面上被施加不需要的力作用的应力。因此,在焊接凸点35与BGA封装IC32一侧的基板33的接合面或焊接凸点35与高频模块一侧的印刷基板31的焊接接合面上,有时会产生裂纹,导致断线等不良情况,不能发挥作为高频模块的电气性能。
另外,通常的IC要用于各种各样的设备,不是以用于一种设备为前提进行设计的。模块中使用的印刷基板31也根据所需要的厚度及层结构改变所需要的材料。因此,将IC中使用的基板33与模块中使用的基板31用同一种材料是不现实的。
作为解决这样的问题的方法,例如如日本专利特开2002-33419号公报所揭示的那样,提出了将BGA封装IC32与高频模块一侧基板31的间隙通过进行树脂密封来避免因热膨胀系数之差而产生的问题的方法。
但是,像该以往技术那样,将进行树脂密封的方法用于小型的表面安装型高频模块时,仍然保留有下述的问题。
图4所示为进行这样的树脂密封时的表面安装型高频模块BGA封装IC安装部分剖视图。
一般,表面安装型高频模块使用的印刷基板,为了进行高密度布线,而采用多层结构的基板。作为多层基板,多采用由形成内层部分的芯材46、及形成外层的组合层45所构成的组合基板。
因而,在对该组合基板与BGA封装IC41的间隙进行树脂密封时,由于密封树脂43是具有流动性的物质,因此难以自由地控制其铺开的方向,将在BGA封装IC41的周边一带较大的范围内流动。
所以,若用于小型的表面安装型高频模块,则作为输入输出端电极而形成的端面通孔44与BGA封装IC41接近,密封树脂43将会流入端面通孔44,端面通孔44将被密封树脂43覆盖,就不能用作输入输出端电极。因此,对于这种具有端面通孔44类型的小型表面安装型高频模块,不能进行树脂密封,不得不依靠BGA封装IC的焊接凸点42与印刷基板的焊盘47的焊接接合面的可靠性。
另外,在特意进行树脂密封时,为了不使密封树脂43连端面通孔44也流入,必须拓宽BGA封装IC41与端面通孔44的间隔L,这将妨碍实现高频模块的特征即小型化。
发明内容
为了解决上述问题,根据本发明的表面安装型高频模块,是在具有BGA封装IC及安装该BGA封装IC的印刷基板、将内层与构成内层的外侧的外层层叠而成的多层基板作为该印刷基板的表面安装型高频模块中,安装上述BGA封装IC的安装部分的该印刷基板上表面形成为低于上述外层的上表面,同时在上述印刷基板与该印刷基板上安装的BGA封装IC的间隙用树脂密封。利用该结构,密封树脂能够被安装BGA封装IC的基板的周边部分侧壁挡住,不产生不必要的流动,这样进行树脂密封。
另外,上述安装部分的印刷基板上表面最好采用低于上述外层上表面的结构,其程度达到上述密封的树脂不向上述BGA封装IC周围的所希望的范围以外流动。通过这样,以防止密封树脂流至不必要的部分,不让密封树脂流入端面通孔。
再有,上述外层也可以在遍及上述BGA封装IC的几乎全部周围形成。利用该结构,能够将作用于BGA封装IC与印刷基板的焊接接合部的不需要的应力也向焊接接合部以外分散。
上述外层也可以由组合层构成,在这种情况下,能够与内层基板分开加工。
也可以在上述印刷基板的边缘部分周围设置端面通孔,在这种情况下,能够容易将高频模块与电子设备本体进行表面安装。
这样,根据本发明的表面安装型高频模块,能够防止密封树脂向所希望的范围以外的不需要部分铺开,在小型的表面安装型高频模块中,也能够阻止树脂流入形成电极端的端面通孔。通过具有该端面通孔、并且在BGA封装IC与印刷基板的空间进行树脂密封,能够制成BGA封装IC与印刷基板具有很好的焊接可靠性的小型表面安装型高频模块。
附图说明
图1为根据本发明的表面安装型高频模块的IC安装部分剖视图。
图2为根据以往技术的表面安装型高频模块的立体图。
图3为根据以往技术的IC安装部分剖视图。
图4为根据以往技术的表面安装型高频模块的IC安装部分剖视图。
具体实施方式
下面一边参照附图,一面说明本发明的实施形态。
图1所示为本发明的表面安装型高频模块10的剖视图。
本实施形态的表面安装型高频模块10,如图1所示,是一种具有BGA封装IC1及安装该BGA封装IC1的印刷基板、将芯材6构成的内层与构成内层的外侧的由组合层5构成的外层层叠的多层基板作为该印刷基板的表面安装型高频模块。另外,安装BGA封装IC1的安装部分的印刷基板(芯材6)上表面形成为低于外层(组合层5)上表面。
另外,在芯材6上表面设置将BGA封装IC1上形成的焊接凸点2与芯材6上形成的电路进行电气连接用的焊接用焊盘7。将这些焊接凸点2与焊接用焊盘7进行焊接,通过这样BGA封装IC1与芯材电气连接。
再有,在芯材6与BGA封装IC1的间隙充填密封树脂3。
该表面安装型高频模块10利用腐蚀加工或激光加工,去除如以往技术所示的图4中的芯材上形成作为外层的组合层5那样的触及BGA封装IC1安装部分的不需要的组合层。
这里,防止密封树脂流出用的侧壁的组合层5的高度,加工成使得BGA封装IC1的背面一侧比侧壁更低那样的高度。
然后,在如上所述利用上述加工去除用作为防止密封树脂流出用的壁的组合层5以外的不需要的组合层而形成的凹下部分上,安装BGA封装IC1,将焊接凸点2与芯材6上形成的焊盘7进行焊接,通过这样使BGA封装IC1与芯材6电气连接。
然后,在BGA封装IC1与芯材6的间隙充填所希望数量的密封树脂3,并进行固化粘结,使其不超出起防止密封树脂流出用的侧壁作用的组合层5的高度。
通过采用这样的表面安装型高频模块的结构,进行树脂密封时,密封树脂被组合层5的侧壁挡住,没有不必要的流动,能够提供提高BGA封装IC1的焊接可靠性的表面安装型高频模块。另外,由于不使密封树脂流入端面通孔4,因此能够在端面通孔4的附近安装BGA封装型IC,没有必要保持端面通孔4与IC之间的一定的距离,能够进行高密度安装,能够实现表面安装型高频模块的小型化。
再有,由于在遍及BGA封装IC1的几乎全部周围形成为外层的组合层5,因此能够在印刷基板与BGA封装IC1之间无间隙地充填密封树脂,所以还能够将作用于BGA封装IC1与印刷基板的焊接接合部的不需要的应力向焊接接合部以外分散,通过这样能够减少因裂纹而引起的焊接接合部剥离的可能性。
另外,由于所述外层是组合层5,是在内层基板上层叠形成的,因此能够与内层基板分别加工,能够在BGA封装IC1的安装部分周围容易制成侧壁。
通过在印刷基板边缘部分周围设置端面通孔4,能够容易将高频模块与电子设备本体进行表面安装,另外容易确认高频模块与电子设备本体一侧的焊接接合状态。
本发明在不超出其精神或主要特征的情况下,能够以其它的各种形态加以实施。因此,上述实施例在所有方面只不过仅是表示例子,不能进行限定性的解释。本发明的范围是由权利要求的范围所示的,对于说明书正文没有任何约束。再有,属于权利要求范围的相同范围的变形或变更,全部是本发明范围内的内容。
另外,本申请是根据在日本申请的特愿2003-118773号而提出的申请,其内容在这此谈到,通过这样编入本申请中。另外,本说明书中引用的文献通过在此谈到,通过这样其全部内容具体编入。
Claims (9)
1.一种表面安装型高频模块,具有BGA封装IC及安装该BGA封装IC的印刷基板、该印刷基板是将内层及构成内层的外侧的外层层叠而成的多层基板,其特征在于,
安装所述BGA封装IC的安装部分的该印刷基板上表面形成为低于所述外层上表面,同时在所述印刷基板与该印刷基板上安装的BGA封装IC的间隙用树脂密封。
2.如权利要求1所述的表面安装型高频模块,其特征在于,
所述安装部分的印刷基板上表面采用低于所述外层上表面的结构,其程度达到所述密封的树脂不向所述BGA封装IC周围的所希望范围以外流动。
3.如权利要求1或2所述的表面安装型高频模块,其特征在于,
所述外层在遍及所述BGA封装IC的几乎全部周围形成。
4.如权利要求1或2所述的表面安装型高频模块,其特征在于,
所述外层由组合层构成。
5.如权利要求3所述的表面安装型高频模块,其特征在于,
所述外层由组合层构成。
6.如权利要求1或2所述的表面安装型高频模块,其特征在于,
在所述印刷基板的边缘部分周围设置端面通孔。
7.如权利要求3所述的表面安装型高频模块,其特征在于,
在所述印刷基板的边缘部分周围设置端面通孔。
8.如权利要求4所述的表面安装型高频模块,其特征在于,
在所述印刷基板的边缘部分周围设置端面通孔。
9.如权利要求5所述的表面安装型高频模块,其特征在于,
在所述印刷基板的边缘部分周围设置端面通孔。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003118773A JP3983711B2 (ja) | 2003-04-23 | 2003-04-23 | 表面実装型高周波モジュール |
JP2003118773 | 2003-04-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1540750A true CN1540750A (zh) | 2004-10-27 |
Family
ID=33296379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004100322105A Pending CN1540750A (zh) | 2003-04-23 | 2004-03-24 | 表面安装型高频模块 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20040211583A1 (zh) |
JP (1) | JP3983711B2 (zh) |
CN (1) | CN1540750A (zh) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6396136B2 (en) * | 1998-12-31 | 2002-05-28 | Texas Instruments Incorporated | Ball grid package with multiple power/ground planes |
US7087988B2 (en) * | 2002-07-30 | 2006-08-08 | Kabushiki Kaisha Toshiba | Semiconductor packaging apparatus |
-
2003
- 2003-04-23 JP JP2003118773A patent/JP3983711B2/ja not_active Expired - Lifetime
-
2004
- 2004-03-24 CN CNA2004100322105A patent/CN1540750A/zh active Pending
- 2004-04-08 US US10/819,937 patent/US20040211583A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2004327621A (ja) | 2004-11-18 |
JP3983711B2 (ja) | 2007-09-26 |
US20040211583A1 (en) | 2004-10-28 |
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