CN1529772A - 用于电子器件制造的金属电化学共沉积 - Google Patents

用于电子器件制造的金属电化学共沉积 Download PDF

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Publication number
CN1529772A
CN1529772A CNA018209033A CN01820903A CN1529772A CN 1529772 A CN1529772 A CN 1529772A CN A018209033 A CNA018209033 A CN A018209033A CN 01820903 A CN01820903 A CN 01820903A CN 1529772 A CN1529772 A CN 1529772A
Authority
CN
China
Prior art keywords
metal
metal layer
copper
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA018209033A
Other languages
English (en)
Chinese (zh)
Inventor
Er
E·R·奥陵
�Ү��
M·W·巴耶斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of CN1529772A publication Critical patent/CN1529772A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
CNA018209033A 2000-11-03 2001-11-03 用于电子器件制造的金属电化学共沉积 Pending CN1529772A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24593700P 2000-11-03 2000-11-03
US60/245,937 2000-11-03

Publications (1)

Publication Number Publication Date
CN1529772A true CN1529772A (zh) 2004-09-15

Family

ID=22928699

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA018209033A Pending CN1529772A (zh) 2000-11-03 2001-11-03 用于电子器件制造的金属电化学共沉积

Country Status (7)

Country Link
US (1) US20020127847A1 (https=)
EP (1) EP1346083A2 (https=)
JP (1) JP2004518022A (https=)
KR (1) KR20030048110A (https=)
CN (1) CN1529772A (https=)
AU (1) AU2002245083A1 (https=)
WO (1) WO2002055762A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112899735A (zh) * 2014-03-19 2021-06-04 应用材料公司 电化学电镀方法

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* Cited by examiner, † Cited by third party
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US20030159941A1 (en) * 2002-02-11 2003-08-28 Applied Materials, Inc. Additives for electroplating solution
US6974767B1 (en) * 2002-02-21 2005-12-13 Advanced Micro Devices, Inc. Chemical solution for electroplating a copper-zinc alloy thin film
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
JP4758614B2 (ja) * 2003-04-07 2011-08-31 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気めっき組成物および方法
US20050045485A1 (en) * 2003-09-03 2005-03-03 Taiwan Semiconductor Manufacturing Co. Ltd. Method to improve copper electrochemical deposition
DE10355953B4 (de) * 2003-11-29 2005-10-20 Infineon Technologies Ag Verfahren zum Galvanisieren und Kontaktvorsprungsanordnung
TWI400365B (zh) 2004-11-12 2013-07-01 安頌股份有限公司 微電子裝置上的銅電沈積
US7771579B2 (en) * 2004-12-03 2010-08-10 Taiwan Semiconductor Manufacturing Co. Electro chemical plating additives for improving stress and leveling effect
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
DE102005014748B4 (de) 2005-03-31 2007-02-08 Advanced Micro Devices, Inc., Sunnyvale Technik zum elektrochemischen Abscheiden einer Legierung mit chemischer Ordnung
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
JP2010045140A (ja) * 2008-08-11 2010-02-25 Nec Electronics Corp リードフレーム、リードフレームの製造方法及び半導体装置の製造方法
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
WO2015065150A1 (ko) * 2013-11-04 2015-05-07 서울시립대학교 산학협력단 합금 도금액과 펄스전류를 이용한 다층 도금 박막 제조방법
US9758896B2 (en) 2015-02-12 2017-09-12 Applied Materials, Inc. Forming cobalt interconnections on a substrate
KR102554104B1 (ko) * 2015-04-22 2023-07-12 덕산하이메탈(주) 비정질 특성을 갖는 접합소재 및 이의 제조방법
US10988851B2 (en) 2015-09-02 2021-04-27 Dankook University Cheonan Campus Industry Academic Cooperation Foundation Method for manufacturing composition controlled thin alloy foil by using electro-forming
US9809892B1 (en) * 2016-07-18 2017-11-07 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
WO2018073011A1 (en) 2016-10-20 2018-04-26 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US11926918B2 (en) 2016-12-20 2024-03-12 Basf Se Composition for metal plating comprising suppressing agent for void free filing
RU2684423C1 (ru) * 2018-05-21 2019-04-09 Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) Способ изготовления хеморезистора на основе наноструктур оксида цинка электрохимическим методом
JP7087759B2 (ja) * 2018-07-18 2022-06-21 住友金属鉱山株式会社 銅張積層板
US11901225B2 (en) * 2021-09-14 2024-02-13 Applied Materials, Inc. Diffusion layers in metal interconnects

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713637B2 (https=) * 1973-09-04 1982-03-18
US4108739A (en) * 1973-09-04 1978-08-22 Fuji Photo Film Co., Ltd. Plating method for memory elements
BR8805772A (pt) * 1988-11-01 1990-06-12 Metal Leve Sa Processo de formacao de camada de deslizamento de mancal
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
JP4394234B2 (ja) * 2000-01-20 2010-01-06 日鉱金属株式会社 銅電気めっき液及び銅電気めっき方法
US6679983B2 (en) * 2000-10-13 2004-01-20 Shipley Company, L.L.C. Method of electrodepositing copper

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112899735A (zh) * 2014-03-19 2021-06-04 应用材料公司 电化学电镀方法
CN112899735B (zh) * 2014-03-19 2022-05-31 应用材料公司 电化学电镀方法

Also Published As

Publication number Publication date
WO2002055762A3 (en) 2003-07-17
US20020127847A1 (en) 2002-09-12
WO2002055762A2 (en) 2002-07-18
AU2002245083A1 (en) 2002-07-24
KR20030048110A (ko) 2003-06-18
JP2004518022A (ja) 2004-06-17
EP1346083A2 (en) 2003-09-24

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication