CN1497661A - 防止电子器件氧化的装置及方法 - Google Patents

防止电子器件氧化的装置及方法 Download PDF

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CN1497661A
CN1497661A CNA2003101000250A CN200310100025A CN1497661A CN 1497661 A CN1497661 A CN 1497661A CN A2003101000250 A CNA2003101000250 A CN A2003101000250A CN 200310100025 A CN200310100025 A CN 200310100025A CN 1497661 A CN1497661 A CN 1497661A
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黄任武
关家胜
段荣
芮照伢
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ASMPT Singapore Pte Ltd
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Abstract

本发明提供一种防止电子器件在加热时氧化的装置和方法，如半导体引线框。该装置包括所述器件被加热的区域，和提供相对的惰性气体到所述区域的进气部件。特别地，该装置包含一个多孔的分配部件，惰性气体从进气部件经过分配部件到达所述区域，用以防止电子器件在该区域氧化。

Description

防止电子器件氧化的装置及方法
技术领域
本发明涉及减轻制造电子器件的一些活性金属的氧化，如在半导体封装生产过程中的引线框架。本发明尤其可用于铜合金引线框的超声波导线连接，也可以广泛应用于其它领域。
背景技术
半导体引线框架用做制造半导体封装的基底，一般地说，引线框是由铁合金制造的。然而，随着对高性能小型化封装的不断需求，更多的活性金属特别是铜合金引线框越来越广泛应用于半导体封装。铜合金引线框比铁合金引线框具有更大诱惑力的原因是由于其具有良好的散热性、良好的加工性和低成本。另一方面，铜合金的缺点是当在高温暴露于氧中时易于氧化(即，铜与氧反应生成氧化铜)。这种氧化导致氧与引线框表面上的原子形成弱的键连接，和脆性层和/或吸附氧化物。这样，氧化导致了微电子封装的可靠性问题。
在典型的半导体封装过程中，当导线键合半导体芯片和引线框的表面形成导电连接时，氧化问题更加敏锐。通常利用超声波转换器产生具有外部压力的机械振动来键合半导体芯片和引线框的表面。然而，在此过程中产生的热会氧化引线框的表面，形成假粘或不可靠键合。导线键合过程中的氧化应当被避免或减轻。
典型的导线键合机采用窗口夹具，其通常设计成矩形，便于牢固地夹住引线框到顶板上。防止引线框氧化的工业上的方法是导入大量的惰性气体，一般为氮气，到引线框架，多种设备应用于此。在一典型的设备中，引线框架的一部分面积被夹具的本体覆盖而得到相对较好的防氧化保护，在窗口夹具本体的作为键合区的部分留下开口。键合区暴露在环境中，易发生氧化。
一种导入氮气的方法是固定一个或多个喷嘴至键合区，喷吹氮气到键合区(附图1)。键合区周围环境中的氮气可以避免在高的键合温度下引线框发生氧化反应。但是喷嘴的使用，在喷嘴开口周围产生负压，而向喷嘴开口吸收空气。过几分钟，由于从大气中吸入的氧与氮气混合，削弱了喷嘴的作用。
另一导入氮气的方法是在顶板上有一个或多个气体出口，顶板上放置引线框架以便气体喷射到键合区(附图2)。这种方法的缺点是制造一个个的带有许多作为氮气出口的小孔的顶板是困难的，思想上要有的概念是顶板的表面必须绝对平坦，以便在其上能够有效地完成导线键合。
这种设计也有围绕顶板开口的负压的问题。过一段时间，引起空气中的氧被吸入到喷嘴的开口，与氮气结合，而减轻保护的有效性。另外，应当引起注意的是这种方法仅在引线框自身的表面具有让气体进入导线夹具内的键合区的通孔时，才发挥作用。如果没有这样的通孔，此种方法无效。
第三种方法是利用一个盖子，与第一种方法和/或第二种方法结合，以尽可能地防止氮气从键合区跑掉。可移动的盖子带有让作为键合部件的毛细管通过并伸到键合区的通孔。但是，导线键合机附件(特别是导线键合机的键合头)的增加，影响键合机的键合效率。盖子也影响引线框键合时操作者的视线，例如当导线断开时，无法接近键合区。当键合区大时，盖子的尺寸也太大。另外当导线夹具移开，来取出引线框时，会发生导线夹具碰撞移动的盖子的险情。
发明内容
如前面所述的问题，利用传统的方法导入氮气来防止键合操作过程中引线框的氧化，本发明的目的是提供一种改进的装置和方法导入一种相对的惰性气体到键合区来防止引线框的氧化。
根据本发明的第一方面提供一种装置，防止电子器件加热时的氧化，包括：
(1)被加热的一个器件区；
(2)提供相对惰性气体到所述区域的进气部件；
(3)一个多孔的分配部件，通过它惰性气体从进气部件到达所述区域，以防止电子器件在该区域氧化。
根据本发明的第二方面，提供电子器件被加热时的防止氧化方法，包括从进气部件导入相对的惰性气体到达电子器件以防止氧化，所述气体首先经过多孔的分配部件，而后到达电子器件。
参阅描述本发明的实施例的附图，来描述本发明是很方便的。附图和相关的描述不能理解成是对本发明的限制，本发明的特点限定在权利要求书中。
附图说明
本发明相应装置和方法的一个实施例现结合下述的附图说明如下，其中：
附图1是现有技术的第一个例子，为氮气通过一个窗口夹具中的喷嘴被导入到引线框的键合区的截面图；
附图2是现有技术的第二个例子，为氮气通过携带引线框的顶板上的气体出口被导入到键合区的截面图；
附图3是现有技术的第三个例子，为移动的盖子位于窗口夹具的上方以防止键合区的氮气跑掉的截面图；
附图4是根据本发明的第一实施例，为位于窗口夹具上的多孔材料层导入氮气到键合区的截面图；
附图5是根据本发明的第二实施例的用于导入氮气到键合区的、位于顶板上的多孔材料层的截面图。
具体实施方式
参见附图所示，相同的部件采用相同标记。图1是相关现有技术中使用相对的惰性气体的第一个例子，根据该现有技术第一个例子，氮气(N2)通过在窗口夹具106中的一个喷嘴108，被导入到引线框104的键合区100。附着在引线框104上的芯片102完全位于窗口夹具106的开口的中心部位，完成导线键合，实现芯片102与引线框104的电连接。
当导线键合工序进行时，氮气通过喷嘴108被泵压到键合区100，让氮气在键合区域充满环境，从而在焊接过程中保护引线框不被氧化。然而，由于喷嘴的缘故，将在喷嘴108的开口附近产生低压，这样来自大气的氧气被吸入并与氮气相混合。结果，通过将氮气压缩到键合区域以防止氧化的效果被减弱。
附图2是现有技术的第二个例子，为氮气通过携带引线框104的顶板110上的气体出口112被导入到键合区的截面图。此时，氮气从引线框104的下面导入，这仅在引线框104上具有允许氮气通过并导入到键合区100的开口时才是适用的。
除此之外，向键合区100中吹氮气，氮气也可通过第二开口116被吹到引线框104的区域114，该引线框104位于窗口夹具106和在键合区之外100的顶板110之间，由于区域114很少暴露在大气中，所以氧化不是很严重。这样其它方法可以分别用于导入氮气到区域114。
尽管这样，喷嘴效应依然发生，在此设计中，氧被吸入到喷嘴的出口到达键合区100，因而减弱了装置的有效性。
附图3是一个位于窗口夹具106上的移动的盖子120的，用于避免键合区的氮气跑掉的，根据现有技术的第三个例子的截面图。可移动的盖子具有通孔122，该通孔让携带导线的毛细管124经过。当进行导线键合时，一个熄火部件126产生电火花形成一个焊料球。可移动盖子120与导线键合机的焊头连接，以便与焊头一起移动。一个光学部件128用于形状识别(PR)。氮气通过喷嘴入口112到顶板110上的出口以及气体的第二入口116被导入键合区100。
附图4是本发明实施装置的截面图，包括一个以多孔材料层18形式存在的分配部件，该部件由电子器件的支撑部件携带，电子器件可以是铜合金引线框14。在本实施例中，支撑部件可以是窗口夹具16。相对的惰性气体如氮气通过多孔材料层18被导入到引线框14的键合区10。固定在引线框14的芯片12在窗口夹具的中心区域暴露。氮气通过通道20进气部件到达窗口夹具16，而窗口夹具16变形使得多孔材料层18耦合到位于通道20和键合区10之间的窗口夹具16上，因而气体在被导入到键合区10之前通过多孔材料层18。
在通道20和键合区10之间安放多孔材料层18的优点是，当氮气被导入到键合区时可以实现大面积的气体分布均匀。这样在氮气被导入时，可以有效地减轻周围区域的负压，就象没有造成负压的喷嘴一样。由于氧与氮气的混合现象被明显地消除，因而可以有效地防止引线框在键合过程中的氧化。
适合的多孔材料是高度压缩的多孔金属粉末，例如不锈钢粉末。例如Mott公司制造的多孔金属媒介物。
图5是本发明第二实施例的截面图，包括一由多孔材料30形成的分配元件，该分配元件由一顶部金属板21的表面支撑，并与之连接，引线框14形成在该金属板21的表面上，该分配元件将氮气导入键合区，引线框14由窗口夹具16固定在顶部金属板21上。氮气通过顶部金属板21上的入气口24被吹入键合区10。顶部金属板21产生变形，使得多孔材料层30与入气口24的尾部在顶部金属板21的表面靠近键合区10部分进行连接。
在上面的例子中，多孔材料30分配氮气更加均匀，而在大的区域减小可能影响设备有效性的负压。另外，多孔材料被设计成使得氮气被分配至引线框14的在窗口夹具16和顶板21之间的部分。这将进一步防止引线框的键合区被氧化。而且更多的氮气通过第二进气口26被导入所述部分。可以理解的是，在附图5所描述的实施例在引线框14具有开口，使得氮气由入口下方被导入键合区时是合适的，而没有这些使得氮气被这样传输的开口是不合适的。
可以理解的是，附图4和5中所各自描述的实例的应用都依赖于引线框的利用和类型。并且，这两种实例可以在一起使用，氮气或通过进气部件或通过窗口夹具16以及顶板21的表面同时被导入，来增加键合区的氮浓度。这样，本发明的设备在不增加键合区负压的情况下更有效的供应氮气，并比现有技术更长时间地防止氧化。
本发明在所具体描述的内容基础上很容易产生变化、修正和补充，可以理解的是所有这些变化、修正和补充都包括在本发明的上述描述的精神和范围内。

Claims (13)

1、一种防止电子器件在解热时氧化的装置，包括：
(1)被加热的一个器件区；
(2)提供相对惰性气体到所述区域的进气部件；
(3)一个多孔的分配部件，通过它惰性气体从进气部件到达所述区域，以防止电子器件在该区域氧化。
2、如权利要求1所述的防止电子器件在解热时氧化的装置，其中分配部件包含位于进气通道一端的、且与所述区域相邻的并组成所述进气部件的一层多孔材料。
3、如权利要求1或2所述的防止电子器件在解热时氧化的装置，其中具有支撑部件来支撑电子器件，同时多孔材料层由支撑部件携带。
4、如权利要求2或3所述的防止电子器件在解热时氧化的装置，其中多孔材料层至少构成电子器件放置的表面一部分。
5、如权利要求2至4所述的任一种防止电子器件在解热时氧化的装置，其中，多孔材料由压缩的金属粉末形成。
6、如权利要求5所述的防止电子器件在解热时氧化的装置，其中，金属粉末是不锈钢粉末。
7、如权利要求1所述的防止电子器件在解热时氧化的装置，其中，所述区域是导线键合区，相对的惰性气体被吹到电子器件的导线键合区。
8、如权利要求7所述的防止电子器件在解热时氧化的装置，其中，所述气体是氮气。
9、如权利要求1所述的防止电子器件在解热时氧化的装置，其中，其中电子器件是铜合金引线框。
10、一种防止电子器件在加热时氧化的方法，包括：通过进气部件导入一种相对的惰性气体到电子器件，以防止其氧化，其中气体首先经过一个多孔的分配部件而后到达电子器件。
11、如权利要求10所述的防止电子器件在加热时氧化的方法，其中所述分配部件包含一层多孔材料层，进气部件包含通道，所述部件位于通道的一端，相对的惰性气体从通道流出。
12、如权利要求11所述的防止电子器件在加热时氧化的方法，具有支撑电子器件的支撑部件，同时支撑部件携带多孔材料层。
13、如权利要求10至12所述的任一种防止电子器件在加热时氧化的方法，其中具有电子器件放置的表面，多孔材料层至少构成所述表面的一部分。
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