CN1452787A - 将散热片夹紧在电路板的处理器上 - Google Patents

将散热片夹紧在电路板的处理器上 Download PDF

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CN1452787A
CN1452787A CN00819531.5A CN00819531A CN1452787A CN 1452787 A CN1452787 A CN 1452787A CN 00819531 A CN00819531 A CN 00819531A CN 1452787 A CN1452787 A CN 1452787A
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clamp
circuit board
fin
clasp
base portion
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CN1288751C (zh
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G·L·布克哈德特
S·S·麦克奥恩
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract

本发明涉及采用与弹性夹板(20)接合且预先设于电路板(14)上的卡子(10)，将一块散热片(18)弹性箍紧在插入插座的处理器(11)上。卡子(10)可以为C形且可包括一个上弹性臂部分(34)，一个垂向部分(32)和一个基部(30)，基部可表面安装在电路板(14)上。C形卡子(10)的该上弹性臂(34)可松开地接合弹性夹板(20)以将散热片(18)牢固地夹紧在插入插座的处理器(11)上。

Description

将散热片夹紧在电路板的处理器上
背景技术
本发明主要涉及将散热片固定到处理器上的技术。
处理器一般安装在母板上的插座内，母板例如为印刷电路板，它包括多个固定于其上的集成电路。集成电路可通过印刷在电路板上的导线电连接。热耗散影响处理器的工作，因此期望得到用于处理器的高效并且较小型的散热片。
通常在用于处理器的插座上设有卡子。连接到这些卡子的夹板用于把散热片夹紧在容纳于插座内的处理器上。该技术提供了散热片与处理器间牢固的弹性连接并且在处理器散热方面是有效的。
但是许多可用的插座不包括用于将散热片弹性箍紧在插座上的卡子。尽管期望使用弹性卡子箍紧技术，却没有办法连接所述夹板以便将散热片固定于处理器上。
因此需要有一种不使用设于插座上的夹板连接卡子而将散热片弹性箍紧在插座中的处理器上的方法。
发明内容
根据本发明的一个方面，一种方法包括将至少两个卡子固定于电路板上。用卡子将散热片加紧在电路板上的处理器上。
其它方面将在后面的具体实施方式与权利要求书中阐述。
附图简要说明
图1为根据本发明的一个实施例，固定在一块电路板上的插入插座内的处理器的透视图；
图2为根据本发明的一个实施例，设于图1所示的插入插座内的处理器顶上的散热片的透视图；
图3为根据本发明的一个实施例，一个被加紧在插入插座内的处理器上的散热片的透视图；
图4为基本上沿图3中4-4线所取的部分放大的剖视图；
图4a，4b表示根据本发明的一个实施例，将弹性加载夹板连接到卡子上的顺序的部分放大剖视图；
图5为根据本发明的一个实施例，包括多个卡子的带条的俯视平面图；
图6为基本上沿图5中6-6线所取的剖视图，卡子正被拾取与放置设备拾取；
图7表示将卡子放置于电路板上的本发明的一个实施例的剖视图。
具体实施方式
参见图1，处理器11安装在一个插座12中，插座12固定在一块电路板14(例如印刷电路板)上。插座12可提供处理器11与电路板14之间的电连接。多个C形的卡子10固定在电路板14上，与插座12邻近并与之相对。一个螺钉连接件16可用于将插座12固定在电路板14上。在本发明的一个实施例中，该电路板14是一块母板。
如图2所示，一块散热片18可设于插座12的顶上位于所述插入插座的处理器11的上方。可以采用各种散热片中的任何一种。图2所示的散热片是所谓低型散热片。但是其它的散热片也可被应用，包括那些具有直立的散热翼片的散热片。
如图3所示，使用一个弹性加载的夹板20可将散热片18夹在插入插座的处理器11上。夹板20可包括一个弓形的中间板簧部分28和一对弹性臂24和26，这两个弹性臂与弹性臂22相对。弹性臂22接合卡子10c，弹性臂26接合卡子10b，弹性臂24接合卡子10a。尽管一个实施例中使用了如图所示的三个弹性臂22，24，26，在不同实施例中也可以采用更多或更少的弹性臂。
弹性加载夹板20提供弹力，该弹力牢固地压住散热片18使其与插入插座的处理器11物理接触。在这方面，夹板20优选由高弹性材料制成，例如弹性钢。同样的，C形的卡子10可提供卡子对电路板14与夹板20的其余部分稳固点之间的弹性作用。就是说，卡子10可用作板簧，其作用与板簧部分28引起的弹性作用有关。因此，该卡子也可由高弹性材料制成。
如图4所示，每个卡子10包括一个上悬臂式板簧臂34，一个垂向臂32和一个基部30。此外，该弹性臂34包括一个扣子36，该扣子36相对于臂34朝下弯曲。在本发明的一个实施例中，臂34与基部30基本是平的并且基本上彼此平行。
同样，臂22，24和26可包括一个导引端38，该导引端邻近于开口40，该开口40接合扣子36，该扣子36通过导引端38可松开地卡接到夹板20上。
再参考图3，夹板臂24和26可钩在卡子10a和10b上，使得卡子10a、10b的扣子36接合弹性臂24和26的开口40。板簧部分28可在散热片18顶上被旋转。之后，弹性臂22向下偏斜直到它的导引端38接合扣子36的上部，如图4a所示。
因为扣子36的向下偏斜的结构，该接合导致弹性臂34向下偏斜且弹性臂22向内偏斜，如图4a的箭头所示。其结果是，臂34和22彼此滑过，如图4b所示。然后，扣子36沿导引端38向上弹起。其结果是扣子36弹过开口40和导引端38，向外的弹力使扣子36落入开口40中，如图4所示。扣子36可松开地被约束在导梢38的侧面41。以这种方式，一个弹性的夹紧力可通过相对的卡子10施加在夹板20上以便将散热片牢固地压在处理器11上。
卡子10c与夹板20之间的固定可这样解除：再次压下弹性臂22，通过边缘44与扣子36的上表面的接合使扣子36借助凸轮运动滑出开口40。当弹性臂22被放松时，它迅速向上运动，扣子36不再与开口40接合。
现在转向图5，带条50可由相对廉价的材料制成，卷在一个卷轴(未画出)上，带条50包括成排列形式固定在其上的多个卡子10。这些卡子通过使用一种可脱开的粘结剂可脱开地固定在带条50上。
带条50可在一台拾取与放置设备(未画出)中展开，该拾取与放置设备顺序地接合卡子10并将它们放置于电路板14上的正确位置。因此，如图6所示，一台拾取与放置设备的真空抓取器A可抓取上弹性臂34，将卡子抬离带条50并将其放置于电路板14上的合适位置。因为该弹性臂34的水平且基本上为平的结构，该真空抓取器A有一个良好的抓取面并可抬起卡子10。
然后，拾取与放置设备的真空抓取器A可将卡子10准确定位在电路板上的预先编程到拾取与放置设备中的位置。然后将每个卡子10的基部30放置在限定于电路板14上的焊接垫54的顶上，如图7所示。该焊接垫可用传统的焊接遮蔽技术确定。
然后，该电路板14可在一台表面安装炉中进行处理。采用表面安装技术可将全部表面安装的元件热固定在电路板14上。这意味着卡子10被焊接在电路板14上。也可以是，采用热活化粘合剂替代焊接材料。
以这种方式，箍紧卡子10可以自动、低成本的方式定位在电路板上。如果插座未提供卡子，那么这些卡子可将散热片快速捆紧在插入插口的处理器上。
尽管本发明针对有限几个实施例进行了描述，但是本领域的普通技术人员可以理解据此可有很多修改和变型。所附的权利要求书要覆盖的是本发明真实思想和范围内的全部修改和变型。

Claims (20)

1.一种方法包括以下步骤：
在一块电路板上固定至少两个卡子；
利用所述卡子将一块散热片夹紧在所述电路板的处理器上。
2.如权利要求1所述的方法，其特征在于，在一块电路板上固定至少两个卡子包括采用表面安装技术将所述卡子固定在所述电路板上。
3.如权利要求2所述的方法，其特征在于，在一块电路板上固定至少两个卡子包括采用拾取与放置设备将所述卡子定位在所述电路板上。
4.如权利要求3所述的方法，其特征在于，在一块电路板上固定至少两个卡子包括将多个卡子固定在一个带条上。
5.如权利要求4所述的方法，其特征在于，在一块电路板上固定至少两个卡子包括通过使用拾取与放置设备将所述卡子从所述带条去掉并将所述卡子定位在所述电路板上。
6.一种电子器件，包括
一个电路板；
一个固定在所述电路板上的处理器插座；
一个安装在所述插座上的处理器；
一个设于所述插座和所述处理器上的散热片；
至少两个安装在所述电路板上位于所述散热片相对两侧的卡子；以及
一个从所述散热片一侧的卡子延伸到所述散热片另一侧卡子的弹性夹板，以便将所述散热片弹性地夹紧在所述处理器上。
7.如权利要求6所述的器件，其特征在于，所述卡子为C形。
8.如权利要求6所述的器件，其特征在于，利用表面安装技术将所述卡子固定在所述电路板上。
9.如权利要求8所述的器件，其特征在于，每个为C形的卡子包括一个基部和一个悬臂式板簧臂，该基部通过表面安装技术固定在所述电路板上，该悬臂式板簧臂接合所述弹性夹板，所述臂连接所述基部。
10.如权利要求9所述的器件，其特征在于，所述弹性夹板包括一个开口并且所述悬臂式板簧臂包括一个向下的扣子，所述扣子与所述开口可脱开地接合。
11.一种用于将散热片夹紧在电路板上的已插入插座中的处理器的系统，包括：
一个带有至少两个相对的弹性臂的弹性夹板，每个弹性臂包括一个开口；和
一对C形的卡子，每个卡子包括一个悬臂式弹性臂，所述弹性臂包括一个扣子，所述扣子可脱开地接合在所述开口中，所述卡子包括一个可固定在所述电路板上的基部。
12.如权利要求11所述的系统，其特征在于，每个卡子包括一个连接基部和所述悬臂式弹性臂的垂直部分。
13.如权利要求12所述的系统，其特征在于，所述扣子是所述悬臂式弹性臂弹的端部的向下弯曲的部分。
14.如权利要求13所述的系统，其特征在于，所述基部和所述悬臂式弹性臂基本上是平的并且基本上彼此平行。
15.将散热片捆束在电路板上的处理器上的卡子包括：
一个基本上是平的基部；
一个连接所述基部的竖直部分；
一个连接到所述竖直部分的悬臂式板簧；以及
一个位于所述板簧上的扣子，该扣子与一个散热片夹板可脱开地接合。
16.如权利要求15所述的卡子，其特征在于，所述扣子是所述悬臂式板簧向下弯曲的端部。
17.如权利要求16所述的卡子，其特征在于，所述板簧和所述基部基本上是平的并且基本上彼此平行。
18.如权利要求16所述的卡子，其特征在于，所述板簧有一对相对的边，一边连接所述竖直部分而另一边构成所述扣子。
19.如权利要求18所述的卡子，其特征在于，所述基部有一对相对的边，所述边中的一个连至所述板簧。
20.如权利要求15所述的卡子，其特征在于，卡子基本上为C形。
CN00819531.5A 1999-11-29 2000-10-16 将散热片夹紧在电路板的处理器上 Expired - Fee Related CN1288751C (zh)

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US09/450,080 US6222734B1 (en) 1999-11-29 1999-11-29 Clamping heat sinks to circuit boards over processors
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US6222734B1 (en) 2001-04-24
CN1288751C (zh) 2006-12-06
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WO2001039268A1 (en) 2001-05-31
GB0208934D0 (en) 2002-05-29
AU1089601A (en) 2001-06-04
US20010002160A1 (en) 2001-05-31
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US6362965B2 (en) 2002-03-26

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