US20010002160A1 - Clamping heat sinks to circuit boards over processors - Google Patents
Clamping heat sinks to circuit boards over processors Download PDFInfo
- Publication number
- US20010002160A1 US20010002160A1 US09/736,987 US73698700A US2001002160A1 US 20010002160 A1 US20010002160 A1 US 20010002160A1 US 73698700 A US73698700 A US 73698700A US 2001002160 A1 US2001002160 A1 US 2001002160A1
- Authority
- US
- United States
- Prior art keywords
- clips
- circuit board
- spring
- clip
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T24/00—Buckles, buttons, clasps, etc.
- Y10T24/44—Clasp, clip, support-clamp, or required component thereof
- Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
- Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Definitions
- This invention relates generally to techniques for securing heat sinks to processors.
- a processor is mounted in a socket on a motherboard such as a printed circuit board including a plurality of integrated circuits secured thereto.
- the integrated circuits may be electrically coupled by conductive lines printed on the circuit board. Heat dissipation affects the operation of the processor and thus it is desirable to have a highly effective and relatively compact heat sink for the processor.
- a method includes securing at least two clips to a circuit board. A heat sink is clamped over a processor on the circuit board using the clips.
- FIG. 1 a perspective view of a socketed processor secured to a circuit board, in accordance with one embodiment of the present invention
- FIG. 2 is a perspective view of a heat sink positioned atop the socketed processor shown in FIG. 1, in accordance with one embodiment of the present invention
- FIG. 3 is a perspective view of a heat sink clamped over a socketed processor, in accordance with one embodiment of the present invention
- FIG. 4 is a partial, enlarged cross-sectional view taken generally along the line 4 - 4 in FIG. 3;
- FIGS. 4 a, 4 b are partial, enlarged cross-sectional view showing the sequence of attaching a spring loaded strap to a clip in accordance with one embodiment of the present invention
- FIG. 5 is a top plan view of a tape containing a plurality of clips in accordance with one embodiment of the present invention
- FIG. 6 is a cross-sectional view taken generally along the line 6 - 6 in FIG. 5 as the clip is being picked up by a pick and place machine;
- FIG. 7 is a cross-sectional view of one embodiment of the present invention showing the placement of a clip on a circuit board.
- a processor 11 is mounted in a socket 12 which is secured to a circuit board 14 such as a printed circuit board.
- the socket 12 may provide electrical connections between the processor 11 and the circuit board 14 .
- a plurality of C-shaped clips 10 are secured to the circuit board 14 in an opposed relationship adjacent the socket 12 .
- a screw attachment 16 may be utilized to fix the socket 12 on the circuit board 14 .
- the circuit board 14 is a motherboard.
- a heat sink 18 may be positioned atop the socket 12 over the socketed processor 11 . Any of variety of heat sinks may be utilized.
- the heat sink shown in FIG. 2 is a so-called low profile heat sink. However other heat sinks may be utilized including those which include upstanding heat dissipating fins.
- the heat sink 18 may be clamped over the socketed processor 11 using a spring loaded clamp 20 , as shown in FIG. 3.
- the clamp 20 may include a bowed, central leaf spring portion 28 and a pair of spring arms 24 and 26 which are opposed to a spring arm 22 .
- the spring arm 22 engages the clip 10 c
- the spring arm 26 engages the clip 10 b
- the spring arm 24 engages the clip 10 a. While an embodiment using three spring arms 22 , 24 , and 26 is illustrated, more or fewer spring arms may be utilized in various embodiments.
- the spring loaded strap 20 provides a spring force which securely presses the heat sink 18 into physical contact with the socketed processor 11 .
- the strap 20 is advantageously made of a highly resilient material such as spring steel.
- the C-shaped clips 10 may provide a spring action between the point of securement of the clips to the circuit board 14 and the rest of the strap 20 . That is, the clips 10 may act as leaf springs which act in concert with the spring action arising from the portion 28 .
- the clips may also be made of a highly resilient material.
- each clip 10 includes an upper cantilevered leaf spring arm 34 , a vertical arm 32 , and a base 30 .
- the spring arm 34 includes a catch 36 which may be turned downwardly relative to the arm 34 .
- the arm 34 and base 30 may be substantially planar and substantially parallel to one another, in one embodiment of the invention.
- the arms 22 , 24 , and 26 may include a guide end 38 which is adjacent to an opening 40 .
- the opening 40 is engaged by the catch 36 which is releasably locked to the strap 20 by the guide end 38 .
- the strap arms 24 and 26 may be hooked onto the clips 10 a and lob so that the catches 36 of the clips 10 a, 10 b engage the openings 40 in the spring arms 24 and 26 .
- the portion 28 is then rotated atop the heat sink 18 .
- the spring arm 22 is deflected downwardly until its guide end 38 engages the top of the catch 36 as shown in FIG. 4 a.
- the securement between the clip 10 c and the strap 20 may be released by again depressing the spring arm 22 , camming the catch 36 out of the opening 40 through the engagement of edge 44 with the top surface of the catch 36 .
- the spring arm 22 When the spring arm 22 is released, it moves upwardly quickly, and the catch 36 does not reengage the opening 40 .
- a tape 50 which may be made of a relatively low cost material wound onto a reel (not shown), includes a plurality of clips 10 secured in rows and columns thereto.
- the clips 10 may be releasably secured to the tape 50 using a releasable adhesive.
- the tape 50 may be unwound into a pick and place machine (not shown) which sequentially engages the clips 10 and places them in the correct positions on the circuit board 14 .
- a pick and place machine vacuum grabber A may engage the upper spring arm 34 , lift the clip 10 off of the tape 50 and place the clip 10 at the appropriate position on the circuit board 14 . Because of the horizontal, substantially planar configuration of the spring arm 34 , the vacuum grabber A has a good surface to engage and lift the clip 10 .
- the pick and place machine vacuum grabber A may then place the clip 10 on the circuit board 14 in positions precisely preprogrammed into the pick and place machine.
- the base 30 of each clip 10 is then positioned atop a solder pad 54 defined on the circuit board 14 , as shown in FIG. 7.
- the solder pad 54 may be defined using conventional solder masking techniques.
- the circuit board 14 may be processed in a surface mount oven. All of the surface mount components on the circuit board 14 are then heat secured using surface mount technology to the circuit board 14 . This means that the clips 10 are soldered to the circuit board 14 . Alternatively, a heat activatable adhesive may be used in place of a solder material.
- strapping clips 10 may be positioned on circuit boards in an automated, low cost fashion.
- the clips enable heat sinks to be quickly strapped onto the socketed processors in cases where clips are not provided with the sockets.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Telephone Set Structure (AREA)
Abstract
A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.
Description
- This invention relates generally to techniques for securing heat sinks to processors.
- Conventionally, a processor is mounted in a socket on a motherboard such as a printed circuit board including a plurality of integrated circuits secured thereto. The integrated circuits may be electrically coupled by conductive lines printed on the circuit board. Heat dissipation affects the operation of the processor and thus it is desirable to have a highly effective and relatively compact heat sink for the processor.
- Commonly clips are provided on the socket for the processor. Straps that connect to those clips are used to clamp a heat sink over the processor contained in the socket. This technique provides a firm spring attachment between the heat sink and the processor and is effective in dissipating heat from the processor.
- However many available sockets do not include the clips for spring strapping the heat sink onto the socket. While it would be desired to use a spring clip strapping technique, there is no way to attach the strap so as to secure the heat sink over the processor.
- Thus there is a need for a way to spring strap heat sinks onto processors secured in sockets without strap attaching clips.
- In accordance with one aspect, a method includes securing at least two clips to a circuit board. A heat sink is clamped over a processor on the circuit board using the clips.
- Other aspects are set forth in the accompanying detailed description and claims.
- FIG. 1 a perspective view of a socketed processor secured to a circuit board, in accordance with one embodiment of the present invention;
- FIG. 2 is a perspective view of a heat sink positioned atop the socketed processor shown in FIG. 1, in accordance with one embodiment of the present invention;
- FIG. 3 is a perspective view of a heat sink clamped over a socketed processor, in accordance with one embodiment of the present invention;
- FIG. 4 is a partial, enlarged cross-sectional view taken generally along the line4-4 in FIG. 3;
- FIGS. 4a, 4 b are partial, enlarged cross-sectional view showing the sequence of attaching a spring loaded strap to a clip in accordance with one embodiment of the present invention;
- FIG. 5 is a top plan view of a tape containing a plurality of clips in accordance with one embodiment of the present invention;
- FIG. 6 is a cross-sectional view taken generally along the line6-6 in FIG. 5 as the clip is being picked up by a pick and place machine; and
- FIG. 7 is a cross-sectional view of one embodiment of the present invention showing the placement of a clip on a circuit board.
- Referring to FIG. 1, a
processor 11 is mounted in asocket 12 which is secured to acircuit board 14 such as a printed circuit board. Thesocket 12 may provide electrical connections between theprocessor 11 and thecircuit board 14. A plurality of C-shaped clips 10 are secured to thecircuit board 14 in an opposed relationship adjacent thesocket 12. Ascrew attachment 16 may be utilized to fix thesocket 12 on thecircuit board 14. In one embodiment of the present invention, thecircuit board 14 is a motherboard. - As shown in FIG. 2, a
heat sink 18 may be positioned atop thesocket 12 over the socketedprocessor 11. Any of variety of heat sinks may be utilized. The heat sink shown in FIG. 2 is a so-called low profile heat sink. However other heat sinks may be utilized including those which include upstanding heat dissipating fins. - The
heat sink 18 may be clamped over the socketedprocessor 11 using a spring loadedclamp 20, as shown in FIG. 3. Theclamp 20 may include a bowed, centralleaf spring portion 28 and a pair ofspring arms spring arm 22. Thespring arm 22 engages theclip 10 c, thespring arm 26 engages theclip 10 b, and thespring arm 24 engages theclip 10 a. While an embodiment using threespring arms - The spring loaded
strap 20 provides a spring force which securely presses theheat sink 18 into physical contact with the socketedprocessor 11. In this regard, thestrap 20 is advantageously made of a highly resilient material such as spring steel. Likewise, the C-shaped clips 10 may provide a spring action between the point of securement of the clips to thecircuit board 14 and the rest of thestrap 20. That is, theclips 10 may act as leaf springs which act in concert with the spring action arising from theportion 28. Thus, the clips may also be made of a highly resilient material. - As shown in FIG. 4, each
clip 10 includes an upper cantileveredleaf spring arm 34, avertical arm 32, and abase 30. In addition, thespring arm 34 includes acatch 36 which may be turned downwardly relative to thearm 34. Thearm 34 andbase 30 may be substantially planar and substantially parallel to one another, in one embodiment of the invention. - Similarly, the
arms guide end 38 which is adjacent to an opening 40. The opening 40 is engaged by thecatch 36 which is releasably locked to thestrap 20 by theguide end 38. - Referring next to FIG. 3, the
strap arms clips 10 a and lob so that thecatches 36 of theclips openings 40 in thespring arms portion 28 is then rotated atop theheat sink 18. Thereafter, thespring arm 22 is deflected downwardly until itsguide end 38 engages the top of thecatch 36 as shown in FIG. 4a. - Because of the downwardly deflected configuration of the
catch 36 this engagement causes thespring arm 34 to deflect downwardly and thespring arm 22 to deflect inwardly as indicated by the arrows in FIG. 4a Eventually thearms catch 36 springs upwardly along theguide end 38. Eventually thecatch 36 springs through the opening 40 and theguide end 38 then springs outwardly trapping thecatch 36 in the opening 40, as shown in FIG. 4. Thecatch 36 is releasably constrained on theside 41 of theguide edge 38. In this way, a spring clamping force may be applied byopposed clips 10 to thestrap 20 to securely press theheat sink 18 onto theprocessor 11. - The securement between the
clip 10 c and thestrap 20 may be released by again depressing thespring arm 22, camming thecatch 36 out of the opening 40 through the engagement ofedge 44 with the top surface of thecatch 36. When thespring arm 22 is released, it moves upwardly quickly, and thecatch 36 does not reengage the opening 40. - Turning now to FIG. 5, a
tape 50, which may be made of a relatively low cost material wound onto a reel (not shown), includes a plurality ofclips 10 secured in rows and columns thereto. Theclips 10 may be releasably secured to thetape 50 using a releasable adhesive. - The
tape 50 may be unwound into a pick and place machine (not shown) which sequentially engages theclips 10 and places them in the correct positions on thecircuit board 14. Thus, as shown in FIG. 6, a pick and place machine vacuum grabber A may engage theupper spring arm 34, lift theclip 10 off of thetape 50 and place theclip 10 at the appropriate position on thecircuit board 14. Because of the horizontal, substantially planar configuration of thespring arm 34, the vacuum grabber A has a good surface to engage and lift theclip 10. - The pick and place machine vacuum grabber A may then place the
clip 10 on thecircuit board 14 in positions precisely preprogrammed into the pick and place machine. Thebase 30 of eachclip 10 is then positioned atop asolder pad 54 defined on thecircuit board 14, as shown in FIG. 7. Thesolder pad 54 may be defined using conventional solder masking techniques. - Thereafter, the
circuit board 14 may be processed in a surface mount oven. All of the surface mount components on thecircuit board 14 are then heat secured using surface mount technology to thecircuit board 14. This means that theclips 10 are soldered to thecircuit board 14. Alternatively, a heat activatable adhesive may be used in place of a solder material. - In this way, strapping clips10 may be positioned on circuit boards in an automated, low cost fashion. The clips enable heat sinks to be quickly strapped onto the socketed processors in cases where clips are not provided with the sockets.
- While the present invention has been described with respect to a limited number of embodiments, those skilled in the art will appreciate numerous modifications and variations therefrom. It is intended that the appended claims cover all such modifications and variations as fall within the true spirit and scope of this present invention.
Claims (20)
1. A method comprising:
securing at least two clips to a circuit board; and
clamping a heat sink over a processor on said circuit board using said clips.
2. The method of wherein securing at least two clips to a circuit board includes securing said clips to said circuit board using surface mount techniques.
claim 1
3. The method of wherein securing at least two clips to a circuit board includes using a pick and place machine to position said clips on said circuit board.
claim 2
4. The method of wherein securing at least two clips to a circuit board includes securing a plurality of clips to a tape.
claim 3
5. The method of wherein securing at least two clips to a circuit board includes removing said clips from said tape and positioning said clips on said circuit board using a pick and place machine.
claim 4
6. An electronic device comprising:
a circuit board;
a processor socket secured to said circuit board;
a processor mounted in said socket;
a heat sink positioned over said socket and said processor;
at least two clips mounted on said circuit board on two opposed sides of said heat sink; and
a spring clamp extending from a clip on one side of said heat sink to a clip on the other side of said heat sink so as to resiliently clamp said heat sink onto said processor.
7. The device of wherein said clips are C-shaped.
claim 6
8. The device of wherein said clips are secured to said circuit board using surface mount techniques.
claim 6
9. The device of wherein each clip is C-shaped including a base which is secured to said circuit board by surface mount techniques and a cantilevered leaf spring arm, which engages said spring clamp, said arm coupled to said base.
claim 8
10. The device of wherein said spring clamp includes an opening and said cantilevered leaf spring arm including a downwardly directed catch, said catch releasably engagable by said opening.
claim 9
11. A system for clamping a heat sink over a socketed processor on a circuit board comprising:
a spring clamp having at least two opposed spring arms, each spring arm including an opening; and
a pair of C-shaped clips, each clip including a cantilevered spring arm, said spring arm including a catch, said catch releasably engagable in said opening, said clips including a base that may be secured to a circuit board.
12. The system of wherein each clip includes a vertical portion coupling said base and said cantilevered spring arm.
claim 11
13. The system of wherein said catch is a downwardly turned portion of the end of said cantilevered spring arm.
claim 12
14. The system of wherein said base and said cantilevered spring arm are substantially planar and are substantially parallel to one another.
claim 13
15. A clip for strapping heat sinks onto processors on circuit boards comprising:
a substantially planar base;
an upstanding portion coupled to said base;
a cantilevered leaf spring coupled to said upstanding portion; and
a catch on said spring to releasably engage a heat sink clamp.
16. The clip of wherein said catch is a downwardly turned end portion of said cantilevered leaf spring.
claim 15
17. The clip of wherein said spring and said base are both substantially planar and are substantially parallel to one another.
claim 16
18. The clip of wherein said spring has a pair of opposed edges, one edge coupled to said portion and the other edge forming said catch.
claim 16
19. The clip of wherein said base has a pair of opposed edges, one of said edges coupled to said spring.
claim 18
20. The clip of being generally C-shaped.
claim 15
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/736,987 US6362965B2 (en) | 1999-11-29 | 2000-12-14 | Clamping heat sinks to circuit boards over processors |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/450,080 US6222734B1 (en) | 1999-11-29 | 1999-11-29 | Clamping heat sinks to circuit boards over processors |
US09/736,987 US6362965B2 (en) | 1999-11-29 | 2000-12-14 | Clamping heat sinks to circuit boards over processors |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/450,080 Division US6222734B1 (en) | 1999-11-29 | 1999-11-29 | Clamping heat sinks to circuit boards over processors |
Publications (2)
Publication Number | Publication Date |
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US20010002160A1 true US20010002160A1 (en) | 2001-05-31 |
US6362965B2 US6362965B2 (en) | 2002-03-26 |
Family
ID=23786690
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/450,080 Expired - Lifetime US6222734B1 (en) | 1999-11-29 | 1999-11-29 | Clamping heat sinks to circuit boards over processors |
US09/736,987 Expired - Lifetime US6362965B2 (en) | 1999-11-29 | 2000-12-14 | Clamping heat sinks to circuit boards over processors |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/450,080 Expired - Lifetime US6222734B1 (en) | 1999-11-29 | 1999-11-29 | Clamping heat sinks to circuit boards over processors |
Country Status (8)
Country | Link |
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US (2) | US6222734B1 (en) |
CN (1) | CN1288751C (en) |
AU (1) | AU1089601A (en) |
DE (1) | DE10085252T1 (en) |
GB (1) | GB2371680B (en) |
HK (1) | HK1059986A1 (en) |
TW (1) | TW556468B (en) |
WO (1) | WO2001039268A1 (en) |
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US20080310120A1 (en) * | 2004-08-31 | 2008-12-18 | Werner Wallrafen | Electric Sub-Assembly |
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-
2000
- 2000-10-16 WO PCT/US2000/028587 patent/WO2001039268A1/en active Application Filing
- 2000-10-16 AU AU10896/01A patent/AU1089601A/en not_active Abandoned
- 2000-10-16 GB GB0208934A patent/GB2371680B/en not_active Expired - Fee Related
- 2000-10-16 DE DE10085252T patent/DE10085252T1/en not_active Ceased
- 2000-10-16 CN CN00819531.5A patent/CN1288751C/en not_active Expired - Fee Related
- 2000-11-22 TW TW089124804A patent/TW556468B/en not_active IP Right Cessation
- 2000-12-14 US US09/736,987 patent/US6362965B2/en not_active Expired - Lifetime
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2004
- 2004-04-19 HK HK04102739A patent/HK1059986A1/en not_active IP Right Cessation
Cited By (12)
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US6545352B1 (en) | 2002-02-15 | 2003-04-08 | Ericsson Inc. | Assembly for mounting power semiconductive modules to heat dissipators |
WO2003081641A2 (en) * | 2002-03-21 | 2003-10-02 | Aavid Thermalloy, Llc | Support clip |
WO2003081641A3 (en) * | 2002-03-21 | 2004-07-29 | Aavid Thermalloy Llc | Support clip |
US20050160568A1 (en) * | 2002-03-21 | 2005-07-28 | Aavid Thermalloy, Llc | Support clip |
US20080310120A1 (en) * | 2004-08-31 | 2008-12-18 | Werner Wallrafen | Electric Sub-Assembly |
US8174097B2 (en) | 2004-08-31 | 2012-05-08 | Continental Automotive Gmbh | Electric sub-assembly |
US20060087014A1 (en) * | 2004-10-25 | 2006-04-27 | Rubenstein Brandon A | Bolster plate assembly for processor module assembly |
US7344384B2 (en) | 2004-10-25 | 2008-03-18 | Hewlett-Packard Development Company, L.P. | Bolster plate assembly for processor module assembly |
US20090154108A1 (en) * | 2007-12-18 | 2009-06-18 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Clip and heat dissipation assembly using the same |
US7746647B2 (en) * | 2007-12-18 | 2010-06-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Clip and heat dissipation assembly using the same |
US20130094141A1 (en) * | 2009-11-17 | 2013-04-18 | Apple Inc. | Heat removal in compact computing systems |
US8897016B2 (en) * | 2009-11-17 | 2014-11-25 | Apple Inc. | Heat removal in compact computing systems |
Also Published As
Publication number | Publication date |
---|---|
CN1452787A (en) | 2003-10-29 |
DE10085252T1 (en) | 2003-06-05 |
GB2371680A (en) | 2002-07-31 |
US6222734B1 (en) | 2001-04-24 |
HK1059986A1 (en) | 2004-07-23 |
US6362965B2 (en) | 2002-03-26 |
AU1089601A (en) | 2001-06-04 |
CN1288751C (en) | 2006-12-06 |
WO2001039268A1 (en) | 2001-05-31 |
GB0208934D0 (en) | 2002-05-29 |
TW556468B (en) | 2003-10-01 |
GB2371680B (en) | 2004-08-11 |
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