CN1421964A - 电子元件组装体及其中间电连接器以及单元体 - Google Patents
电子元件组装体及其中间电连接器以及单元体 Download PDFInfo
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Abstract
在中间连接器(2)中,使电路基板(1)上的电子元件(8A)、(8B)、(8C)收容用的基板侧空间部(7)在外壳中贯穿形成;单元体(11)由重叠连接器构件(12)及搭载构件(13)二片构件构成;位于中间连接器侧的连接器构件(12)对应中间连接器的基板侧空间部(7)朝板厚方向贯穿形成单元侧空间部(16),同时,在朝向中间连接器的面设有使多个阳端子(17)从该面突出且在相反面连接在该阳端子的连接部(18);搭载构件(13)以朝向连接器构件(12)的面在单元侧空间部(16)的收容领域内搭载有电子元件(19A)、(19B)、(19C),而在该领域外对应连接器构件的连接部设有连接垫片(20)。从而提供可搭载多个电子元件的电子元件组装体、中间连接器、单元体而不需增加电路基板的厚度方向尺寸。
Description
技术领域
本发明涉及电子元件组装体及其中间电连接器以及单元体,具体涉及一种经中间连接器将搭载有电子元件的单元体与电路基板连接的电子元件组装体及其中间电连接器以及单元体。
背景技术
这种电子元件组装体已知的例如日本专利特开平8-31532。
如图3所示,该公知的组装体具有与配置于中间连接器51上的中间连接器52连接的单元体53。
中间连接器52为在与中间连接器51平行的板状的外壳54中将多个端子55设成在图中横方向且对于纸面垂直方向的行及列。该端子55在其突出下端55A处与中间连接器51的对应电路由焊料连接,且上端为阴受入部55B而突出于外壳54的上面。
单元体53由连接器构件56及搭载于其上的IC等的电子元件57构成。连接器构件56在对应大小的板状外壳56A上与上述中间连接器51平行植设有销状的端子58。该端子58从外壳56A朝下方突出,且上端由焊球59与上述IC等的电子元件57连接。该电子元件57及连接器构件56由固定工具60保持并形成上述单元体53。
近来,电子机器趋向小型化,尤其是薄型化,即使在图3中的例子也最好为高度方向的尺寸小且可搭载较多的元件,接点数多。
但在图3中的例子中,电子元件57在单元体53中只搭载于连接器构件56的上面,其数量只有一个。其结果是与可搭载多个电子元件使其功能多样化的目的无法对应。但是,即使单纯地扩大上述连接器构件56,与上述电子元件57邻接并搭载其它电子元件,而在周围需具有多个用于连接该电子元件的脚,并需确保其电路配线的空间,所以无法将电子元件彼此紧密配置,因此横方向的尺寸可能变得太大。
本发明有鉴于此,其目的在于提供一种不需增加电路基板的厚度方向尺寸就可搭载多个电子元件的电子元件组装体及其中间连接器以及单元体。
本发明内容
本发明的电子元件组装体包括:与电路基板的面平行延伸且被安装在该电路基板的中间连接器,经该中间连接器在而连接在与上述电路基板平行的位置并搭载电子元件的板状的单元体。
这种本发明的电子元件组装体的特征在于:中间连接器使供电路基板上的电子元件收容用的基板侧空间部在外壳中贯穿形成;单元体由重叠连接器构件及搭载构件的二片构件构成;位在中间连接器侧的连接器构件对应于中间连接器的基板侧空间部朝板厚方向贯穿形成单元侧空间部,同时,在朝向中间连接器的面设有使多个阳端子从该面突出且在相反面与该阳端子连接的连接部;搭载构件以朝向连接器构件的面在单元侧空间部的收容领域内搭载有电子元件,而在该领域外对应于连接器构件的连接部设有连接垫片。
本发明中,不需对应于中间连接器的基板侧空间部及单元体的单元侧空间部增大其厚度就可形成一个收容空间,且在其中收容有电路基板上的电子元件及单元体的搭载构件上的电子元件。中间连接器及单元体的连接部虽设在上述收容空间的周围,但只要稍稍加大两者的一边的尺寸就可确保较多的接点数,而不需过于大型化。
贯穿上述中间连接器及单元体构件的空间部可以是形成窗状的开口部,也可以是朝周围开放的缺口部。
在本发明中,向中间连接器的电路基板的安装和通过搭载构件和连接器构件的连接的单元体的的形成可由其他工序即由非专业人员进行组装,最终由使用者作为电子元件组装体组装。另外,将电子元件向搭载构件进行搭载的人与连接器构件的的提供者有所区别。
本发明由于在中间连接器、单元体的搭载构件的接合面配置多个电子构件,并将其周围区域用作连接器的连接,所以可以在其厚度的范围内收容电子元件而不需增大整个高度(厚度)方向的尺寸,只需加大若干平面形状尺寸即可确保更多的接点,又,在搭载构件上可依据需要利用上述接合面及相反侧的面增大电子元件的搭载区域而使设计的自由度增大,并可实现组装体的元件的高密度配置及功能的多样化。
附图简单说明
图1为表示本发明的一实施例的电子元件组装体、单元体被连接在中间连接器之前的状态的立体图。
图2为在分离连接器构件及搭载构件的状态下将图1的单元体对于图1呈上下反转的姿势的立体图。
图3为现有装置的正面图。
具体实施方式
现参照图面1、2说明本发明的电子元件组装体及其之中间电连接器以及单元体。
在表示本发明的一实施例的图1中,在电路基板1上安装有中间连接器2,且与电路基板1上的预定电路部(未图示)连接。
上述中间连接器2包括固定在电路基板1并保持与电路基板的上述预定电路部连接的多个端子(未图示)的固定构件3以及在此固定构件3上只可滑动预定距离的可动构件4。被保持于上述固定构件3的端子具有当对应该端子朝形成于可动构件4的插入孔4A插入并设在后述对手连接器的单元体的连接器构件的阳端子贯穿上述插入孔4A时接受其的受入部而成为阴端子。在本实施例中,朝该阳端子的阴端子(的受入部)的插入为无阻力或低阻力的所谓零插拔力,并通过对于可动构件4的固定构件3的相对滑动而使两种端子压接接触。在上述可动构件4的一边,使板状的金属构件5安装在上述插入孔4A的配列领域外,并设有在此金属构件5(和可动构件4)及固定构件3之间动作的偏心凸轮6。只要利用起子等适当的工具将此偏心凸轮6正逆旋转预定角度就可将上述可动构件4带到端子压接方向及解除方向。这种原理的中间连接器本身为公知技术。
在本发明中,其特征为:在上述中间连接器2即其固定构件3及可动构件4中,使窗状的空间部7形成朝上下贯穿。换言之,在此窗状的空间部的周围区域,固定构件3保持阴端子,可动构件4形成插入孔4A。
在上述窗状的空间部7的区域中,在电路基板1上配设有各种多个电子元件8A、8B、8C…,并与电路基板1的电路部连接。因此,这些电子元件8A、8B、8C…成为被收容于上述中间连接器2的空间部7的形态。
另一方面,与上述中间连接器2连接的单元体11具有相互呈板状接合的连接器构件12及搭载构件13。连接器构件12将图1的单元体11上下反转并分离两构件12、13,如图2所示,在四角形的框状的平面形状的外壳14上植设有多个销状的阳端子17。在本实施例中,上述外壳14对于上述中间连接器2的金属构件5以外的区域即不被该金属构件5所覆盖而露出的区域具有与多个插入孔4A配列形成的区域一致的外形及窗状的开口部16。而且,在此外壳14中,在与上述中间连接器2面接触的侧面(图2的上面),使与该中间连接器2的阴端子连接的销状的阳端子17设成配列在与上述插入孔4A对应的位置。此阳端子17在外壳14的相反面(图的下面)设有焊球等的连接部18。
如图2所示,与上述连接器构件12一起形成单元体11的搭载构件13在面对上述连接器构件12的侧面(图2的上面)且对应上述连接器构件12的窗状的开口部16的区域内搭载有存储器等多个电子元件19A、19B、19C…并与预定的电路连接。在配置有该电子元件的区域的周围,在对应于上述连接器构件12的多个连接部18的位置分别设有多个连接垫片20。该连接垫片20也与上述预定的电路连接。而且,在本实施例的情况,此搭载构件13在相反面(图2的下面,图1的上面)也追加地搭载有其它的多个电子元件21A、21B、21C……,并与上述电路连接。
在本实施例中,单元体的组装及朝此单元体的中间连接器的连接按以下要领进行。
(1)首先,将搭载有电子元件19A、20A等的搭载构件13及连接器构件12连接一体化并形成单元体11。此连接是通过将搭载构件13在连接器构件12上配置成使搭载构件13的连接部18配置在连接器构件12的对应连接垫片20上,并将热风等吹在连接面使连接部18的焊球熔化而成。而且,在将搭载构件13上的一方的面的电子元件19A、19B、19C…收容于连接器构件12的开口部16内的空间的状态下,使搭载构件13及连接器构件12一体化而形成一个单元体11。
(2)接着,将如图1的单元体11的连接器构件12为阳端子17朝向中间连接器2的方向且使该配置在中间连接器2上的预定位置的连接器构件12的各阳端子17贯穿形成于中间连接器2的可动构件4的对应插入孔4A,并无阻力或低阻力地进入固定构件3的对应阴端子的受入部。
(3)之后,将偏心凸轮6旋转预定角度,使可动构件4在固定构件3上滑动。阳端子17在阴端子的受入部内移动且由该阴端子的接触部进行压接。而且,单元体11的电子元件经电路部及端子与电路基板1的电路连接而获得预定的电子元件组装体。
本发明并不限定于图示的形态。例如:中间连接器可以不是图示的零插拔力连接的形式,也可为单纯地使端子插入(压入嵌合)接触。又,在本实施例中,虽在形成于中间连接器的空间部7(基板侧空间部)中收容有电路基板上的电子元件,而且在单元体的空间部(单元侧空间部)中收容有搭载构件上的电子元件,但因为上述基板侧空间部与单元侧空间部连通而形成一个大的空间,所以可将电路基板侧及搭载构件侧的两侧的电子元件共享地收容于此空间。当然,上述的追加的电子元件21A等如无需要就无需搭载,则该部分可以更薄型化。
而且,上述空间部不作成窗状的开口部,而也可作成具有侧部在一方或二方开放的缺口部的空间。
Claims (7)
1.一种电子元件组装体,包括:与电路基板的面平行延伸且被安装在该电路基板的中间连接器、经该中间连接器在与上述电路基板平行的位置连接并搭载电子元件的板状的单元体,其特征在于:所述中间连接器为使所述电路基板上收容电子元件用的基板侧空间部在外壳中贯穿形成;所述单元体由重叠连接器构件及搭载构件的二片构件构成;位于所述中间连接器侧的连接器构件对应于中间连接器的基板侧空间部朝板厚方向贯穿形成单元侧空间部,同时,在朝向中间连接器的面上设有使多个阳端子从该面突出且在相反面与该阳端子连接的连接部;所述搭载构件以朝向连接器构件的面在所述单元侧空间部的收容区域内搭载有电子元件,而在该区域外与所述连接器构件的连接部对应设有连接垫片。
2.一种与电路基板的面平行延伸且安装在该电路基板上的中间连接器,其特征在于:所述外壳中贯穿形成收容上述电路基板上的电子元件用的空间部。
3.如权利要求2的中间连接器,其特征在于:所述空间部为形成窗状的开口部。
4.如权利要求2的中间连接器,其特征在于:所述空间部为朝周围开放的缺口部。
5.一种单元体,系经与电路基板的面平行延伸且安装在该电路基板的中间连接器在与上述电路基板平行的位置连接并搭载电子元件的板状的单元体,其特征在于:所述单元体由重叠连接器构件及搭载构件的二片构件构成;位于所述中间连接器侧的连接器构件朝板厚方向贯穿形成空间部,同时,在朝向中间连接器的面处设有使多个阳端子从该面突出且在相反面与该阳端子连接的连接部;所述搭载构件对应于所述连接器构件的连接部设有连接垫片。
6.如权利要求5的中间连接器,其特征在于:所述空间部为形成窗状的开口部。
7.如权利要求5的中间连接器,其特征在于:所述空间部为朝周围开放的缺口部。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2001357903 | 2001-11-22 | ||
JP2001357903A JP3718161B2 (ja) | 2001-11-22 | 2001-11-22 | 電子部品組立体及びそのためのユニット体 |
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CN1421964A true CN1421964A (zh) | 2003-06-04 |
CN1229896C CN1229896C (zh) | 2005-11-30 |
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CNB021522693A Expired - Fee Related CN1229896C (zh) | 2001-11-22 | 2002-11-18 | 电子元件组装体及单元体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6873519B2 (zh) |
EP (1) | EP1315243A3 (zh) |
JP (1) | JP3718161B2 (zh) |
KR (1) | KR100595342B1 (zh) |
CN (1) | CN1229896C (zh) |
TW (1) | TW560752U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111200898A (zh) * | 2018-11-19 | 2020-05-26 | 中兴通讯股份有限公司 | 一种pcb板、制造方法及设备 |
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JP2011089891A (ja) * | 2009-10-22 | 2011-05-06 | Micronics Japan Co Ltd | 電気的接続装置及びこれを用いる試験装置 |
US9603276B2 (en) | 2014-12-26 | 2017-03-21 | Intel Corporation | Electronic assembly that includes a plurality of electronic packages |
US20160190716A1 (en) * | 2014-12-26 | 2016-06-30 | Kuang Liu | Socket that engages a plurality of electronic packages |
KR101706120B1 (ko) * | 2015-06-10 | 2017-02-15 | 한국태양유전(주) | 단자대 및 이를 포함하는 인쇄회로기판 |
KR20210031303A (ko) | 2019-09-11 | 2021-03-19 | 삼성전자주식회사 | 회로 기판에 실장되는 커넥터를 포함하는 전자 장치 |
CN112930030B (zh) * | 2019-12-05 | 2022-09-23 | 荣耀终端有限公司 | 电路板组件及电子设备 |
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US3764856A (en) * | 1972-05-17 | 1973-10-09 | Massachusetts Inst Technology | Heat transfer in electronic equipment |
US4667267A (en) | 1985-01-22 | 1987-05-19 | Rogers Corporation | Decoupling capacitor for pin grid array package |
US4734819A (en) | 1985-12-20 | 1988-03-29 | Rogers Corporation | Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package |
US4908057A (en) * | 1988-08-01 | 1990-03-13 | Monsanto Company | Substituted 2,6-substituted 1,2- or 1,6-dihydro pyridine compounds |
JPH07101625B2 (ja) * | 1990-05-29 | 1995-11-01 | 株式会社ピーエフユー | Icソケット洗浄用治具並びにこれを利用したソケット洗浄方法 |
US5309324A (en) * | 1991-11-26 | 1994-05-03 | Herandez Jorge M | Device for interconnecting integrated circuit packages to circuit boards |
DE4326104A1 (de) * | 1993-08-04 | 1995-02-09 | Blaupunkt Werke Gmbh | Elektrische Baugruppe |
US6835898B2 (en) * | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
JP2541487B2 (ja) | 1993-11-29 | 1996-10-09 | 日本電気株式会社 | 半導体装置パッケ―ジ |
US5959840A (en) * | 1994-05-17 | 1999-09-28 | Tandem Computers Incorporated | Apparatus for cooling multiple printed circuit board mounted electrical components |
JP2752038B2 (ja) | 1994-07-19 | 1998-05-18 | ケル株式会社 | Bga−pga変換装置 |
US5619399A (en) * | 1995-02-16 | 1997-04-08 | Micromodule Systems, Inc. | Multiple chip module mounting assembly and computer using same |
US5730620A (en) * | 1995-09-08 | 1998-03-24 | International Business Machines Corporation | Method and apparatus for locating electrical circuit members |
KR20000047155A (ko) * | 1998-12-31 | 2000-07-25 | 장근호 | 부품간격 변환 아답터 |
-
2001
- 2001-11-22 JP JP2001357903A patent/JP3718161B2/ja not_active Expired - Fee Related
-
2002
- 2002-10-21 TW TW091216782U patent/TW560752U/zh not_active IP Right Cessation
- 2002-11-01 KR KR1020020067491A patent/KR100595342B1/ko not_active IP Right Cessation
- 2002-11-18 CN CNB021522693A patent/CN1229896C/zh not_active Expired - Fee Related
- 2002-11-21 US US10/300,855 patent/US6873519B2/en not_active Expired - Fee Related
- 2002-11-21 EP EP02026007A patent/EP1315243A3/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111200898A (zh) * | 2018-11-19 | 2020-05-26 | 中兴通讯股份有限公司 | 一种pcb板、制造方法及设备 |
Also Published As
Publication number | Publication date |
---|---|
EP1315243A2 (en) | 2003-05-28 |
KR100595342B1 (ko) | 2006-07-03 |
EP1315243A3 (en) | 2004-01-28 |
CN1229896C (zh) | 2005-11-30 |
KR20030043633A (ko) | 2003-06-02 |
JP2003157938A (ja) | 2003-05-30 |
TW560752U (en) | 2003-11-01 |
US6873519B2 (en) | 2005-03-29 |
US20030095391A1 (en) | 2003-05-22 |
JP3718161B2 (ja) | 2005-11-16 |
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