CN1347844A - 用蜡涂敷硅石的方法 - Google Patents
用蜡涂敷硅石的方法 Download PDFInfo
- Publication number
- CN1347844A CN1347844A CN01125767A CN01125767A CN1347844A CN 1347844 A CN1347844 A CN 1347844A CN 01125767 A CN01125767 A CN 01125767A CN 01125767 A CN01125767 A CN 01125767A CN 1347844 A CN1347844 A CN 1347844A
- Authority
- CN
- China
- Prior art keywords
- wax
- silica
- coating
- temperature
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 27
- 238000000576 coating method Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 91
- 239000000377 silicon dioxide Substances 0.000 title claims description 42
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 5
- 239000006224 matting agent Substances 0.000 claims description 9
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 abstract 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract 3
- 239000001993 wax Substances 0.000 description 45
- 239000013049 sediment Substances 0.000 description 9
- 238000004062 sedimentation Methods 0.000 description 8
- 238000000227 grinding Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000017 hydrogel Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000004018 waxing Methods 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000006115 industrial coating Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- ADOFEJQZDCWAIL-UHFFFAOYSA-N propyl 2-ethoxyacetate Chemical compound CCCOC(=O)COCC ADOFEJQZDCWAIL-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3072—Treatment with macro-molecular organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
- C09D1/02—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances alkali metal silicates
- C09D1/04—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances alkali metal silicates with organic additives
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
- Silicon Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
硅石 | 涂层剂 | ||
BET[m2/g] | 200 | 微粉[μm] | 8.5 |
DBP[g/100g] | 230 | 熔点(DSC)[℃] | 110-118 |
d10 | 4.66 | 120℃下的熔体粘度[mm2/s] | 135-240 |
d50 | 9.11 | 克分子量(GPC)[g/mol] | 约3500 |
d90 | 23.10 | 23℃下的密度[g/cm3] | 0.940-0.955 |
分选器转速 | [min-1] | 10500 |
研磨器转速 | [min-1] | 9500 |
d10 | [μm] | 2.82 |
d50 | [μm] | 5.24 |
d90 | [μm] | 8.91 |
C-含量 | [%] | 3.3 |
细度计值 | [μm] | 30 |
60°光泽 | 19.7 | |
相对于标准的60°光泽 | 1.7 | |
沉降 | 2- |
出口温度 | [℃] | 120 | 100 | 80 |
蜡名称 | AF 30 | AF 30 | AF 30 | |
d10* | [μm] | 4,48 | 4,63 | 4,67 |
d50* | [μm] | 8,44 | 8,88 | 8,54 |
d90* | [μm] | 13,96 | 14,63 | 14,05 |
C-含量 | [%] | 5,48 | 5,94 | 5,67 |
细度计值 | [μm] | 25 | 30 | 27 |
相对于标准的60°光泽** | [%] | -5,5 | 1,7 | 0,8 |
沉降*** | 2 | 2 | 5 | |
蜡脱离 | 无 | 无 | - |
蜡 | 生产商 | 软化点 [℃] |
AF 30 | BASF 公司 | 105-112 |
SL 555 | Daniel Products 公司 | 82-86 |
Aquabead 916 | Micropowders 公司 | 64-67 |
蜡名称 | AF 30 | SL 555 | Aquabead 916 | |
出口温度 | [℃] | 120 | 120 | 120 |
d10* | [μm] | 4,48 | 4,57 | 4,58 |
d50* | [μm] | 8,44 | 8,88 | 8,98 |
d90* | [μm] | 13,96 | 14,84 | 15,29 |
C-含量 | [%] | 5,48 | 5,31 | 4,97 |
细度计值 | [μm] | 25 | 28 | 29 |
相对于标准的60°光泽** | [%] | -5,5 | -4,9 | -5,5 |
沉降*** | 2 | 2 | 2 | |
蜡脱离 | 无 | 无 | 无 |
蜡名称 | AF 30 | SL 555 | Aquabead 916 | |
出口温度 | [℃] | 100 | 100 | 100 |
d10* | [μm] | 4,57 | 4,46 | 4,13 |
d50* | [μm] | 8,88 | 8,77 | 7,76 |
d90* | [μm] | 14,63 | 13,31 | 11,83 |
C-含量 | [%] | 5,94 | 5,69 | 4,97 |
细度计值 | [μm] | 30 | 29 | 31 |
相对于标准的60°光泽** | [%] | 1,7 | 0,5 | -0,1 |
沉降*** | 2 | 2 | 2 | |
蜡脱离 | 无 | 无 | 无 |
蜡名称 | AF 30 | SL 555 | Aquabead 916 | |
出口温度 | [℃] | 80 | 80 | 80 |
d10* | [μm] | 4,67 | 4,18 | 4,15 |
d50* | [μm] | 8,54 | 8,17 | 7,79 |
d90* | [μm] | 14,05 | 12,56 | 11,75 |
C-含量 | [%] | 5,67 | 5,79 | 4,76 |
细度计值 | [μm] | 27 | 27 | 31 |
相对于标准的60°光泽** | [%] | 0,8 | 1,1 | -1,2 |
沉降 | 5 | 2 | 2 | |
蜡脱离 | - | 无 | 无 |
Claims (6)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10041465.6 | 2000-08-23 | ||
DE10041465 | 2000-08-23 | ||
DE10122861A DE10122861A1 (de) | 2000-08-23 | 2001-05-11 | Verfahren zur Belegung von Kieselsäuren mit Wachsen |
DE10122861.9 | 2001-05-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1347844A true CN1347844A (zh) | 2002-05-08 |
CN1281489C CN1281489C (zh) | 2006-10-25 |
Family
ID=26006799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011257679A Expired - Lifetime CN1281489C (zh) | 2000-08-23 | 2001-08-22 | 用蜡涂敷硅石的方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US6921781B2 (zh) |
EP (1) | EP1182233B1 (zh) |
JP (1) | JP2002097385A (zh) |
KR (1) | KR100800981B1 (zh) |
CN (1) | CN1281489C (zh) |
BR (1) | BR0103436A (zh) |
CA (1) | CA2355501A1 (zh) |
IL (1) | IL145016A (zh) |
NZ (1) | NZ513801A (zh) |
TR (1) | TR200402354T4 (zh) |
TW (1) | TWI274777B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100519665C (zh) * | 2002-09-06 | 2009-07-29 | 德古萨公司 | 基于沉淀二氧化硅的高效消光剂 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0127220D0 (en) * | 2001-11-13 | 2002-01-02 | Ineos Silicas Ltd | Silica matting agents |
KR100954073B1 (ko) * | 2002-12-18 | 2010-04-23 | 에보닉 데구사 게엠베하 | 구조적으로 피복된 실리카 |
US20090011352A1 (en) * | 2007-07-02 | 2009-01-08 | John Francis Cooper | Process for preparing novel composite imaging materials and novel composite imaging materials prepared by the process |
DE102008021006A1 (de) | 2008-04-25 | 2009-11-05 | Byk-Chemie Gmbh | Partikuläre Wachskomposite und Verfahren zu deren Herstellung sowie deren Verwendung |
DE102008021005A1 (de) | 2008-04-25 | 2009-10-29 | Byk-Chemie Gmbh | Partikuläre Wachskomposite mit Kern/Hülle-Struktur und Verfahren zu deren Herstellung sowie deren Verwendung |
US20100028604A1 (en) * | 2008-08-01 | 2010-02-04 | The Ohio State University | Hierarchical structures for superhydrophobic surfaces and methods of making |
WO2013187895A1 (en) * | 2012-06-14 | 2013-12-19 | Empire Technology Development Llc | Multi-functional filtrate materials for adsorbing ethylene gas |
GB201222908D0 (en) | 2012-12-19 | 2013-01-30 | Pq Silicas Uk Ltd | Curable liquid compositions |
WO2018091986A1 (en) * | 2016-10-06 | 2018-05-24 | King Abdullah University Of Science And Technology | Compositions and methods relating to functionalized sands |
DE102017209874A1 (de) | 2017-06-12 | 2018-12-13 | Evonik Degussa Gmbh | Verfahren zur Herstellung von wachsbeschichteter Kieselsäure |
JP7128057B2 (ja) * | 2017-09-27 | 2022-08-30 | 水澤化学工業株式会社 | 塗料用配合剤 |
US20220186045A1 (en) | 2019-02-01 | 2022-06-16 | W.R. Grace & Co.-Conn. | Silica-based matting agents and methods of making and using the same |
JP7353469B2 (ja) | 2019-08-30 | 2023-09-29 | ダブリュー・アール・グレース・アンド・カンパニー-コーン | シリカベースの艶消し配合物ならびにその作製および使用方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2838413A (en) | 1954-05-27 | 1958-06-10 | Grace W R & Co | Silica gel flatting agent, method of preparing same, and composition containing same |
DE1592865C3 (de) | 1967-10-12 | 1980-04-24 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Verfahren zur Herstellung von organisch modifizierten Kieselsauren |
US3816154A (en) * | 1973-05-18 | 1974-06-11 | Goury T Mc | Silica gel flatting agent |
DE3047412A1 (de) * | 1980-12-17 | 1982-07-15 | Thyssen Industrie Ag, 4300 Essen | Anordnung von scheibenbremsen an einem schienenfahrzeug |
DE4032619C3 (de) * | 1990-10-15 | 1998-01-08 | Grace Gmbh | Si0¶2¶-Mattierungsmittel, Verfahren zu dessen Herstellung und dessen Verwendung |
EP0442325B2 (en) | 1990-02-14 | 1997-10-22 | Grace GmbH | Si02-Flatting agent, process for its production and its use |
EP0541359B1 (en) * | 1991-11-07 | 1995-07-19 | Crosfield Limited | Silica products |
GB9517607D0 (en) * | 1995-08-29 | 1995-11-01 | Unilever Plc | Silica products and uv curable systems |
EP0922691B1 (en) | 1997-12-03 | 2004-04-28 | Shell Internationale Research Maatschappij B.V. | Hydroformylation process |
DE19755287A1 (de) * | 1997-12-12 | 1999-07-08 | Degussa | Fällungskieselsäure |
WO2001004217A2 (en) * | 1999-04-13 | 2001-01-18 | Grace Gmbh & Co. Kg | A matting agent for radiation curing coatings |
-
2001
- 2001-07-07 TR TR200402354T patent/TR200402354T4/xx unknown
- 2001-07-07 EP EP20010116461 patent/EP1182233B1/de not_active Revoked
- 2001-08-17 BR BR0103436A patent/BR0103436A/pt not_active Application Discontinuation
- 2001-08-21 IL IL145016A patent/IL145016A/en not_active IP Right Cessation
- 2001-08-21 CA CA 2355501 patent/CA2355501A1/en not_active Abandoned
- 2001-08-21 JP JP2001250829A patent/JP2002097385A/ja active Pending
- 2001-08-22 CN CNB011257679A patent/CN1281489C/zh not_active Expired - Lifetime
- 2001-08-22 KR KR20010050607A patent/KR100800981B1/ko active IP Right Grant
- 2001-08-23 US US09/934,471 patent/US6921781B2/en not_active Expired - Lifetime
- 2001-08-23 TW TW90120775A patent/TWI274777B/zh not_active IP Right Cessation
- 2001-08-27 NZ NZ51380101A patent/NZ513801A/xx not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100519665C (zh) * | 2002-09-06 | 2009-07-29 | 德古萨公司 | 基于沉淀二氧化硅的高效消光剂 |
Also Published As
Publication number | Publication date |
---|---|
US6921781B2 (en) | 2005-07-26 |
NZ513801A (en) | 2001-09-28 |
US20020055556A1 (en) | 2002-05-09 |
KR100800981B1 (ko) | 2008-02-05 |
CN1281489C (zh) | 2006-10-25 |
CA2355501A1 (en) | 2002-02-23 |
EP1182233A3 (de) | 2002-07-24 |
KR20020015962A (ko) | 2002-03-02 |
BR0103436A (pt) | 2002-05-28 |
IL145016A (en) | 2006-06-11 |
TWI274777B (en) | 2007-03-01 |
JP2002097385A (ja) | 2002-04-02 |
EP1182233B1 (de) | 2004-09-08 |
EP1182233A2 (de) | 2002-02-27 |
IL145016A0 (en) | 2002-06-30 |
TR200402354T4 (tr) | 2004-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: EVONIK DEGUSSA CO., LTD. Free format text: FORMER NAME: DEGUSSA CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Dusseldorf, Federal Republic of Germany Patentee after: Degussa GmbH Address before: Dusseldorf, Federal Republic of Germany Patentee before: Degussa AG |
|
CP03 | Change of name, title or address |
Address after: essen Patentee after: Evonik Degussa GmbH Address before: Dusseldorf, Federal Republic of Germany Patentee before: Degussa GmbH |
|
CX01 | Expiry of patent term |
Granted publication date: 20061025 |
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CX01 | Expiry of patent term |