CN1329531A - Method and device for discharge surface treatment - Google Patents
Method and device for discharge surface treatment Download PDFInfo
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- CN1329531A CN1329531A CN99814043.0A CN99814043A CN1329531A CN 1329531 A CN1329531 A CN 1329531A CN 99814043 A CN99814043 A CN 99814043A CN 1329531 A CN1329531 A CN 1329531A
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- machined object
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- discharge
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- sintered electrode
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
A method and a device for discharge surface treatment, wherein a sintered electrode, obtained by mixing iron group metal powder or non-iron group metal powder having the same component as that of a work singly or in combination into powder manufactured by combining metal carbides belonging to IVa, VA and VIa groups in the periodic table single or in combination, compression-molding the mixture and presintering the molded mixture, is used as a discharge machining electrode, a switching means is provided which is adapted to switch, according to the characteristics of a material to be treated, between an electric condition under which the base material of the work is directly discharge-surface-treated and another electric condition under which a hard formed coating is discharge-surface-treated, and discharging is performed continuously between the sintered electrode and the work to continuously keep hard coatings deposited on the surface of the work using the discharge energy, thereby forming a thick film.
Description
Technical field
The present invention relates to a kind of making produces discharge and utilizes this discharge energy to form the discharge surface treating method of hard films and the improvement of device on the machined object surface between electrode and machined object.
Background technology
In the past, as carrying out coating and make machined object have the technology of corrosion stability, wear resistance on the surface of machined object, for example, the spy opened the discharge surface treating method that is disclosed in flat 5-No. 148615 communiques.The surface treatment method of the metallic substance that this technology is made up of following two operations, promptly use the powder electrode that forms by WC powder and Co powder etc. to carry out time processing (pile up processing), change less electrode such as the consumption of electrode of copper electrode etc. then into and carry out processing second time (melt-processed again).This technology in the past is a kind of good method for the hard films that forms several 10 μ m left and right thicknesses on steel, but be difficult on the surface of the agglomerated material of superhard alloy etc., form some first-class problem of hard films with powerful clinging power.
Secondly, opening the discharge surface treating method that also can form the hard films with high clinging power on superhard alloy that flat 9-No. 192937 communiques are disclosed for the spy describes with reference to Fig. 7.In Fig. 7, the 1st, the powder electrode that the TiH2 compression molding is formed, the 2nd, machined object, the 3rd, working groove, the 4th, working fluid, the 5th, be controlled at the switching element that applies voltage and electrode between powder electrode 1 and the machined object 2, the 6th, the pilot circuit that the connection of trip switch element 5 disconnects, the 7th, power supply, the 8th, resistance, the 9th, formed hard films.Handle by utilizing this structure to carry out discharging surface, can form the hard films of number μ m～several 10 μ m thickness on the surface of iron and steel, superhard alloy etc.
Again, open in flat 10-No. 225824 communiques the spy and to have proposed a kind of method, it is to use the material of the high rigidity carbide that generates Ti, V, Nb, Ta etc. to make generation discharge as electrode, and making the surface decarburization of machined object, the powder electrode that makes more smooth back, surface (pre-treatment) utilize TiH2 to be again make produces discharge and carries out the surface treatment of machined object.The purpose of this pre-treatment is to make the material of coating more closely adhere to the machined object surface in this processing.Again, also disclosed the method for this processing, promptly for same purpose, TiH
2Be that powder electrode carries out earlier pre-treatment and makes discharge energy increase subsequently and utilize this TiH under condition negative polarity, that discharge energy is less
2Powder electrode carry out this processing.
In above-mentioned technology in the past, its characteristics are all to have adopted powder electrode.Because following 3 former aspect practicability existing problems.
The 1st reason is the electrode that is difficult to form practical size.Promptly, for the electrode of practical size in the surface treatment that is formed for metal pattern etc., pressurize function power and owing to pressure when the powder material compression molding makes density heterogeneity, the defective that cracks etc. more in the inhomogeneous transmission of material internal greatly.And its shape of the powdery electrode after the shaping is easy to damage the hard films that is difficult to carry out secondary processing and is formed on the machined object can produce deviation, downgrade.
The 2nd reason is the difficult treatment of electrode with material.That is, Ti and TiH
2Deng the easy oxidation of powder, TiH especially
2Even in air, also can add water decomposition etc. over time, be difficult to handle.And, in a single day, therefore, in the processing of discarded electrode, also have problems owing to put in the water and can hydrogen take place intensely.
The 3rd reason is to be difficult to form thick film.That is, in method in the past, form the thickness of number μ m～tens of μ m at most, can not be configured to the above hard films of this thickness that requires in the industry.
Below, remark additionally for being relevant to the 3rd reason.Normally adopt the physical vapor deposition of drying process and the method that electroless plating is steamed for forming film, and be difficult to form thick film, in present situation, must rely on the molten method of penetrating with these methods.The molten method of penetrating can be thickeied various materials on machined object, and it organizes coarse and can not be applicable in the purposes of necessary precision that the overlay film of metal pattern etc. is such and weather resistance, for the also many restrictions of using of material.
Summary of the invention
The objective of the invention is in order to solve the problem of above-mentioned conventional art, provide a kind of and can be effectively form hard films and when easily forming electrode, can in areal extent arbitrarily, form the thick film of hard films and can be applicable to the discharge surface treating method and the device of various mechanical part of metal pattern, instrument, mechanical part etc. at machined object.
The discharge surface treating method of the present invention the 1st aspect be with the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple being incorporated in combination with periodictable IVa, Va, in the independent or multiple powder that is combined to form of metallic carbide under the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode, according to the characteristic of treated material change base-material to described machined object directly carry out discharging surface when handling electric condition and the hard films that forms carried out the electric condition of discharging surface when handling.
The discharge surface treating method of the present invention the 2nd aspect be with the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in the independent or multiple powder that is combined to form with the metallic carbide under periodictable IVa, Va, the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode, at least once change for the hard films that forms according to the characteristic of treated material and to carry out the electric condition of discharging surface when handling.
The discharge surface treating method of the present invention the 3rd aspect be with the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in periodictable IVa, Va, in the independent or multiple powder that is combined to form of metallic carbide under the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode, change base-material to described machined object according to the characteristic of treated material and directly carry out electric condition and the hard films of formation of discharging surface when handling and carry out the electrical condition of discharging surface when handling, and at least once change for the hard films of described formation according to the characteristic of treated material and to carry out the electrical condition of discharging surface when handling.
The discharge surface treating method of the present invention the 4th aspect is to make in the discharge surface treating method aspect the 1st to be filled with rare gas element between described sintered electrode and described machined object.
The discharge surface treating method of the present invention the 5th aspect is to make in the discharge surface treating method aspect the 2nd to be filled with rare gas element between described sintered electrode and described machined object.
The discharge surface treating method of the present invention the 6th aspect is to make in the discharge surface treating method aspect the present invention the 3rd to be filled with rare gas element between described sintered electrode and described machined object.
The discharge surface treating method of the present invention the 7th aspect is to make described sintered electrode scan for described machined object in the discharge surface treating method aspect the 1st, forms described hard films on described machined object surface.
The discharge surface treating method of the present invention the 8th aspect is to make described sintered electrode scan for described machined object in the discharge surface treating method aspect the 2nd, forms described hard films on described machined object surface.
The discharge surface treating method of the present invention the 9th aspect is to make described sintered electrode scan for described machined object in the discharge surface treating method aspect the 3rd, forms described hard films on described machined object surface.
The apparatus for discharge surface treatment of the present invention the 10th aspect be with the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in periodictable IVa, Va, in the independent or multiple powder that is combined to form of metallic carbide under the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode, and possess characteristic according to treated material and change base-material to described machined object and directly carry out electrical condition and the hard films of the formation switch means of carrying out discharging surface electrical condition when handling of discharging surface when handling.
The apparatus for discharge surface treatment of the present invention the 11st aspect be with the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in the independent or multiple powder that is combined to form with the metallic carbide under periodictable IVa, Va, the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode, and possess characteristic according to treated material and at least once change the switch means of carrying out the electrical condition of discharging surface when handling for the hard films that forms.
The apparatus for discharge surface treatment of the present invention the 12nd aspect be with the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in periodictable IVa, Va, in the independent or multiple powder that is combined to form of metallic carbide under the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode, and possess characteristic according to treated material and change base-material to described machined object and directly carry out electrical condition and the hard films of formation of discharging surface when handling and carry out the 1st switch means of the electrical condition of discharging surface when handling, and possess characteristic according to treated material and at least once change the 2nd switch means of carrying out the electrical condition of discharging surface when handling for the hard films of described formation.
The apparatus for discharge surface treatment of the present invention the 13rd aspect is to possess in the apparatus for discharge surface treatment aspect the 10th to make inert gas filled rare gas element supply mean between described sintered electrode and described machined object.
The apparatus for discharge surface treatment of the present invention the 14th aspect is to possess in the apparatus for discharge surface treatment aspect the 11st to make inert gas filled rare gas element supply mean between described sintered electrode and described machined object.
The apparatus for discharge surface treatment of the present invention the 15th aspect is to possess the inert gas filled inertia supply gas means between described sintered electrode and described machined object that make in the apparatus for discharge surface treatment aspect the 12nd.
The apparatus for discharge surface treatment of the present invention the 16th aspect is to possess X-axis drive unit, Y-axis drive unit and the Z axial brake device that makes that described sintered electrode and described machined object relatively move on directions X, Y direction and Z direction in the apparatus for discharge surface treatment aspect the 10th, utilize described X-axis drive unit, described Y-axis drive unit and described Z axial brake device, make described sintered electrode scan and form described hard films on described machined object surface for described machined object.
The apparatus for discharge surface treatment of the present invention the 17th aspect is to possess X-axis drive unit, Y-axis drive unit and the Z axial brake device that makes that described sintered electrode and described machined object relatively move on directions X, Y direction and Z direction in the apparatus for discharge surface treatment aspect the 11st, utilize described X-axis drive unit, described Y-axis drive unit and described Z axial brake device, make described sintered electrode scan and form described hard films on described machined object surface for described machined object.
The apparatus for discharge surface treatment of the present invention the 18th aspect is to possess X-axis drive unit, Y-axis drive unit and the Z axial brake device that makes that described sintered electrode and described machined object relatively move on directions X, Y direction and Z direction in the apparatus for discharge surface treatment aspect the 12nd, utilize described X-axis drive unit, described Y-axis drive unit and described Z axial brake device, make described sintered electrode scan and form described hard films on described machined object surface for described machined object.
Because the present invention has the structure as above-mentioned, therefore, has following effect.
The discharge surface treating method of the 1st～the 3rd aspect can obtain such effect, can easily form electrode can form the hard films of high adhesion efficiently simultaneously and can be applicable to the various mechanical parts of metal pattern, instrument, mechanical part etc. on machined object discharging surface processing.Again, owing to can then not need to shelter processing to pile up hard films on machined object with the almost equal area of electrode area.
The discharge surface treating method of the present invention the 4th aspect has the more simple effect of the structure of making on the basis of effect aspect the 1st.
The discharge surface treating method of the present invention the 5th aspect has the more simple effect of the structure of making on the basis of effect aspect the 2nd.
The discharge surface treating method of the present invention the 6th aspect has the more simple effect of the structure of making on the basis of effect aspect the 3rd.
The discharge surface treating method of the present invention the 7th aspect also has following effect on the basis of effect aspect the 1st, can enough little shape sintered electrodes scan and process and needn't use the sintered electrode of large-scale specified shape, and can make above-mentioned little shape sintered electrode scanning can cover whole curved surfaces that metal pattern etc. has the machined object of any three-dimensional curve, can be on entire area equally or change thickness according to necessity and form hard films.
The discharge surface treating method of the present invention the 8th aspect also has following effect on the basis of effect aspect the 2nd, can enough little shape sintered electrodes scan and process and needn't use the sintered electrode of large-scale specified shape, and can make above-mentioned little shape sintered electrode scanning can cover whole curved surfaces that metal pattern etc. has the machined object of any three-dimensional curve, can be on entire area equally or change thickness according to necessity and form hard films.
The discharge surface treating method of the present invention the 9th aspect also has following effect on the basis of effect aspect the 3rd, can enough little shape sintered electrodes scan and process and needn't use the sintered electrode of large-scale specified shape, and can make above-mentioned little shape sintered electrode scanning can cover whole curved surfaces that metal pattern etc. has the machined object of any three-dimensional curve, can be on entire area equally or change thickness according to necessity and form hard films.
The discharge surface treating method of the 10th～the 12nd aspect can obtain such effect, can easily form electrode, the while can form the hard films of high adhesion efficiently and can be applicable to the discharging surface processing of the various mechanical parts of metal pattern, instrument, mechanical part etc. on machined object.Again, owing to can then not need to shelter processing to pile up hard films on machined object with the almost equal area of electrode area.
The discharge surface treating method of the present invention the 13rd aspect has the more simple effect of the structure of making on the basis of effect aspect the 10th.
The discharge surface treating method of the present invention the 14th aspect has the more simple effect of the structure of making on the basis of effect aspect the 11st.
The discharge surface treating method of the present invention the 15th aspect has the more simple effect of the structure of making on the basis of effect aspect the 12nd.
The discharge surface treating method of the present invention the 16th aspect also has following effect on the basis of effect aspect the 10th, promptly can use little shape sintered electrode to make to scan and process and needn't use the sintered electrode of the specified shape of big shape, and can make above-mentioned little shape sintered electrode scanning can cover whole curved surfaces that metal pattern etc. has the machined object of any three-dimensional curve, can be on entire area equally or change thickness according to necessity and form hard films.
The discharge surface treating method of the present invention the 17th aspect also has following effect on the basis of effect aspect the 11st, promptly can use little shape sintered electrode to make to scan and process and needn't use the sintered electrode of the specified shape of big shape, and can make above-mentioned little shape sintered electrode scanning can cover whole curved surfaces that metal pattern etc. has the machined object of any three-dimensional curve, can be on entire area equally or change thickness according to necessity and form hard films.
The discharge surface treating method of the present invention the 18th aspect also has following effect on the basis of effect aspect the 12nd, promptly can use little shape sintered electrode to make to scan and process and needn't use the sintered electrode of the specified shape of big shape, and can make above-mentioned little shape sintered electrode scanning can cover whole curved surfaces that metal pattern etc. has the machined object of any three-dimensional curve, can be on entire area equally or change thickness according to necessity and form hard films.
The accompanying drawing summary
Fig. 1 is the discharge surface treating method and the device of expression the invention process form 1.
Fig. 2 represents the discharge surface treating method of the invention process form 1 and the accumulation situation of the hard films that device produces in continuous discharge.
Fig. 3 represents the discharge surface treating method of the invention process form 1 and situation and the discharging current of this moment that device forms thick film.
Fig. 4 represents to change in the discharge surface treating method of the invention process form 1 and the device means of electrical condition.
Fig. 5 is the discharge surface treating method of expression the invention process form 2 and the structural map of device.
Fig. 6 is the discharge surface treating method of expression the invention process form 3 and the structural map of device.
Fig. 7 represents the structural map of discharge surface treating method in the past.
Best example
Example 1
Fig. 1 is the discharge surface treating method of expression the invention process form 1 and the structural map of device.In Fig. 1, the 2nd, machined object, the 3rd, working groove, the 4th, based on the working fluid of insulativity oil or water, the 10th, transmit and use electric motor, the 11st, bolt, the 12nd, sintered electrode, 13 are formed in the hard films on the machined object 2, and the 14th, possess the control device of power supply and control current, voltage.Here, pass on and have such structure, promptly utilize and do not carry out illustrated Controlling System, through transmitting bolt 11 by sintered electrode 12 can be sent to the subtend of machined object 2 to necessary control patterns such as clothes transmission, constant speed transmission with electric motor 10.
Above-mentioned working fluid 4 is based on insulativity oil or water, has the technology that can intactly use the electric discharge device of extensively having popularized under the situation of insulativity oil as working fluid 4 when adopting, and the comparatively simple advantage of structure.When adopting water, then in reaction, produce oxyhydroxide sometimes, for having problems under the situation that requires high-quality film as working fluid again.Yet, if when adopting the no electrolysis power of the current wire electric discharge machine of extensively popularizing, then above-mentioned weak point can be suppressed at inferior limit, though with water as working fluid, also can form in the practicality and the hard films of the oil that uses insulativity as identical proterties under the situation of working fluid.
Secondly, the making method for sintered electrode 12 describes.With the iron family metal powder of Fe, Co, Ni etc. or with machined object with the non-iron family metal powder of sample ingredient (for example, Al powdered alloy etc.) independent or multiple mix in combination under periodictable Iva, Va, the VIa family metallic carbide (for example, WC, TiC, TaC etc.) in the independent or multiple powder that is combined to form, be made into the powder electrode of definite shape by compression molding.Then, adopt vacuum oven etc. and impel that temperature rises gradually in the stove, make powder electrode have the intensity of anti-mechanical workout, but inundue sclerosis makes for example chalk degree (this operation is called the presintering operation) that hardens to.When this state, the iron family metal of Co etc. begins fusion and is filled in the gap of carbide, has promptly made the sosoloid of carbide.Again, the contact part between carbide on the other hand, mutually gradually in conjunction with and sintering temperature is lower, because of not reaching this sintering temperature, and a little less than the combination.The sintered electrode of such presintering operation has been passed through in taking-up, is necessary shape and forms certain size by mechanical workout, and it is used as sintered electrode 12.
The condition of above-mentioned presintering operation is different with electrode materials, and can decide by test in advance.For example, sintering temperature is about 400 ℃～1100 ℃ scope.
In this case, to prevent that mainly pre-sintering temperature from surpassing about 1100 ℃.When surpassing this temperature, electrode meeting overvulcanization and the thermal shocking that in the electrodischarge machining(E.D.M.) of after this carrying out, causes because of arc-over, electrode materials is understood inhomogeneous coming off and produce the unfavorable condition that can not normally supply with between electrode, and influence is formed on the quality of the film on the machined object greatly.
Secondly, the formation method for hard films 13 describes.Make between sintered electrode 12 and machined object 2, intermittently or continuously to produce arc-over, then owing to part between electric arc heat electrode becomes the condition of high temperature.At first, when producing an arc-over, then since this thermal shocking energy on the part of 12 its machined objects 2 of the sintered electrode after presintering, form Powdered when the electrode materials of a part comes off between electrode and discharge.Moment is the high-temperature plasma state more than thousands of ℃ between electrode, and the electrode materials major part is complete fused state.For surface towards the machined object of electrode, on the position that produces arc-over, also carry out instantaneously heating, this surface also becomes molten state with electrode materials the samely.Under this condition of high temperature, electrode materials and machined object after the fusion mix mutually, form the alloy phase of the base-material of electrode materials and machined object on the machined object surface.Then, owing to be present between electrode and working fluid on every side cools off rapidly, from the condition of high temperature to the refrigerative process, the liquid phase of iron family metal takes place to moment and as the sosoloid reaction between surface reaction between the solid phase of carbide or carbide solid phase each other, carry out this sintering in extremely of short duration moment.So, on machined object 2, form hard films.Carry out this operation repeatedly, then As time goes on film is piled up gradually and can be formed thick film.
Fig. 2 represents because the accumulation situation of the hard films that continuous discharge produced can be observed significantly by the folding overlapping situation of piling up of independent discharge hard films separately.
Fig. 3 represents situation and the discharging current of this moment that thick film forms, represented to use Wc-Co as sintered electrode 12, use the situation of steel as machined object 2.Again, Fig. 3 (a) is illustrated in and makes the situation of directly discharging, Fig. 3 (b) be illustrated in to form the situation of discharging that makes again after the hard films 13 on the base-material of machined object 2.According to make the situation of on the base-material of machined object 2, directly discharging and form hard films 13 after make the characteristic of the treated material in the situation of discharging again, change as electrically discharge current value Ip, discharge current pulse width τ p and the stand-by time τ r of condition.According to circumstances also can change polarity of electrode again.This is because different for base-material and formed hard films material, hardness, the electrical condition that changes according to the characteristic that it is directly made it again discharge after polarity discharge on the base-material will and form hard films with treated material, be suitable for the electrical condition of treated material by employing, and can in the processing of shorter time, form the hard films of high adhesion.For so suitable electrical condition of pressing the treated material characteristic, can wait by test in advance and decide, can utilize control device 14 to change according to the treated material characteristic.The switching and the conversion and control of switch 15,16 that for example, can be by pilot circuit shown in Figure 4 change discharge current value Ip, discharge current pulse width τ p, stand-by time τ r.
In above-mentioned, illustrated make that it directly discharges on base-material the time and the formation hard films after change the situation of electrical condition when it is discharged, even and in the process of the thick film that forms hard films, also can change electrical condition according to the characteristic of treated material.
Again, in Fig. 4, having represented to switch the situation of 2 switches, also can be the switch more than 3.Also can utilize variable resistor to change the means that electric current etc. can change electric current again.
And in Fig. 3, the base-material of having represented machined object is the situation of steel, and when the base-material of machined object be under the superhard alloy situation, can use the Ti based material for electrode.According to the various combinations of such treated material and electrode, and change current waveform.
Example 2
Fig. 5 is the discharge surface treating method of this invention process form 2 of expression and the structural map of device, in Fig. 5, the 2nd, machined object, the 12nd, sintered electrode, 13 are formed in the hard films, the 14th on the machined object 2, possess the control device of power supply and control current, voltage.By not carrying out illustrated X-axis drive unit, Y-axis drive unit and Z axial brake device, make sintered electrode 12 and machined object 2 on directions X, Y direction and Z direction, relatively move, on the surface of machined object 2, form hard films 13 simultaneously.For example, when research machined object 2 is metal pattern, then its surface is not for the plane but has the arbitrary surface of 3 D complex, and, make sintered electrode 12 along the arbitrary surface of metal pattern and keeping clearance constant or the servo voltage constant scans simultaneously by above-mentioned X-axis drive unit, Y-axis drive unit and Z axial brake device.At this moment, because consumption of electrode speed is very fast, need be with respect to the additional transmission that consumes, must be correctly and control the motion of Z direction of the main shaft of supporting electrode apace.Repeat above-mentioned action, make electrode constituting the enterprising line scanning of whole curved surfaces of metal pattern, on whole area, can be equally or change thickness as required and make simultaneously and pile up hard films.
Again, make on the base-material of machined object directly discharge will with form when making it to discharge again after the hard films or in the formation process of the thick film of formation hard films, according to the electrical condition of the characteristic changing of treated material, be suitable for the electrical condition of treated material by employing, can in the shorter treatment time, form the hard films of high adhesion.
Example 3
Fig. 6 is the discharge surface treating method of expression the invention process form 3 and the structural map of device, has represented the situation of discharging in the gas.In Fig. 6, the 2nd, machined object, the 10th transmits with electric motor, the 11st, transmits bolt, the 12nd, and sintered electrode, 13 is formed in the hard films, the 14th on the machined object 2, possesses the control device, the 17th of power supply and control current, voltage, gas source, the 18th, path, the 19th, conduit.Gas source 17 is connected with the path 18 that is arranged on sintered electrode 12 inside by pipe arrangement.When the power supply that utilizes control device 14 is switched on, only supply with amount of inert gas such as necessary air capacity or nitrogen by gas source 17.Here, represented between electrode, to spray gas when supplying duct 19 example by the outside supply gas of electrode when electrode interior is not provided with path.The purpose of supply gas is in order to shift out outside the electrode system between the cooling electrode and with remaining electrode materials, and is identical with the effect of above-mentioned working fluid.If do not supply with this gas, then be difficult to stably form the hard films on the machined object.For the gaseous species that uses, need to consider the environment aspect that air or nitrogen are suitable.
Even in such air, carry out under the discharge scenario, after making when discharging on the direct base-material and forming hard films, making when discharging again or forming in the process of thick film of hard films at machined object, change electrical condition and adopt suitable electrical condition by characteristic, thereby can in the shorter time, form the hard films of high adhesion for treated material according to treated material.
Industrial applicability
As mentioned above, discharge surface treating method of the present invention and device are applicable to machined object surface shape Become hard films.
Claims (18)
1. a discharge surface treating method makes to produce discharge and utilize described discharge energy to form hard films on described machined object surface between electrodischarge machining(E.D.M.) is with electrode and machined object, it is characterized in that,
With the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in the powder that the independent or multiple combination of the metallic carbide under periodictable IVa, Va, the VIa family is made, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode
According to the characteristic of treated material change base-material to described machined object directly carry out discharging surface when handling electric condition and the described hard films that forms carried out the electric condition of discharging surface when handling.
2. a discharge surface treating method makes to produce discharge and utilize described discharge energy to form hard films on described machined object surface between electrodischarge machining(E.D.M.) is with electrode and machined object, it is characterized in that,
With the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in the independent or multiple powder that is combined to form with the metallic carbide under periodictable IVa, Va, the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode
At least once change for the hard films that forms according to the characteristic of treated material and to carry out the electrical condition of discharging surface when handling.
3. a discharge surface treating method makes to produce discharge and utilize described discharge energy to form hard films on described machined object surface between electrodischarge machining(E.D.M.) is with electrode and machined object, it is characterized in that,
With the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in the independent or multiple powder that is combined to form with the metallic carbide under periodictable IVa, Va, the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode
According to the characteristic of treated material change base-material to described machined object directly carry out discharging surface when handling electrical condition and the hard films of described formation carried out the electrical condition of discharging surface when handling, and at least once change for the described hard films that forms according to the characteristic of treated material and to carry out the electrical condition of discharging surface when handling.
4. discharge surface treating method as claimed in claim 1 is characterized in that,
Make and between described sintered electrode and described machined object, be filled with rare gas element.
5. discharge surface treating method as claimed in claim 2 is characterized in that,
Make and between described sintered electrode and described machined object, be filled with rare gas element.
6. discharge surface treating method as claimed in claim 3 is characterized in that,
Make and between described sintered electrode and described machined object, be filled with rare gas element.
7. discharge surface treating method as claimed in claim 1 is characterized in that,
Make described sintered electrode scan for described machined object, form described hard films on described machined object surface.
8. discharge surface treating method as claimed in claim 2 is characterized in that,
Make described sintered electrode scan for described machined object, form described hard films on described machined object surface.
9. discharge surface treating method as claimed in claim 2 is characterized in that,
Make described sintered electrode scan for described machined object, form described hard films on described machined object surface.
10. an apparatus for discharge surface treatment makes to produce discharge and utilize described discharge energy to form hard films on described machined object surface between electrodischarge machining(E.D.M.) is with electrode and machined object, it is characterized in that,
With the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination with in the independent or multiple powder that is combined to form of the metallic carbide under periodictable IVa, Va, the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode
Possessing characteristic according to treated material changes base-material to described machined object and directly carries out the electrical condition of discharging surface when handling and the switch means of the described hard films that forms being carried out the electrical condition of discharging surface when handling.
11. an apparatus for discharge surface treatment makes to produce discharge and utilize described discharge energy to form hard films on described machined object surface between electrodischarge machining(E.D.M.) is with electrode and machined object, it is characterized in that,
With the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination with in the independent or multiple powder that is combined to form of the metallic carbide under periodictable IVa, Va, the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode, possess characteristic according to treated material and at least once change the switch means of carrying out the electrical condition of discharging surface when handling for the described hard films that forms.
12. an apparatus for discharge surface treatment makes to produce discharge and utilize described discharge energy to form hard films on described machined object surface between electrodischarge machining(E.D.M.) is with electrode and machined object, it is characterized in that,
With the iron family metal powder or with described machined object with the non-iron family metal powder of sample ingredient independent or multiple mixing in combination in the independent or multiple powder that is combined to form with the metallic carbide under periodictable IVa, Va, the VIa family, after compression molding with the sintered electrode after the presintering as described electrodischarge machining(E.D.M.) electrode
Possess characteristic according to treated material change base-material to described machined object directly carry out discharging surface when handling electrical condition and the hard films of described formation carried out the 1st switch means of the electrical condition of discharging surface when handling, and possess characteristic according to treated material and at least once change the 2nd switch means of carrying out the electrical condition of discharging surface when handling for the described hard films that forms.
13. apparatus for discharge surface treatment as claimed in claim 10 is characterized in that,
Possess and make inert gas filled rare gas element supply mean between described sintered electrode and described machined object.
14. apparatus for discharge surface treatment as claimed in claim 11 is characterized in that,
Possess and make inert gas filled rare gas element supply mean between described sintered electrode and described machined object.
15. apparatus for discharge surface treatment as claimed in claim 12 is characterized in that,
Possess and make inert gas filled rare gas element supply mean between described sintered electrode and described machined object.
16. apparatus for discharge surface treatment as claimed in claim 10 is characterized in that,
Possess the X-axis drive unit, Y-axis drive unit and the Z axial brake device that make that described sintered electrode and described machined object relatively move on directions X, Y direction and Z direction, utilize described X-axis drive unit, described Y-axis drive unit and described Z axial brake device, make described sintered electrode scan and form described hard films on described machined object surface for described machined object.
17. apparatus for discharge surface treatment as claimed in claim 11 is characterized in that,
Possess the X-axis drive unit, Y-axis drive unit and the Z axial brake device that make that described sintered electrode and described machined object relatively move on directions X, Y direction and Z direction, utilize described X-axis drive unit, described Y-axis drive unit and described Z axial brake device, make described sintered electrode scan and form described hard films on described machined object surface for described machined object.
18. apparatus for discharge surface treatment as claimed in claim 12 is characterized in that,
Possess the X-axis drive unit, Y-axis drive unit and the Z axial brake device that make that described sintered electrode and described machined object relatively move on directions X, Y direction and Z direction, utilize described X-axis drive unit, described Y-axis drive unit and described Z axial brake device, make described sintered electrode scan and form described hard films on described machined object surface for described machined object.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1999/000822 WO2000050194A1 (en) | 1999-02-24 | 1999-02-24 | Method and device for discharge surface treatment |
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| Publication Number | Publication Date |
|---|---|
| CN1329531A true CN1329531A (en) | 2002-01-02 |
| CN1126628C CN1126628C (en) | 2003-11-05 |
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|---|---|---|---|
| CN99814043A Expired - Fee Related CN1126628C (en) | 1999-02-24 | 1999-02-24 | Method and device for discharge surface treatment |
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| Country | Link |
|---|---|
| JP (1) | JP5547864B2 (en) |
| CN (1) | CN1126628C (en) |
| CH (1) | CH694246A5 (en) |
| DE (1) | DE19983777T1 (en) |
| TW (1) | TW475005B (en) |
| WO (1) | WO2000050194A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1802453B (en) * | 2003-06-11 | 2010-10-20 | 三菱电机株式会社 | Method of electrical discharge coating |
| CN102317011A (en) * | 2009-02-18 | 2012-01-11 | 株式会社Ihi | Electrode manufacturing method and electric discharge surface treatment used therein |
| CN106312205A (en) * | 2016-10-08 | 2017-01-11 | 大连理工大学 | Method for electrosparking in atmospheric pressure cold plasma jet |
| CN115233215A (en) * | 2022-07-25 | 2022-10-25 | 江苏大学 | Transient heating cladding device and method for large depth-diameter ratio curved hole |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE474946T1 (en) | 2002-07-30 | 2010-08-15 | Mitsubishi Electric Corp | ELECTRODE FOR TREATING SURFACES WITH ELECTRICAL DISCHARGES, METHOD FOR TREATING SURFACES WITH ELECTRICAL DISCHARGES AND DEVICE FOR TREATING SURFACES WITH ELECTRICAL DISCHARGES |
| CN103993312B (en) * | 2013-12-16 | 2016-09-14 | 湖北工业大学 | Rotary body electric spark on surface deposition modified technique and device |
| TWI696544B (en) * | 2016-03-22 | 2020-06-21 | 國立中興大學 | Laminated manufacturing and processing machine |
| KR101874519B1 (en) | 2016-04-26 | 2018-07-04 | 연세대학교 산학협력단 | Apparatus for electrochemical discharge machining and method therefor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5542708A (en) * | 1978-09-13 | 1980-03-26 | Tdk Corp | Electrode for electrolytic lapping |
| JP3297463B2 (en) * | 1992-03-19 | 2002-07-02 | 東芝タンガロイ株式会社 | Electric discharge machine |
| JP3366679B2 (en) * | 1993-03-01 | 2003-01-14 | 日東電工株式会社 | Processing method of organic material |
| JP3363284B2 (en) * | 1995-04-14 | 2003-01-08 | 科学技術振興事業団 | Electrode for electric discharge machining and metal surface treatment method by electric discharge |
| JP3563203B2 (en) * | 1996-06-12 | 2004-09-08 | 独立行政法人 科学技術振興機構 | Surface treatment method by electric discharge machining and its apparatus |
| JP2883581B2 (en) * | 1996-06-17 | 1999-04-19 | 東亜機工株式会社 | Sanitary product manufacturing equipment |
-
1999
- 1999-02-24 JP JP2000600798A patent/JP5547864B2/en not_active Expired - Lifetime
- 1999-02-24 WO PCT/JP1999/000822 patent/WO2000050194A1/en active Application Filing
- 1999-02-24 DE DE19983777T patent/DE19983777T1/en not_active Ceased
- 1999-02-24 CN CN99814043A patent/CN1126628C/en not_active Expired - Fee Related
- 1999-02-24 CH CH01573/01A patent/CH694246A5/en not_active IP Right Cessation
- 1999-03-19 TW TW088104284A patent/TW475005B/en active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1802453B (en) * | 2003-06-11 | 2010-10-20 | 三菱电机株式会社 | Method of electrical discharge coating |
| CN102317011A (en) * | 2009-02-18 | 2012-01-11 | 株式会社Ihi | Electrode manufacturing method and electric discharge surface treatment used therein |
| CN106312205A (en) * | 2016-10-08 | 2017-01-11 | 大连理工大学 | Method for electrosparking in atmospheric pressure cold plasma jet |
| CN106312205B (en) * | 2016-10-08 | 2018-01-16 | 大连理工大学 | Electric discharge machining method in atmosphere cold plasma jet |
| CN115233215A (en) * | 2022-07-25 | 2022-10-25 | 江苏大学 | Transient heating cladding device and method for large depth-diameter ratio curved hole |
| CN115233215B (en) * | 2022-07-25 | 2024-02-13 | 江苏大学 | Transient heating cladding device and method for large-depth-diameter-ratio curved hole |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5547864B2 (en) | 2014-07-16 |
| CH694246A5 (en) | 2004-10-15 |
| DE19983777T1 (en) | 2002-01-31 |
| WO2000050194A1 (en) | 2000-08-31 |
| CN1126628C (en) | 2003-11-05 |
| TW475005B (en) | 2002-02-01 |
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