JPS5542708A - Electrode for electrolytic lapping - Google Patents
Electrode for electrolytic lappingInfo
- Publication number
- JPS5542708A JPS5542708A JP11164878A JP11164878A JPS5542708A JP S5542708 A JPS5542708 A JP S5542708A JP 11164878 A JP11164878 A JP 11164878A JP 11164878 A JP11164878 A JP 11164878A JP S5542708 A JPS5542708 A JP S5542708A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- electrode
- boride
- group
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/10—Electrodes specially adapted therefor or their manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
PURPOSE:To obtain an electrode for electrolytic lapping excellent in the durability and corrosion-proof property, by means of using sintering bodies containing the powder of IV group, V group or a transition element of IV group or boride of lanthanum. CONSTITUTION:A designated electrode is obtained by means of sintering at 700- 1500 deg.C in vacuum from several minutes to several hr., after the press-forming, by means of adding 1-20wt% of the powders of clay minerals of a feldspar etc. a glass frit, or a low melting pt. metal against the powder of a boride on the powder of the boride of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W or La as a binding agent. In a case when a binding agent is not used, a common powder metallurgy forming method is used, and a sintering body is obtained at about 1700-2300 deg.C in vacuum by a hot press.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11164878A JPS5542708A (en) | 1978-09-13 | 1978-09-13 | Electrode for electrolytic lapping |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11164878A JPS5542708A (en) | 1978-09-13 | 1978-09-13 | Electrode for electrolytic lapping |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5542708A true JPS5542708A (en) | 1980-03-26 |
Family
ID=14566638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11164878A Pending JPS5542708A (en) | 1978-09-13 | 1978-09-13 | Electrode for electrolytic lapping |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5542708A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000050194A1 (en) * | 1999-02-24 | 2000-08-31 | Mitsubishi Denki Kabushiki Kaisha | Method and device for discharge surface treatment |
US6929829B2 (en) | 1998-11-13 | 2005-08-16 | Mitsubishi Denki Kabushiki Kaisha | Method and device discharging surface treatment |
-
1978
- 1978-09-13 JP JP11164878A patent/JPS5542708A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6929829B2 (en) | 1998-11-13 | 2005-08-16 | Mitsubishi Denki Kabushiki Kaisha | Method and device discharging surface treatment |
WO2000050194A1 (en) * | 1999-02-24 | 2000-08-31 | Mitsubishi Denki Kabushiki Kaisha | Method and device for discharge surface treatment |
JP5547864B2 (en) * | 1999-02-24 | 2014-07-16 | 三菱電機株式会社 | Discharge surface treatment method and apparatus |
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