CN1322582C - 使用蒸发微冷却的电子学器件和相关方法 - Google Patents

使用蒸发微冷却的电子学器件和相关方法 Download PDF

Info

Publication number
CN1322582C
CN1322582C CNB018221297A CN01822129A CN1322582C CN 1322582 C CN1322582 C CN 1322582C CN B018221297 A CNB018221297 A CN B018221297A CN 01822129 A CN01822129 A CN 01822129A CN 1322582 C CN1322582 C CN 1322582C
Authority
CN
China
Prior art keywords
integrated circuit
pair
electronic device
package
microfluidic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018221297A
Other languages
English (en)
Chinese (zh)
Other versions
CN1502130A (zh
Inventor
查尔斯·M·牛顿
兰迪·T·派克
理查德·A·格斯曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harrier Inc
Original Assignee
Harrier Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harrier Inc filed Critical Harrier Inc
Publication of CN1502130A publication Critical patent/CN1502130A/zh
Application granted granted Critical
Publication of CN1322582C publication Critical patent/CN1322582C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Micromachines (AREA)
CNB018221297A 2000-12-19 2001-12-11 使用蒸发微冷却的电子学器件和相关方法 Expired - Fee Related CN1322582C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/741,772 2000-12-19
US09/741,772 US6459581B1 (en) 2000-12-19 2000-12-19 Electronic device using evaporative micro-cooling and associated methods

Publications (2)

Publication Number Publication Date
CN1502130A CN1502130A (zh) 2004-06-02
CN1322582C true CN1322582C (zh) 2007-06-20

Family

ID=24982125

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018221297A Expired - Fee Related CN1322582C (zh) 2000-12-19 2001-12-11 使用蒸发微冷却的电子学器件和相关方法

Country Status (7)

Country Link
US (1) US6459581B1 (https=)
EP (1) EP1362370A2 (https=)
JP (1) JP2005501392A (https=)
KR (1) KR100553170B1 (https=)
CN (1) CN1322582C (https=)
AU (1) AU2002226065A1 (https=)
WO (1) WO2002050901A2 (https=)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1176496A1 (en) * 2000-07-24 2002-01-30 Hewlett-Packard Company, A Delaware Corporation Voltage regulation in an integrated circuit
US6815739B2 (en) * 2001-05-18 2004-11-09 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
US7032392B2 (en) * 2001-12-19 2006-04-25 Intel Corporation Method and apparatus for cooling an integrated circuit package using a cooling fluid
US6891385B2 (en) * 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US7064953B2 (en) * 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US6673649B1 (en) * 2002-07-05 2004-01-06 Micron Technology, Inc. Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
WO2004036040A1 (en) 2002-09-23 2004-04-29 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US6994151B2 (en) 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US6986382B2 (en) 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7000684B2 (en) 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7156159B2 (en) 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7806168B2 (en) 2002-11-01 2010-10-05 Cooligy Inc Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
TWI295726B (en) 2002-11-01 2008-04-11 Cooligy Inc Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7090001B2 (en) 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US7126822B2 (en) 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
JP3778910B2 (ja) * 2003-12-15 2006-05-24 株式会社ソニー・コンピュータエンタテインメント 電子デバイス冷却装置、電子デバイス冷却方法および電子デバイス冷却制御プログラム
GB0410850D0 (en) * 2004-05-14 2004-06-16 Cambridge Consultants Cooling
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US7188662B2 (en) 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7768619B2 (en) * 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
US7492595B2 (en) * 2005-03-31 2009-02-17 Tecnisco Limited Semiconductor cooling device and stack of semiconductor cooling devices
US7516776B2 (en) * 2005-05-19 2009-04-14 International Business Machines Corporation Microjet module assembly
US7255153B2 (en) * 2005-05-25 2007-08-14 International Business Machines Corporation High performance integrated MLC cooling device for high power density ICS and method for manufacturing
JP5137379B2 (ja) * 2005-11-14 2013-02-06 インターナショナル・ビジネス・マシーンズ・コーポレーション 衝突冷却器
US7272005B2 (en) * 2005-11-30 2007-09-18 International Business Machines Corporation Multi-element heat exchange assemblies and methods of fabrication for a cooling system
US20070126103A1 (en) * 2005-12-01 2007-06-07 Intel Corporation Microelectronic 3-D package defining thermal through vias and method of making same
DE102005058780A1 (de) * 2005-12-09 2007-06-14 Forschungszentrum Karlsruhe Gmbh Mikrowärmeübertrager sowie die Verwendung desselben als Fluidkühler für elektronische Bauteile
US7515415B2 (en) * 2006-02-02 2009-04-07 Sun Microsystems, Inc. Embedded microchannel cooling package for a central processor unit
US7536870B2 (en) * 2006-03-30 2009-05-26 International Business Machines Corporation High power microjet cooler
TW200809477A (en) 2006-03-30 2008-02-16 Cooligy Inc Integrated fluid pump and radiator reservoir
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US7709296B2 (en) * 2006-10-19 2010-05-04 International Business Machines Corporation Coupling metal clad fiber optics for enhanced heat dissipation
KR100906797B1 (ko) * 2007-06-20 2009-07-09 삼성전기주식회사 냉각부를 갖는 광변조기 패키지, 광변조기의 냉각방법 및냉각방법을 수행하기 위한 프로그램이 기록된 기록매체
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
WO2009042232A1 (en) * 2007-09-25 2009-04-02 Flextronics Ap, Llc Thermally enhanced magnetic transformer
US8106505B2 (en) * 2007-10-31 2012-01-31 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
JP5181874B2 (ja) * 2008-06-30 2013-04-10 富士通株式会社 ループヒートパイプおよび電子機器
CN101958297A (zh) * 2009-07-16 2011-01-26 王玉富 阵列柔性焊柱连接蒸发冷却半导体器件封装
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) * 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
WO2013017132A1 (en) * 2011-07-29 2013-02-07 Inmold Biosystems A/S Reactive silicon oxide precursor facilitated anti-corrosion treatment
US8565970B2 (en) * 2011-08-17 2013-10-22 GM Global Technology Operations LLC Method for controlling powertrain pumps
DE102012207196A1 (de) 2012-04-30 2013-10-31 Robert Bosch Gmbh Energiequelle und Verfahren zur Versorgung eines autarken elektrischen Verbrauchersystems und eine Verwendung derselben
US9035452B2 (en) * 2012-08-07 2015-05-19 General Electric Company Electronic device cooling with autonomous fluid routing and method of assembly
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US20160093553A1 (en) * 2014-09-25 2016-03-31 Mani Prakash On demand cooling of an nvm using a peltier device
RU2620732C1 (ru) * 2016-06-27 2017-05-29 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Устройство формирования пристенных капельных течений жидкости в микро- и мини-каналах
CN106409790B (zh) * 2016-08-27 2018-08-28 电子科技大学 一种强效的芯片散热器
IT201600104601A1 (it) 2016-10-18 2018-04-18 Menarini Silicon Biosystems Spa Sistema microfluidico
CN107293496B (zh) * 2017-05-09 2019-09-27 中国电子科技集团公司第五十五研究所 芯片级集成微流体散热模块及制备方法
CN107949242B (zh) * 2017-11-17 2020-08-28 珠海诚然科技服务有限公司 一种环保设备用双排散热器
CN110034082B (zh) * 2018-01-12 2021-01-01 创意电子股份有限公司 具有主动式散热的电子装置
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
WO2020210587A1 (en) 2019-04-10 2020-10-15 Jetcool Technologies, Inc. Thermal management of electronics using co-located microjet nozzles and electronic elements
WO2020214493A1 (en) * 2019-04-14 2020-10-22 Jetcool Technologies, Inc. Direct contact fluid based cooling module
US20210134510A1 (en) * 2019-10-31 2021-05-06 Analog Devices International Unlimited Company Electronic device
US12289871B2 (en) 2020-09-15 2025-04-29 Jetcool Technologies Inc. High temperature electronic device thermal management system
WO2022060898A1 (en) 2020-09-15 2022-03-24 Jetcool Technologies Inc. High temperature electronic device thermal management system
WO2022119698A1 (en) * 2020-12-02 2022-06-09 Danfoss A/S Motor cooling using impingement jets created by perforated cooling jacket
FR3117662B1 (fr) * 2020-12-14 2023-03-03 Valeo Systemes Thermiques Elément de refroidissement pour câble de charge électrique d’un dispositif de stockage d’énergie électrique et procédé de mise en place correspondant.
WO2022159447A1 (en) 2021-01-20 2022-07-28 Jetcool Technologies Inc. Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies
US12048118B2 (en) 2021-08-13 2024-07-23 Jetcool Technologies Inc. Flow-through, hot-spot-targeting immersion cooling assembly
US12315776B2 (en) 2021-11-08 2025-05-27 Analog Devices, Inc. Integrated device package with an integrated heat sink
US12289861B2 (en) 2021-11-12 2025-04-29 Jetcool Technologies Inc. Liquid-in-liquid cooling system for electronic components
TW202407925A (zh) 2022-03-04 2024-02-16 美商捷控技術有限公司 用於電腦處理器及處理器組件之主動冷卻散熱蓋
WO2024091481A1 (en) 2022-10-24 2024-05-02 Jetcool Technologies Inc. Cooling module with integrated pump for immersion cooling in electronics

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023457A (ja) * 1987-12-30 1990-01-09 Ppg Ind Inc ハイブリッド粉体塗装硬化系
US4912600A (en) * 1988-09-07 1990-03-27 Auburn Univ. Of The State Of Alabama Integrated circuit packaging and cooling
US5315239A (en) * 1991-12-16 1994-05-24 Hughes Aircraft Company Circuit module connections
US6007309A (en) * 1995-12-13 1999-12-28 Hartley; Frank T. Micromachined peristaltic pumps
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
FR2157094A5 (https=) * 1971-10-18 1973-06-01 Thomson Csf
FR2580060B1 (https=) * 1985-04-05 1989-06-09 Nec Corp
JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
US5105336A (en) * 1987-07-29 1992-04-14 Lutron Electronics Co., Inc. Modular multilevel electronic cabinet
US5770029A (en) 1996-07-30 1998-06-23 Soane Biosciences Integrated electrophoretic microdevices
SE470347B (sv) 1990-05-10 1994-01-31 Pharmacia Lkb Biotech Mikrostruktur för vätskeflödessystem och förfarande för tillverkning av ett sådant system
JPH0423457A (ja) * 1990-05-18 1992-01-27 Fujitsu Ltd 浸漬冷却装置
US5161089A (en) 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5170319A (en) 1990-06-04 1992-12-08 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
SE9100392D0 (sv) 1991-02-08 1991-02-08 Pharmacia Biosensor Ab A method of producing a sealing means in a microfluidic structure and a microfluidic structure comprising such sealing means
US5237484A (en) * 1991-07-08 1993-08-17 Tandem Computers Incorporated Apparatus for cooling a plurality of electronic modules
JP2500757B2 (ja) 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
US5596228A (en) * 1994-03-10 1997-01-21 Oec Medical Systems, Inc. Apparatus for cooling charge coupled device imaging systems
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5876187A (en) 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
KR0156622B1 (ko) * 1995-04-27 1998-10-15 문정환 반도체 패키지,리드프레임 및 제조방법
BR9608062A (pt) 1995-04-28 1999-11-30 Rosemount Inc Conjunto de montagem para um sensor de pressão em um transmissor de pressão, e, processo para ligar um suporte de um transmissor de pressão.
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US5932940A (en) 1996-07-16 1999-08-03 Massachusetts Institute Of Technology Microturbomachinery
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US5976336A (en) 1997-04-25 1999-11-02 Caliper Technologies Corp. Microfluidic devices incorporating improved channel geometries
US6001231A (en) 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
DE19733455B4 (de) 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung
US5965410A (en) 1997-09-02 1999-10-12 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US5842787A (en) 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
EP0954210A1 (en) * 1998-04-28 1999-11-03 Lucent Technologies Inc. Cooling electronic apparatus
CN1306609C (zh) * 1998-09-18 2007-03-21 三菱电机株式会社 半导体电力变换装置
JP2000252671A (ja) * 1999-02-26 2000-09-14 Sony Corp 冷却装置及び電子機器
US6096656A (en) * 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6205799B1 (en) * 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023457A (ja) * 1987-12-30 1990-01-09 Ppg Ind Inc ハイブリッド粉体塗装硬化系
US4912600A (en) * 1988-09-07 1990-03-27 Auburn Univ. Of The State Of Alabama Integrated circuit packaging and cooling
US5315239A (en) * 1991-12-16 1994-05-24 Hughes Aircraft Company Circuit module connections
US6007309A (en) * 1995-12-13 1999-12-28 Hartley; Frank T. Micromachined peristaltic pumps
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling

Also Published As

Publication number Publication date
AU2002226065A1 (en) 2002-07-01
US20020075651A1 (en) 2002-06-20
JP2005501392A (ja) 2005-01-13
CN1502130A (zh) 2004-06-02
EP1362370A2 (en) 2003-11-19
US6459581B1 (en) 2002-10-01
KR100553170B1 (ko) 2006-02-21
WO2002050901A2 (en) 2002-06-27
WO2002050901A3 (en) 2003-09-12
KR20040014438A (ko) 2004-02-14

Similar Documents

Publication Publication Date Title
CN1322582C (zh) 使用蒸发微冷却的电子学器件和相关方法
EP1378153B1 (en) Electronic module including a cooling substrate and manufacturing method thereof
US7289326B2 (en) Direct contact cooling liquid embedded package for a central processor unit
US7032392B2 (en) Method and apparatus for cooling an integrated circuit package using a cooling fluid
US7027300B2 (en) Compact electronics plenum
US6490160B2 (en) Vapor chamber with integrated pin array
US7327570B2 (en) Fluid cooled integrated circuit module
US6452798B1 (en) Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods
CN116324671A (zh) 用于冷却电路板的元件的冷却装置
AU2002254176A1 (en) Electronic module including a cooling substrate and related methods
US6710442B1 (en) Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
CA2441124C (en) Electronic module with fluid dissociation electrodes and methods
CN101427368A (zh) 电渗透泵和微通道
JPH03211862A (ja) 集積回路基板用ヒート・シンク
KR20040014424A (ko) 열적 향상 미세회로 패키지와 그 제조 방법
WO2005104323A2 (en) Improved microchannel heat sink
TWI580344B (zh) 水冷系統
AU2002306686A1 (en) Electronic module with fluid dissociation electrodes and methods
JP2002026214A (ja) 電子部品冷却装置
CN101051724B (zh) 减热插座
CN223260594U (zh) 液冷封装模块

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070620

Termination date: 20121211