KR100553170B1 - 증발성 미세-쿨링 전자장치 및 그 쿨링 방법 - Google Patents

증발성 미세-쿨링 전자장치 및 그 쿨링 방법 Download PDF

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Publication number
KR100553170B1
KR100553170B1 KR1020037008196A KR20037008196A KR100553170B1 KR 100553170 B1 KR100553170 B1 KR 100553170B1 KR 1020037008196 A KR1020037008196 A KR 1020037008196A KR 20037008196 A KR20037008196 A KR 20037008196A KR 100553170 B1 KR100553170 B1 KR 100553170B1
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South Korea
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micro
integrated circuit
pair
cooling
package
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Korean (ko)
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KR20040014438A (ko
Inventor
뉴튼찰스엠.
파이크랜디티.
가스만리차드에이.
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해리스 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Micromachines (AREA)
KR1020037008196A 2000-12-19 2001-12-11 증발성 미세-쿨링 전자장치 및 그 쿨링 방법 Expired - Lifetime KR100553170B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/741,772 2000-12-19
US09/741,772 US6459581B1 (en) 2000-12-19 2000-12-19 Electronic device using evaporative micro-cooling and associated methods
PCT/US2001/047637 WO2002050901A2 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods

Publications (2)

Publication Number Publication Date
KR20040014438A KR20040014438A (ko) 2004-02-14
KR100553170B1 true KR100553170B1 (ko) 2006-02-21

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KR1020037008196A Expired - Lifetime KR100553170B1 (ko) 2000-12-19 2001-12-11 증발성 미세-쿨링 전자장치 및 그 쿨링 방법

Country Status (7)

Country Link
US (1) US6459581B1 (https=)
EP (1) EP1362370A2 (https=)
JP (1) JP2005501392A (https=)
KR (1) KR100553170B1 (https=)
CN (1) CN1322582C (https=)
AU (1) AU2002226065A1 (https=)
WO (1) WO2002050901A2 (https=)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1176496A1 (en) * 2000-07-24 2002-01-30 Hewlett-Packard Company, A Delaware Corporation Voltage regulation in an integrated circuit
US6815739B2 (en) * 2001-05-18 2004-11-09 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
US7032392B2 (en) * 2001-12-19 2006-04-25 Intel Corporation Method and apparatus for cooling an integrated circuit package using a cooling fluid
US6891385B2 (en) * 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US7064953B2 (en) * 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US6673649B1 (en) * 2002-07-05 2004-01-06 Micron Technology, Inc. Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
WO2004036040A1 (en) 2002-09-23 2004-04-29 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US6994151B2 (en) 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US6986382B2 (en) 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7000684B2 (en) 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7156159B2 (en) 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7806168B2 (en) 2002-11-01 2010-10-05 Cooligy Inc Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
TWI295726B (en) 2002-11-01 2008-04-11 Cooligy Inc Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7090001B2 (en) 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US7126822B2 (en) 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
JP3778910B2 (ja) * 2003-12-15 2006-05-24 株式会社ソニー・コンピュータエンタテインメント 電子デバイス冷却装置、電子デバイス冷却方法および電子デバイス冷却制御プログラム
GB0410850D0 (en) * 2004-05-14 2004-06-16 Cambridge Consultants Cooling
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US7188662B2 (en) 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7768619B2 (en) * 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
US7492595B2 (en) * 2005-03-31 2009-02-17 Tecnisco Limited Semiconductor cooling device and stack of semiconductor cooling devices
US7516776B2 (en) * 2005-05-19 2009-04-14 International Business Machines Corporation Microjet module assembly
US7255153B2 (en) * 2005-05-25 2007-08-14 International Business Machines Corporation High performance integrated MLC cooling device for high power density ICS and method for manufacturing
JP5137379B2 (ja) * 2005-11-14 2013-02-06 インターナショナル・ビジネス・マシーンズ・コーポレーション 衝突冷却器
US7272005B2 (en) * 2005-11-30 2007-09-18 International Business Machines Corporation Multi-element heat exchange assemblies and methods of fabrication for a cooling system
US20070126103A1 (en) * 2005-12-01 2007-06-07 Intel Corporation Microelectronic 3-D package defining thermal through vias and method of making same
DE102005058780A1 (de) * 2005-12-09 2007-06-14 Forschungszentrum Karlsruhe Gmbh Mikrowärmeübertrager sowie die Verwendung desselben als Fluidkühler für elektronische Bauteile
US7515415B2 (en) * 2006-02-02 2009-04-07 Sun Microsystems, Inc. Embedded microchannel cooling package for a central processor unit
US7536870B2 (en) * 2006-03-30 2009-05-26 International Business Machines Corporation High power microjet cooler
TW200809477A (en) 2006-03-30 2008-02-16 Cooligy Inc Integrated fluid pump and radiator reservoir
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US7709296B2 (en) * 2006-10-19 2010-05-04 International Business Machines Corporation Coupling metal clad fiber optics for enhanced heat dissipation
KR100906797B1 (ko) * 2007-06-20 2009-07-09 삼성전기주식회사 냉각부를 갖는 광변조기 패키지, 광변조기의 냉각방법 및냉각방법을 수행하기 위한 프로그램이 기록된 기록매체
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
WO2009042232A1 (en) * 2007-09-25 2009-04-02 Flextronics Ap, Llc Thermally enhanced magnetic transformer
US8106505B2 (en) * 2007-10-31 2012-01-31 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
JP5181874B2 (ja) * 2008-06-30 2013-04-10 富士通株式会社 ループヒートパイプおよび電子機器
CN101958297A (zh) * 2009-07-16 2011-01-26 王玉富 阵列柔性焊柱连接蒸发冷却半导体器件封装
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) * 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
WO2013017132A1 (en) * 2011-07-29 2013-02-07 Inmold Biosystems A/S Reactive silicon oxide precursor facilitated anti-corrosion treatment
US8565970B2 (en) * 2011-08-17 2013-10-22 GM Global Technology Operations LLC Method for controlling powertrain pumps
DE102012207196A1 (de) 2012-04-30 2013-10-31 Robert Bosch Gmbh Energiequelle und Verfahren zur Versorgung eines autarken elektrischen Verbrauchersystems und eine Verwendung derselben
US9035452B2 (en) * 2012-08-07 2015-05-19 General Electric Company Electronic device cooling with autonomous fluid routing and method of assembly
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US20160093553A1 (en) * 2014-09-25 2016-03-31 Mani Prakash On demand cooling of an nvm using a peltier device
RU2620732C1 (ru) * 2016-06-27 2017-05-29 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Устройство формирования пристенных капельных течений жидкости в микро- и мини-каналах
CN106409790B (zh) * 2016-08-27 2018-08-28 电子科技大学 一种强效的芯片散热器
IT201600104601A1 (it) 2016-10-18 2018-04-18 Menarini Silicon Biosystems Spa Sistema microfluidico
CN107293496B (zh) * 2017-05-09 2019-09-27 中国电子科技集团公司第五十五研究所 芯片级集成微流体散热模块及制备方法
CN107949242B (zh) * 2017-11-17 2020-08-28 珠海诚然科技服务有限公司 一种环保设备用双排散热器
CN110034082B (zh) * 2018-01-12 2021-01-01 创意电子股份有限公司 具有主动式散热的电子装置
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
WO2020210587A1 (en) 2019-04-10 2020-10-15 Jetcool Technologies, Inc. Thermal management of electronics using co-located microjet nozzles and electronic elements
WO2020214493A1 (en) * 2019-04-14 2020-10-22 Jetcool Technologies, Inc. Direct contact fluid based cooling module
US20210134510A1 (en) * 2019-10-31 2021-05-06 Analog Devices International Unlimited Company Electronic device
US12289871B2 (en) 2020-09-15 2025-04-29 Jetcool Technologies Inc. High temperature electronic device thermal management system
WO2022060898A1 (en) 2020-09-15 2022-03-24 Jetcool Technologies Inc. High temperature electronic device thermal management system
WO2022119698A1 (en) * 2020-12-02 2022-06-09 Danfoss A/S Motor cooling using impingement jets created by perforated cooling jacket
FR3117662B1 (fr) * 2020-12-14 2023-03-03 Valeo Systemes Thermiques Elément de refroidissement pour câble de charge électrique d’un dispositif de stockage d’énergie électrique et procédé de mise en place correspondant.
WO2022159447A1 (en) 2021-01-20 2022-07-28 Jetcool Technologies Inc. Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies
US12048118B2 (en) 2021-08-13 2024-07-23 Jetcool Technologies Inc. Flow-through, hot-spot-targeting immersion cooling assembly
US12315776B2 (en) 2021-11-08 2025-05-27 Analog Devices, Inc. Integrated device package with an integrated heat sink
US12289861B2 (en) 2021-11-12 2025-04-29 Jetcool Technologies Inc. Liquid-in-liquid cooling system for electronic components
TW202407925A (zh) 2022-03-04 2024-02-16 美商捷控技術有限公司 用於電腦處理器及處理器組件之主動冷卻散熱蓋
WO2024091481A1 (en) 2022-10-24 2024-05-02 Jetcool Technologies Inc. Cooling module with integrated pump for immersion cooling in electronics

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
FR2157094A5 (https=) * 1971-10-18 1973-06-01 Thomson Csf
FR2580060B1 (https=) * 1985-04-05 1989-06-09 Nec Corp
JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
US5105336A (en) * 1987-07-29 1992-04-14 Lutron Electronics Co., Inc. Modular multilevel electronic cabinet
US4889890A (en) * 1987-12-30 1989-12-26 Ppg Industries, Inc. Powder coating curing system containing a beta-hydroxyalkylamide
US4912600A (en) * 1988-09-07 1990-03-27 Auburn Univ. Of The State Of Alabama Integrated circuit packaging and cooling
US5770029A (en) 1996-07-30 1998-06-23 Soane Biosciences Integrated electrophoretic microdevices
SE470347B (sv) 1990-05-10 1994-01-31 Pharmacia Lkb Biotech Mikrostruktur för vätskeflödessystem och förfarande för tillverkning av ett sådant system
JPH0423457A (ja) * 1990-05-18 1992-01-27 Fujitsu Ltd 浸漬冷却装置
US5161089A (en) 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5170319A (en) 1990-06-04 1992-12-08 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
SE9100392D0 (sv) 1991-02-08 1991-02-08 Pharmacia Biosensor Ab A method of producing a sealing means in a microfluidic structure and a microfluidic structure comprising such sealing means
US5237484A (en) * 1991-07-08 1993-08-17 Tandem Computers Incorporated Apparatus for cooling a plurality of electronic modules
US5315239A (en) * 1991-12-16 1994-05-24 Hughes Aircraft Company Circuit module connections
JP2500757B2 (ja) 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
US5596228A (en) * 1994-03-10 1997-01-21 Oec Medical Systems, Inc. Apparatus for cooling charge coupled device imaging systems
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5876187A (en) 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
KR0156622B1 (ko) * 1995-04-27 1998-10-15 문정환 반도체 패키지,리드프레임 및 제조방법
BR9608062A (pt) 1995-04-28 1999-11-30 Rosemount Inc Conjunto de montagem para um sensor de pressão em um transmissor de pressão, e, processo para ligar um suporte de um transmissor de pressão.
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US5932940A (en) 1996-07-16 1999-08-03 Massachusetts Institute Of Technology Microturbomachinery
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US5976336A (en) 1997-04-25 1999-11-02 Caliper Technologies Corp. Microfluidic devices incorporating improved channel geometries
US6001231A (en) 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
DE19733455B4 (de) 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung
US5965410A (en) 1997-09-02 1999-10-12 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US5842787A (en) 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
EP0954210A1 (en) * 1998-04-28 1999-11-03 Lucent Technologies Inc. Cooling electronic apparatus
CN1306609C (zh) * 1998-09-18 2007-03-21 三菱电机株式会社 半导体电力变换装置
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling
JP2000252671A (ja) * 1999-02-26 2000-09-14 Sony Corp 冷却装置及び電子機器
US6096656A (en) * 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6205799B1 (en) * 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system

Also Published As

Publication number Publication date
AU2002226065A1 (en) 2002-07-01
US20020075651A1 (en) 2002-06-20
JP2005501392A (ja) 2005-01-13
CN1502130A (zh) 2004-06-02
CN1322582C (zh) 2007-06-20
EP1362370A2 (en) 2003-11-19
US6459581B1 (en) 2002-10-01
WO2002050901A2 (en) 2002-06-27
WO2002050901A3 (en) 2003-09-12
KR20040014438A (ko) 2004-02-14

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