CN1318971A - 制造印刷电路板的方法 - Google Patents
制造印刷电路板的方法Info
- Publication number
- CN1318971A CN1318971A CN01110113A CN01110113A CN1318971A CN 1318971 A CN1318971 A CN 1318971A CN 01110113 A CN01110113 A CN 01110113A CN 01110113 A CN01110113 A CN 01110113A CN 1318971 A CN1318971 A CN 1318971A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- solder resist
- sinking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19045/2000 | 2000-04-11 | ||
KR10-2000-0019045A KR100509058B1 (ko) | 2000-04-11 | 2000-04-11 | 인쇄회로기판의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1318971A true CN1318971A (zh) | 2001-10-24 |
CN1203734C CN1203734C (zh) | 2005-05-25 |
Family
ID=19663589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB01110113XA Expired - Fee Related CN1203734C (zh) | 2000-04-11 | 2001-03-26 | 制造印刷电路板的方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6631838B2 (zh) |
KR (1) | KR100509058B1 (zh) |
CN (1) | CN1203734C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7518065B2 (en) | 2004-11-04 | 2009-04-14 | Mitsui Mining & Smelting Co., Ltd. | Printed wiring board for plasma display and process for producing the same |
CN101959372A (zh) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | 一种超厚铜线路板阻焊加工方法 |
CN103635285A (zh) * | 2011-06-13 | 2014-03-12 | 千住金属工业株式会社 | 焊膏 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552832B (en) * | 2001-06-07 | 2003-09-11 | Lg Electronics Inc | Hole plugging method for printed circuit boards, and hole plugging device |
JP3831638B2 (ja) * | 2001-08-09 | 2006-10-11 | 三菱重工業株式会社 | 板状体接合方法、接合体、ガスタービン燃焼器用の尾筒、及び、ガスタービン燃焼器 |
US7211289B2 (en) * | 2003-12-18 | 2007-05-01 | Endicott Interconnect Technologies, Inc. | Method of making multilayered printed circuit board with filled conductive holes |
DE102004031878B3 (de) * | 2004-07-01 | 2005-10-06 | Epcos Ag | Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt |
US7293355B2 (en) * | 2005-04-21 | 2007-11-13 | Endicott Interconnect Technologies, Inc. | Apparatus and method for making circuitized substrates in a continuous manner |
US7827682B2 (en) | 2005-04-21 | 2010-11-09 | Endicott Interconnect Technologies, Inc. | Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner |
US7627947B2 (en) * | 2005-04-21 | 2009-12-08 | Endicott Interconnect Technologies, Inc. | Method for making a multilayered circuitized substrate |
US7211470B2 (en) * | 2005-09-01 | 2007-05-01 | Endicott Interconnect Technologies, Inc. | Method and apparatus for depositing conductive paste in circuitized substrate openings |
KR100687914B1 (ko) * | 2006-02-15 | 2007-02-27 | (주)인터플렉스 | 연성인쇄회로기판의 비아홀 인쇄 방법 |
US7952207B2 (en) * | 2007-12-05 | 2011-05-31 | International Business Machines Corporation | Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening |
JP2009194321A (ja) * | 2008-02-18 | 2009-08-27 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、半導体パッケージ |
TWI361170B (en) * | 2008-10-30 | 2012-04-01 | Unimicron Technology Corp | Cover component of micro-mechanical device and fabrication method thereof |
US8289727B2 (en) | 2010-06-11 | 2012-10-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package substrate |
KR101204523B1 (ko) | 2010-11-18 | 2012-11-23 | 삼성전기주식회사 | 지그 |
KR101177779B1 (ko) | 2011-08-08 | 2012-08-30 | 대명전자주식회사 | 인쇄회로기판의 비아홀 막음 방법 및 이에 이용되는 공기정량흡입판 |
WO2016100405A1 (en) * | 2014-12-16 | 2016-06-23 | Amphenol Corporation | High-speed interconnects for printed circuit boards |
FR3069127B1 (fr) * | 2017-07-13 | 2019-07-26 | Safran Electronics & Defense | Carte electronique comprenant des cms brases sur des plages de brasage enterrees |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6097089A (en) * | 1998-01-28 | 2000-08-01 | Mitsubishi Gas Chemical Company, Inc. | Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package |
DE2963050D1 (en) * | 1978-02-17 | 1982-07-29 | Du Pont | Use of photosensitive stratum to create through-hole connections in circuit boards |
JPS556833A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Cirucit board and method of manufacturing same |
US5309632A (en) * | 1988-03-28 | 1994-05-10 | Hitachi Chemical Co., Ltd. | Process for producing printed wiring board |
US5252195A (en) * | 1990-08-20 | 1993-10-12 | Mitsubishi Rayon Company Ltd. | Process for producing a printed wiring board |
JP2920854B2 (ja) * | 1991-08-01 | 1999-07-19 | 富士通株式会社 | ビィアホール構造及びその形成方法 |
US5231751A (en) * | 1991-10-29 | 1993-08-03 | International Business Machines Corporation | Process for thin film interconnect |
US5284548A (en) * | 1993-03-03 | 1994-02-08 | Microelectronics And Computer Technology Corporation | Process for producing electrical circuits with precision surface features |
EP0744884A3 (en) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Method of manufacturing a multilayer printed circuit board |
JPH10117068A (ja) * | 1996-10-14 | 1998-05-06 | Cmk Corp | 導電性シート及び該導電性シートを用いた多層プリント配線板の製造方法 |
US5863447A (en) * | 1997-04-08 | 1999-01-26 | International Business Machines Corporation | Method for providing a selective reference layer isolation technique for the production of printed circuit boards |
US6323436B1 (en) * | 1997-04-08 | 2001-11-27 | International Business Machines Corporation | High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer |
JPH11145592A (ja) * | 1997-11-11 | 1999-05-28 | Sumitomo Metal Smi Electron Devices Inc | 回路基板のスルーホール充填方法 |
US6242078B1 (en) * | 1998-07-28 | 2001-06-05 | Isola Laminate Systems Corp. | High density printed circuit substrate and method of fabrication |
JP2000068640A (ja) * | 1998-08-26 | 2000-03-03 | Harima Chem Inc | 層間接続方法 |
US6276055B1 (en) * | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
US6066889A (en) * | 1998-09-22 | 2000-05-23 | International Business Machines Corporation | Methods of selectively filling apertures |
-
2000
- 2000-04-11 KR KR10-2000-0019045A patent/KR100509058B1/ko not_active IP Right Cessation
-
2001
- 2001-03-26 CN CNB01110113XA patent/CN1203734C/zh not_active Expired - Fee Related
- 2001-04-11 US US09/832,122 patent/US6631838B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7518065B2 (en) | 2004-11-04 | 2009-04-14 | Mitsui Mining & Smelting Co., Ltd. | Printed wiring board for plasma display and process for producing the same |
CN101959372A (zh) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | 一种超厚铜线路板阻焊加工方法 |
CN101959372B (zh) * | 2010-05-24 | 2012-03-14 | 大连太平洋多层线路板有限公司 | 一种超厚铜线路板阻焊加工方法 |
CN103635285A (zh) * | 2011-06-13 | 2014-03-12 | 千住金属工业株式会社 | 焊膏 |
Also Published As
Publication number | Publication date |
---|---|
US6631838B2 (en) | 2003-10-14 |
CN1203734C (zh) | 2005-05-25 |
US20020084314A1 (en) | 2002-07-04 |
KR100509058B1 (ko) | 2005-08-18 |
KR20000058318A (ko) | 2000-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LG INNOTEK CO., LTD. Free format text: FORMER OWNER: LG ELECTRONIC CO., LTD. Effective date: 20100603 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: Seoul, South Kerean Patentee after: LG ELECTRONICS Inc. Address before: Seoul Patentee before: LG Electronics Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100603 Address after: Seoul, South Kerean Patentee after: LG INNOTEK Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG Electronics Inc. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050525 Termination date: 20120326 |