CN1317788C - 电子线路嵌进型电池 - Google Patents

电子线路嵌进型电池 Download PDF

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CN1317788C
CN1317788C CNB2004100455592A CN200410045559A CN1317788C CN 1317788 C CN1317788 C CN 1317788C CN B2004100455592 A CNB2004100455592 A CN B2004100455592A CN 200410045559 A CN200410045559 A CN 200410045559A CN 1317788 C CN1317788 C CN 1317788C
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沈科呈
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Abstract

本发明是一种电子线路嵌进型电池包括:电池单元、控制线路层与封装物。电池单元可以利用印刷电路板制造程序来制造。控制线路层是与电池单元积层堆栈呈密接结构,其至少包含:使用电池单元作为电力来源的电子线路层,以及电气接触层其与电子线路层电气性连接,并且电气接触层具有外露于封装物之外的复数个电接点。封装物用来包围且密封电池单元与控制线路层。

Description

电子线路嵌进型电池
技术领域
本发明是关于一种电池,其特别是关于一种具备嵌进型电子线路与内建自备电力供应源的电池,且该电池能够采用印刷电路板制造程序手段来加以制造。
背景技术
公知嵌进型(Embeded)电子线路的自备电池电力供应方式,其大致分成两类作法:第一类作法是采位于嵌进型(Embeded)电子线路外部的电池,然后再藉由正、负电源线来连接嵌进型(Embeded)电子线路与电池;第二类作法是采与嵌进型电子线路在内部封装一起的电池,并且整体外观是呈现出一体封装的结构,因此从外观上是无法以肉眼看见到位于内部的电池,然而此类嵌进型电子线路的电池电力所采用的电池,本身仍是已具备完好的封装,这种作法与第一类作法在电气性连接方式的差异,仅是将正、负电源线内藏在内部而已。习知此两类作法皆是直接采用现有电池,因此受限于电池的因素,嵌进型电子线路是无法与电池彼此构装成积层堆栈呈一体的结构,此一限制即带给自备电池电力供应的嵌进型(Embeded)电子线路无法进一步将其缩减成更小规模的体积。
本发明的发明人有鉴于上述公知作法的缺点,乃亟思发明改良出一种电子线路嵌进型电池,其将嵌进型电子线路与电池两者构装成积层堆栈呈一体的结构。
发明内容
本发明第一目的是提供一种嵌进型电子线路与内建自备电力供应源的电子线路嵌进型电池。
本发明第二目的是提供一种能够采用印刷电路板制造程序手段来加以制造的电子线路嵌进型电池。
为达成本发明上述目的,本发明是提供一种电子线路嵌进型电池包括:利用印刷电路板制造程序所制造的电池单元;与电池单元积层堆栈呈密接结构的控制线路层,其至少包含:使用电池单元作为电力来源的电子线路层,包含至少一个以上的电子组件;与电子线路层电气性连接且具有复数个电接点的电气接触层,其中复数个电接点是外露于封装物之外;封装物是包围且密封电池单元与控制线路层。
附图说明
图1显示本发明电子线路嵌进型电池的实施例外观图。
图2显示图1实施例的内部构造分解图。
图3显示图1实施例的立体图。
图4显示本发明电池单元的实施例的构造分解图。
图5显示图4实施例的断面图。
图6显示本发明控制线路层的实施例的构造分解图。
图7显示本发明电气接触层的另一实施例。
图8显示本发明的散热薄板其积层堆栈于控制线路层之上的立体图。
图中
10    电子线路嵌进型电池
101   电池单元
101a  盖件
101b  上容纳槽
101c  正极
101d  隔离板
101e  负极
101f  下容纳槽
101g  电解物质
101h  导通孔
103   控制线路层
103a  电子线路层
103b  电气接触层
103c  印刷电路板
105   封装物
107   散热薄板
1031  电接点
1033  电子组件
为使熟悉该项技术人士了解本发明的目的、特征及功效,兹藉由下述具体实施例,并配合所附的图式,对本发明详加说明如后。
具体实施方式
图1显示本发明电子线路嵌进型电池的实施例外观图,图2显示图1实施例的内部构造分解图,以及图3显示图1实施例的立体图。本发明电子线路嵌进型电池10,乃利用封装物105,例如为环氧(化物)树脂(Epoxy)的封装物,来将电池单元101与控制线路层103密封封装在环氧(化物)树脂之内,并且复数个电接点1031是自控制线路层103伸出且外露于外部。本发明的电池单元101与控制线路层103是彼此积层堆栈成一个密接结构,而本发明的电池单元101与控制线路层103皆是利用印刷电路板制造程序来加以制造。控制线路层103所需要的电力(Power),乃是由电池单元101来供应,同时控制线路层103所设置的复数个电接点1031,乃是用来与外部电子装置电气性连接,例如与计算机主机板焊接连接、或者与其它线路板电气性连接。
本发明所采用的制造手段可以是使用高分子树脂或环氧(化物)树脂材料,采用点胶制造程序或黏带(Tapping)制造程序,将电池单元101与控制线路层103密封封装在高分子树脂或环氧(化物)树脂之内,完成后再加热至约40℃~120℃温度中硬化,即可完成外观塑型。上述的制造手段可以采行平面或卷带方式来进行标准化量产,然后再采用印刷、移印或网印等方式加上外观标示,例如正负极标示等。采用高分子树脂作为封装物105的实施手段,主要是具备有下列的优点:
1.高热传导性。
2.高耐热性。
3.耐湿性及耐腐蚀性。
图4显示本发明电池单元的实施例的构造分解图,以及图5显示图4实施例的断面图。电池单元101的具体形态是能够是一次电池,或是二次电池,本发明电池单元101所具备的主要特色,乃是电池单元101是能够利用印刷电路板制造程序来加以制造。电池单元101包括有盖件101a、上容纳槽101b、正极101c、隔离板101d、负极101e、下容纳槽101f以及电解物质101g,而这些构件由上而下依序积层堆栈成一个密接结构。盖件101a、上容纳槽101b、下容纳槽101f皆是采用印刷电路板材质来加以制造而成,所采用的印刷电路板材质例如可以是FR4材质或是软性电路板。在组装本发明的电池单元101时,上容纳槽105与下容纳槽107是用来容纳电解物质101g,以及显示在图4的这些构件,乃可以利用压合、黏合等迭合手段来完成。电解物质101g的选用是依据选用何种的一次电池或者二次电池而定。再者,导通孔101h灌注有导电材料,例如银胶,并且导通孔101h的一端是分别电气性连接正极101c与负极101e,其另一端则是分别电气性连接着控制线路层103。
图6显示本发明控制线路层的实施例的构造分解图。控制线路层103的具体实施手段可采用以多层印刷电路板为基板的线路板,而这基板的材质可以选用FR4材质或选用软性电路板。在图6中,电子线路层103a焊接着至少一个以上的电子组件1033,由该些电子组件1033来形成一个电路,例如形成一个发射器电路,承上述之说明,该些电子组件1033的电力乃是由电池单元101来供应,该些电子组件1033可藉由导通孔101h分别连接着正极101c与负极101e。再者,电子线路层103a是多层印刷电路板位于夹层内层的其中一层,电子线路层103a的上层则覆盖另一层的印刷电路板103c。具有复数个电接点1031的电气接触层103b可以是多层印刷电路板的最外侧的一层,或者是位于夹层内层的其中一层且其向外伸出复数个电接点1031。在图6的电气接触层103b可采以软性印刷电路板为基材的软排线,或者采形成有金手指的印刷电路板。
图7显示本发明电气接触层的另一实施例。电气接触层103b的复数个电接点1031可采以球状门阵列(Ball Grid Arrays)接点,这些球状接点1031外露于封装物105。在图6与第七图的电接点1031皆是电气性连接该些电子组件1033,且作为电子线路嵌进型电池10的引脚(pins),藉此让外部电子装置透过电接点1031来与电子线路层103a彼此间传输电气讯号。
图8显示本发明的散热薄板其积层堆栈于控制线路层之上之立体图。散热薄板107乃积层堆栈于控制线路层103与电池单元101之间,其主要功能是用来将运作中的电池单元101所产生的热量予以散热,散热薄板107的具体实施方式可采用具有复数个镂空散热孔的网状金属薄板,或是采用二氧化硅材质的薄片。
本发明的电子线路嵌进型电池,乃可采用印刷电路板制造程序手段,来将电池与嵌进型电子线路构装成一体,同时嵌进型电子线路完全使用一起构装其内的电池作为电力,因此在完全无需外接电力下,嵌进型电子线路就能运作。
本发明的电子线路嵌进型电池以及所采行用来制造电子线路嵌进型电池的制造手段,乃具备有下列的优点:
1.可制成高密度连接电接点,符合轻、薄、短、小之产品需求。
2.整合性生产制造成本与材料成本低,符合经济效应。
3.电气容易使用与管理,以及容易管理热的产生。
4.可重复取放焊接使用,故维护容易。
5.具较低之线路阻抗,可提升制造程序筛选率。
6.符合各种不同供应电压与供应电流的规格需求。
虽然本发明已以具体实施例揭露如上,然其所揭露的具体实施例并非用以限定本发明,任何熟悉此技术者,在不脱离本发明的精神和范围内,当可作各种的更动与润饰,其所作的更动与润饰皆属于本发明的范畴,本发明的保护范围当视后附的权利要求保护范围所界定者为准。

Claims (16)

1.一种电子线路嵌进型电池,包括:
一利用印刷电路板制造程序所制造的电池单元,其中该电池单元包括:盖件、上容纳槽、正极、隔离板、负极、下容纳槽以及电解物质,且这些构件由上而下依序积层堆叠成一个密接结构;
一与该电池单元积层堆栈呈密接结构的控制线路层,其至少包含:
一使用该电池单元作为电力来源的电子线路层,其包含至少一个以上的电子组件;
一与该电子线路层电气性连接且具有复数个电接点的电气接触层,其中该复数个电接点是外露于一封装物之外;该封装物包围且密封该电池单元与该控制线路层。
2.如权利要求1所述的电子线路嵌进型电池,其中该控制线路层为一多层印刷电路板。
3.如权利要求2所述的电子线路嵌进型电池,其中该电子线路层为该多层印刷电路板的其中一层。
4.如权利要求2所述的电子线路嵌进型电池,其中该电气接触层为该多层印刷电路板的其中一层。
5.如权利要求2所述的电子线路嵌进型电池,其中该控制线路层的基材,是选自于一FR4印刷电路板、一软性电路板。
6.如权利要求1所述的电子线路嵌进型电池,其中该电子组件是一集成电路(IC)。
7.如权利要求1所述的电子线路嵌进型电池,其中该封装物是选自于一环氧(化物)树脂(Epoxy)、高分子树脂。
8.如权利要求1所述的电子线路嵌进型电池,其中该电气接触层为一具有该复数个电接点的软性电路板。
9.如权利要求1所述的电子线路嵌进型电池,其中该电气接触层为一具有该复数个电接点的FR4印刷电路板。
10.如权利要求1所述的电子线路嵌进型电池,其中该电池单元为一二次电池。
11.如权利要求1所述的电子线路嵌进型电池,其中该电池单元为一一次电池。
12.如权利要求1所述的电子线路嵌进型电池,其中该复数个电接点是一球状门阵列(Ball Grid Arrays)接点。
13.如权利要求1所述的电子线路嵌进型电池,其中该复数个电接点是一以软性印刷电路板为基材的软排线。
14.如权利要求1所述的电子线路嵌进型电池,其中该复数个电接点是一以印刷电路板为基材的金手指。
15.如权利要求1所述的电子线路嵌进型电池,进一步包括一散热薄板,其用以对该电池单元所产生的热量进行散热。
16.如权利要求1所述的电子线路嵌进型电池,其中该散热薄板是积层堆栈于该电池单元与该控制线路层之间。
CNB2004100455592A 2004-06-07 2004-06-07 电子线路嵌进型电池 Expired - Fee Related CN1317788C (zh)

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CN101241977B (zh) * 2007-02-07 2011-08-31 财团法人工业技术研究院 电化学元件封装结构
CN108493463B (zh) * 2018-04-18 2020-11-06 东北大学 一种燃料电池元器件及其热布局方法

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US5018051A (en) * 1988-03-31 1991-05-21 Kabushiki Kaisha Toshiba IC card having circuit modules for mounting electronic components
JPH1187879A (ja) * 1997-09-12 1999-03-30 Seiko Epson Corp シート状電子機器
CN1299579A (zh) * 1998-05-28 2001-06-13 罗姆股份有限公司 蓄电池保护电路的电路板、保护电路装置和蓄电池
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CN1484869A (zh) * 2001-09-26 2004-03-24 索尼公司 燃料电池以及使用燃料电池的电子设备

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