CN1311529C - 超声波振动装置及采用该装置的湿式处理装置 - Google Patents

超声波振动装置及采用该装置的湿式处理装置 Download PDF

Info

Publication number
CN1311529C
CN1311529C CNB2004100598331A CN200410059833A CN1311529C CN 1311529 C CN1311529 C CN 1311529C CN B2004100598331 A CNB2004100598331 A CN B2004100598331A CN 200410059833 A CN200410059833 A CN 200410059833A CN 1311529 C CN1311529 C CN 1311529C
Authority
CN
China
Prior art keywords
mentioned
ultrasonic vibration
oscillator
thickness
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100598331A
Other languages
English (en)
Chinese (zh)
Other versions
CN1574239A (zh
Inventor
芳贺宣明
三森健一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of CN1574239A publication Critical patent/CN1574239A/zh
Application granted granted Critical
Publication of CN1311529C publication Critical patent/CN1311529C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/20—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of a vibrating fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB2004100598331A 2003-06-24 2004-06-22 超声波振动装置及采用该装置的湿式处理装置 Expired - Fee Related CN1311529C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003179676 2003-06-24
JP2003179676A JP3984196B2 (ja) 2003-06-24 2003-06-24 超音波振動装置およびこれを用いたウエット処理装置

Publications (2)

Publication Number Publication Date
CN1574239A CN1574239A (zh) 2005-02-02
CN1311529C true CN1311529C (zh) 2007-04-18

Family

ID=34180944

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100598331A Expired - Fee Related CN1311529C (zh) 2003-06-24 2004-06-22 超声波振动装置及采用该装置的湿式处理装置

Country Status (4)

Country Link
JP (1) JP3984196B2 (ko)
KR (1) KR100546425B1 (ko)
CN (1) CN1311529C (ko)
TW (1) TWI289333B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007288289A (ja) * 2006-04-13 2007-11-01 Honda Electronic Co Ltd 超音波振動子及び超音波洗浄機
JP2010029815A (ja) * 2008-07-30 2010-02-12 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
KR100947558B1 (ko) * 2009-10-16 2010-03-12 우시 브라이트스카이 이렉트로닉 컴퍼니 리미티드 밸러스트수 수처리 시스템
KR100986585B1 (ko) * 2010-03-23 2010-10-08 (주) 경일메가소닉 방열몸체를 갖는 초음파 진동자 및 그것을 구비한 초음파 세정장치
JP6763843B2 (ja) 2017-10-25 2020-09-30 株式会社カイジョー 超音波洗浄装置及び超音波洗浄システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119840A (en) * 1986-04-07 1992-06-09 Kaijo Kenki Co., Ltd. Ultrasonic oscillating device and ultrasonic washing apparatus using the same
JPH1094756A (ja) * 1996-07-31 1998-04-14 Kaijo Corp 超音波励振装置及びこれを具備した超音波洗浄装置
JPH10229067A (ja) * 1997-02-14 1998-08-25 Kaijo Corp 基板処理装置
JPH11207258A (ja) * 1998-01-22 1999-08-03 Tadahiro Omi 超音波振動発生装置及び超音波洗浄装置
JP2000296374A (ja) * 1999-04-14 2000-10-24 Kaijo Corp 超音波励振装置及びこれを備えた超音波洗浄装置
CN1404107A (zh) * 2001-09-04 2003-03-19 阿尔卑斯电气株式会社 湿式处理用喷嘴，湿式处理装置及湿式处理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119840A (en) * 1986-04-07 1992-06-09 Kaijo Kenki Co., Ltd. Ultrasonic oscillating device and ultrasonic washing apparatus using the same
JPH1094756A (ja) * 1996-07-31 1998-04-14 Kaijo Corp 超音波励振装置及びこれを具備した超音波洗浄装置
JPH10229067A (ja) * 1997-02-14 1998-08-25 Kaijo Corp 基板処理装置
JPH11207258A (ja) * 1998-01-22 1999-08-03 Tadahiro Omi 超音波振動発生装置及び超音波洗浄装置
JP2000296374A (ja) * 1999-04-14 2000-10-24 Kaijo Corp 超音波励振装置及びこれを備えた超音波洗浄装置
CN1404107A (zh) * 2001-09-04 2003-03-19 阿尔卑斯电气株式会社 湿式处理用喷嘴，湿式处理装置及湿式处理方法

Also Published As

Publication number Publication date
KR20050001351A (ko) 2005-01-06
CN1574239A (zh) 2005-02-02
JP3984196B2 (ja) 2007-10-03
KR100546425B1 (ko) 2006-01-26
TWI289333B (en) 2007-11-01
JP2005013809A (ja) 2005-01-20
TW200509238A (en) 2005-03-01

Similar Documents

Publication Publication Date Title
CN1111900C (zh) 晶片处理装置、晶片处理方法、和半导体衬底制备方法
CN1197823C (zh) 压电陶瓷
CN1153258C (zh) 基片的加工设备、支撑设备、加工及制造方法
CN100343956C (zh) 等离子加工方法和设备及用于等离子加工的托架
CN1163978C (zh) 热电元件的制造方法
CN1187792C (zh) 清洗多孔体的方法
CN1805163A (zh) 压电元件和压电激励器和压电泵及喷墨式记录头
CN1149645C (zh) 多孔区的去除方法和半导体衬底的制造方法
CN1155055C (zh) 清洗剂以及使用它的清洗方法
CN1109636A (zh) 半导体衬底及其制造方法
CN1909215A (zh) 半导体器件
CN1764067A (zh) 压电振动片和压电器件
CN1530231A (zh) 介质膜构成体和利用该介质膜构成体的压电致动器及油墨喷头
CN1267904A (zh) 蚀刻和清洗方法及所用的蚀刻和清洗设备
CN1712333A (zh) 基板翻转装置及方法、基板运送装置及方法、基板处理装置及方法
CN101030538A (zh) 等离子体蚀刻装置和等离子体蚀刻方法
CN1192579A (zh) 晶片处理装置、晶片处理方法和绝缘体上硅晶片制造方法
CN1822328A (zh) 立式分批处理装置
CN1723747A (zh) 线路板部件和使用该线路板部件的复合线路板
CN1990259A (zh) 加热电阻元件、热式打印头、打印机、以及加热电阻元件的制造方法
CN1201256A (zh) 用于半导体散热器的复合材料及其制造方法
CN1917722A (zh) 加热装置
CN1311529C (zh) 超声波振动装置及采用该装置的湿式处理装置
CN1538468A (zh) 叠层陶瓷电容器、叠层陶瓷电容器的安装结构及电容器组件
CN100344451C (zh) 压电喷墨头的驱动方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070418

Termination date: 20120622