TW200509238A - Ultrasonic vibration device and wet processing device using the same - Google Patents

Ultrasonic vibration device and wet processing device using the same

Info

Publication number
TW200509238A
TW200509238A TW093117498A TW93117498A TW200509238A TW 200509238 A TW200509238 A TW 200509238A TW 093117498 A TW093117498 A TW 093117498A TW 93117498 A TW93117498 A TW 93117498A TW 200509238 A TW200509238 A TW 200509238A
Authority
TW
Taiwan
Prior art keywords
ultrasonic vibration
wet processing
vibration
thickness
wavelength
Prior art date
Application number
TW093117498A
Other languages
Chinese (zh)
Other versions
TWI289333B (en
Inventor
Nobuaki Haga
Kenichi Mimori
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of TW200509238A publication Critical patent/TW200509238A/en
Application granted granted Critical
Publication of TWI289333B publication Critical patent/TWI289333B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/20—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of a vibrating fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention provides a ultrasonic vibration device 1 and wet processing device using the same to simplify the manufacturing processes and reduce the cost. The ultrasonic vibration apparatus 1 has a vibration part 5 including a vibration plate 2 composed of a single-layered or multilayered structure, and vibrators 3 fixed to a vibration plate 2 and generating ultrasonic vibration. The thickness of the vibration part 5 is set so that the sum of ratios of the respective thickness of the ultrasonic vibration of each layer of the vibration plate 2 and the vibrators 3 along the propagation direction to the wavelength of the ultrasonic vibration (hereafter called ratio of thickness/wavelength) is integer multiples of 1/2. The vibrator 3 is set to have a thickness with the ratio of thickness/wavelength being the one other than integer multiples of 1/2. The wet processing device is provided with wet processing nozzles having a wet processing body part with an opposing face to a processed object, and the wet processing body part has the ultrasonic vibration device 1.
TW093117498A 2003-06-24 2004-06-17 Ultrasonic vibration device and wet processing device using the same TWI289333B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003179676A JP3984196B2 (en) 2003-06-24 2003-06-24 Ultrasonic vibration device and wet processing device using the same

Publications (2)

Publication Number Publication Date
TW200509238A true TW200509238A (en) 2005-03-01
TWI289333B TWI289333B (en) 2007-11-01

Family

ID=34180944

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117498A TWI289333B (en) 2003-06-24 2004-06-17 Ultrasonic vibration device and wet processing device using the same

Country Status (4)

Country Link
JP (1) JP3984196B2 (en)
KR (1) KR100546425B1 (en)
CN (1) CN1311529C (en)
TW (1) TWI289333B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007288289A (en) * 2006-04-13 2007-11-01 Honda Electronic Co Ltd Ultrasonic transducer and ultrasonic cleaner
JP2010029815A (en) * 2008-07-30 2010-02-12 Hitachi Kokusai Denki Engineering:Kk Ultrasonic washing device
KR100947558B1 (en) * 2009-10-16 2010-03-12 우시 브라이트스카이 이렉트로닉 컴퍼니 리미티드 Water treatment system for ballast water
KR100986585B1 (en) * 2010-03-23 2010-10-08 (주) 경일메가소닉 The ultrasonic oscillator and cleaning apparatus having the same
JP6763843B2 (en) 2017-10-25 2020-09-30 株式会社カイジョー Ultrasonic cleaning equipment and ultrasonic cleaning system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119840A (en) * 1986-04-07 1992-06-09 Kaijo Kenki Co., Ltd. Ultrasonic oscillating device and ultrasonic washing apparatus using the same
JP3734333B2 (en) * 1996-07-31 2006-01-11 株式会社カイジョー Ultrasonic excitation device and ultrasonic cleaning device having the same
JP3374894B2 (en) * 1997-02-14 2003-02-10 株式会社カイジョー Substrate processing equipment
JP3839154B2 (en) * 1998-01-22 2006-11-01 忠弘 大見 Ultrasonic vibration generator and ultrasonic cleaning device
JP3809296B2 (en) * 1999-04-14 2006-08-16 株式会社カイジョー Ultrasonic cleaning equipment
CN1241241C (en) * 2001-09-04 2006-02-08 阿尔卑斯电气株式会社 Spraying nozzle for wet processing, wet processing apparatus and method

Also Published As

Publication number Publication date
TWI289333B (en) 2007-11-01
KR20050001351A (en) 2005-01-06
CN1574239A (en) 2005-02-02
JP2005013809A (en) 2005-01-20
CN1311529C (en) 2007-04-18
JP3984196B2 (en) 2007-10-03
KR100546425B1 (en) 2006-01-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees