CN1310454A - Copper alloy for electronic material - Google Patents
Copper alloy for electronic material Download PDFInfo
- Publication number
- CN1310454A CN1310454A CN01103064A CN01103064A CN1310454A CN 1310454 A CN1310454 A CN 1310454A CN 01103064 A CN01103064 A CN 01103064A CN 01103064 A CN01103064 A CN 01103064A CN 1310454 A CN1310454 A CN 1310454A
- Authority
- CN
- China
- Prior art keywords
- copper alloy
- intensity
- conductivity
- alloy
- electronic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Abstract
Description
Composition (weight %) | Weight ratio | Tensile strength N/mm 2 | Conductance %IACS | Grain size μ m | 90 ° of bendings of bendability | ||||||
????Ni | ???Si | ?????Fe | ??Zr,Cr,Ti,Mo | Accessory ingredient | ????Ni/Si | ||||||
Alloy of the present invention | ??1 | ???2.50 | ??0.55 | ????0.05 | ?????- | ??????- | ?????4.4 | ????680 | ????52 | ????6 | ????○ |
??2 | ???2.83 | ??0.82 | ???0.007 | ?????- | ??????- | ?????3.5 | ????691 | ????47 | ????8 | ????○ | |
??3 | ???3.20 | ??0.57 | ????0.08 | ?????- | ??????- | ?????5.6 | ????674 | ????45 | ????5 | ????○ | |
??4 | ???2.75 | ??0.41 | ????0.04 | ?????- | ??????- | ?????6.7 | ????675 | ????50 | ????6 | ????○ | |
??5 | ???1.63 | ??0.35 | ?????- | ????0.02Zr | ??????- | ?????4.7 | ????618 | ????55 | ????7 | ????○ | |
??6 | ???2.54 | ??0.56 | ?????- | ????0.04Cr | ??????- | ?????4.5 | ????685 | ????49 | ????7 | ????○ | |
??7 | ???2.07 | ??0.41 | ?????- | ????0.03Zr ????0.08Cr | ??????- | ?????5.0 | ????655 | ????53 | ????6 | ????○ | |
??8 | ???8.86 | ??0.58 | ????0.03 | ????0.01Ti | ??????- | ?????5.8 | ????688 | ????41 | ????5 | ????○ | |
??9 | ???1.92 | ??0.44 | ????0.06 | ???0.008Mo | ??????- | ?????4.4 | ????632 | ????55 | ????6 | ????○ | |
??10 | ???2.83 | ??0.80 | ???0.007 | ????0.02Cr | ??????- | ?????3.5 | ????698 | ????44 | ????6 | ????○ | |
??11 | ???2.52 | ??0.57 | ????0.04 | ????0.01Mo | ??????- | ?????4.4 | ????682 | ????50 | ????6 | ????○ | |
??12 | ???2.33 | ??0.69 | ????0.08 | ??????- | ????0.12Mg | ?????3.4 | ????664 | ????52 | ????6 | ????○ | |
??13 | ???2.35 | ??0.64 | ????0.06 | ??????- | ????0.11Zn | ?????3.7 | ????665 | ????50 | ????6 | ????○ | |
??14 | ???2.87 | ??0.68 | ????0.04 | ??????- | ????0.24Sn | ?????3.5 | ????673 | ????48 | ????7 | ????○ | |
??15 | ???2.80 | ??0.89 | ???0.009 | ??????- | ????0.008Bo | ?????8.1 | ????695 | ????48 | ????8 | ????○ | |
??16 | ???2.53 | ??0.56 | ?????- | ????0.04Cr | ????0.13Mg | ?????4.5 | ????687 | ????48 | ????8 | ????○ | |
??17 | ???3.21 | ??0.58 | ?????- | ????0.03Zr | ????0.12Zn | ?????5.5 | ????676 | ????44 | ????6 | ????○ | |
??18 | ???1.71 | ??0.34 | ?????- | ????0.05Zr | ????0.21Sn | ?????5.0 | ????644 | ????51 | ????7 | ????○ | |
??19 | ???1.85 | ??0.46 | ????0.05 | ????0.07Cr | ????0.005P ????0.03Al | ?????4.0 | ????640 | ????56 | ????6 | ????○ | |
??20 | ???2.64 | ??0.60 | ????0.007 | ????0.04Ti | ????0.03Ag ????0.04Mn | ?????4.4 | ????688 | ????52 | ????7 | ????○ | |
Compare alloy | ??1 | ???1.22 | ??0.25 | ????0.08 | ??????- | ??????- | ?????4.9 | ????483 | ????56 | ????7 | ????○ |
??2 | ???4.14 | ??0.53 | ????0.07 | ??????- | ??????- | ?????7.8 | ????654 | ????32 | ????8 | ????○ | |
??3 | ???3.48 | ??1.17 | ????0.06 | ??????- | ??????- | ?????8.0 | ????704 | ????30 | ????8 | ????△ | |
??4 | ???2.53 | ??0.56 | ????0.004 | ??????- | ??????- | ?????4.5 | ????655 | ????51 | Mix crystal grain | ????× | |
??5 | ???2.76 | ??0.51 | ????0.18 | ??????- | ??????- | ?????5.4 | ????670 | ????49 | ????9 | ????× | |
??6 | ???1.92 | ??0.44 | ?????- | ???0.002Mo | ??????- | ?????4.4 | ????622 | ????49 | Mix crystal grain | ????× | |
??7 | ???2.85 | ??0.88 | ?????- | ????0.23Cr | ??????- | ?????3.2 | ????680 | ????47 | ????10 | ????△ | |
??8 | ???2.64 | ??0.60 | ?????- | ????0.18Zr ????0.09Ti | ??????- | ?????4.4 | ????715 | ????41 | ????8 | ????× | |
??9 | ???2.61 | ??0.58 | ????0.08 | ??????- | ?????0.78Al ?????1.43Sn | ?????4.5 | ????690 | ????31 | ????7 | ????○ | |
?10 | ???1.64 | ??0.79 | ????0.07 | ??????- | ???????- | ?????2.1 | ????611 | ????38 | ????8 | ????○ | |
?11 | ???3.22 | ??0.37 | ????0.04 | ??????- | ?????1.52Zn | ?????8.7 | ????633 | ????34 | ????8 | ????○ |
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000018319A JP2001207229A (en) | 2000-01-27 | 2000-01-27 | Copper alloy for electronic material |
JP18319/2000 | 2000-01-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1310454A true CN1310454A (en) | 2001-08-29 |
CN1191590C CN1191590C (en) | 2005-03-02 |
Family
ID=18545183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB01103064XA Expired - Fee Related CN1191590C (en) | 2000-01-27 | 2001-01-22 | Copper alloy for electronic material |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2001207229A (en) |
KR (1) | KR20010077917A (en) |
CN (1) | CN1191590C (en) |
TW (1) | TW500813B (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101775531A (en) * | 2010-04-07 | 2010-07-14 | 朝阳鸿翔冶炼有限公司 | Nickel-molybdenum-copper alloy and preparation method thereof |
CN101270423B (en) * | 2007-03-19 | 2010-10-06 | 日矿金属加工株式会社 | Cu-Ni-Si based copper alloy for electronic material |
CN101268206B (en) * | 2005-09-30 | 2010-12-29 | 古河电气工业株式会社 | Copper alloy for an electric connecting device |
CN101646792B (en) * | 2007-03-30 | 2012-02-22 | Jx日矿日石金属株式会社 | Cu-Ni-Si-based alloy for electronic material |
CN102418004A (en) * | 2011-11-24 | 2012-04-18 | 中铝洛阳铜业有限公司 | Nickel-chromium-silicon-bronze alloy material |
US8519269B2 (en) | 2006-12-28 | 2013-08-27 | Autonetworks Technologies, Ltd. | Conductor of an electric wire, and an insulated wire |
CN103680671A (en) * | 2013-12-14 | 2014-03-26 | 苏州戴尔曼电器有限公司 | Copper and iron nickel alloy cable strong in bending resisting performance |
CN104046841A (en) * | 2013-03-13 | 2014-09-17 | 南京金基合金材料有限公司 | Crystallizer block alloy material |
CN105296797A (en) * | 2015-11-03 | 2016-02-03 | 任静儿 | Tensile copper alloy material |
CN106711721A (en) * | 2016-12-29 | 2017-05-24 | 宁波市胜源技术转移有限公司 | Mobile phone data line |
CN108149121A (en) * | 2017-12-27 | 2018-06-12 | 洛阳神佳窑业有限公司 | A kind of alloy |
CN111128944A (en) * | 2019-12-30 | 2020-05-08 | 南通南平电子科技有限公司 | High-performance capacitor lead frame |
WO2020113352A1 (en) * | 2018-12-06 | 2020-06-11 | 宁波博威合金材料股份有限公司 | High-performance copper alloy and preparation method therefor |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3754011B2 (en) * | 2002-09-04 | 2006-03-08 | デプト株式会社 | Metal material for electronic component, electronic component, electronic device, method for processing metal material, method for manufacturing electronic component, and electro-optical component |
JP3740474B2 (en) * | 2003-03-20 | 2006-02-01 | 日鉱金属加工株式会社 | Titanium copper excellent in conductivity and method for producing the same |
JP2004315940A (en) * | 2003-04-18 | 2004-11-11 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si ALLOY AND ITS PRODUCTION METHOD |
WO2006101172A1 (en) | 2005-03-24 | 2006-09-28 | Nippon Mining & Metals Co., Ltd. | Copper alloy for electronic material |
JP4068626B2 (en) | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same |
JP4754930B2 (en) * | 2005-10-14 | 2011-08-24 | Jx日鉱日石金属株式会社 | Cu-Ni-Si based copper alloy for electronic materials |
KR101049655B1 (en) | 2006-05-26 | 2011-07-14 | 가부시키가이샤 고베 세이코쇼 | Copper alloy with high strength, high conductivity and bendability |
JP4143662B2 (en) | 2006-09-25 | 2008-09-03 | 日鉱金属株式会社 | Cu-Ni-Si alloy |
US7555817B2 (en) | 2006-11-13 | 2009-07-07 | Shin Zu Shing Co., Ltd. | Hinge with less abrasion |
JP4930993B2 (en) * | 2007-01-05 | 2012-05-16 | 住友軽金属工業株式会社 | Copper alloy material, method for producing the same, and electrode member for welding equipment |
KR100878165B1 (en) * | 2007-03-21 | 2009-01-12 | 닛코 킨조쿠 가부시키가이샤 | Copper-nickel-silicon based copper alloy for electronic material, wrought copper and copper alloy using thereof and electronic device part using therof |
CN105274385B (en) * | 2015-11-09 | 2017-04-26 | 昆明贵金属研究所 | Continuously cast high-strength high-conductivity copper alloy |
KR102421870B1 (en) * | 2022-05-19 | 2022-07-19 | 주식회사 풍산 | Cu-Ni-Si-Mn-Sn based Copper alloy material with excellent strength, electrical conductivity and bendability, and method for preparing the same |
-
2000
- 2000-01-27 JP JP2000018319A patent/JP2001207229A/en active Pending
- 2000-11-07 KR KR1020000065758A patent/KR20010077917A/en not_active Application Discontinuation
-
2001
- 2001-01-03 TW TW090100100A patent/TW500813B/en not_active IP Right Cessation
- 2001-01-22 CN CNB01103064XA patent/CN1191590C/en not_active Expired - Fee Related
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101268206B (en) * | 2005-09-30 | 2010-12-29 | 古河电气工业株式会社 | Copper alloy for an electric connecting device |
US8519269B2 (en) | 2006-12-28 | 2013-08-27 | Autonetworks Technologies, Ltd. | Conductor of an electric wire, and an insulated wire |
CN101270423B (en) * | 2007-03-19 | 2010-10-06 | 日矿金属加工株式会社 | Cu-Ni-Si based copper alloy for electronic material |
CN101646792B (en) * | 2007-03-30 | 2012-02-22 | Jx日矿日石金属株式会社 | Cu-Ni-Si-based alloy for electronic material |
CN101775531B (en) * | 2010-04-07 | 2011-06-22 | 朝阳鸿翔冶炼有限公司 | Nickel-molybdenum-copper alloy and preparation method thereof |
CN101775531A (en) * | 2010-04-07 | 2010-07-14 | 朝阳鸿翔冶炼有限公司 | Nickel-molybdenum-copper alloy and preparation method thereof |
CN102418004A (en) * | 2011-11-24 | 2012-04-18 | 中铝洛阳铜业有限公司 | Nickel-chromium-silicon-bronze alloy material |
CN104046841A (en) * | 2013-03-13 | 2014-09-17 | 南京金基合金材料有限公司 | Crystallizer block alloy material |
CN103680671A (en) * | 2013-12-14 | 2014-03-26 | 苏州戴尔曼电器有限公司 | Copper and iron nickel alloy cable strong in bending resisting performance |
CN105296797A (en) * | 2015-11-03 | 2016-02-03 | 任静儿 | Tensile copper alloy material |
CN106711721A (en) * | 2016-12-29 | 2017-05-24 | 宁波市胜源技术转移有限公司 | Mobile phone data line |
CN108149121A (en) * | 2017-12-27 | 2018-06-12 | 洛阳神佳窑业有限公司 | A kind of alloy |
WO2020113352A1 (en) * | 2018-12-06 | 2020-06-11 | 宁波博威合金材料股份有限公司 | High-performance copper alloy and preparation method therefor |
CN111128944A (en) * | 2019-12-30 | 2020-05-08 | 南通南平电子科技有限公司 | High-performance capacitor lead frame |
CN111128944B (en) * | 2019-12-30 | 2021-12-10 | 南通南平电子科技有限公司 | High-performance capacitor lead frame |
Also Published As
Publication number | Publication date |
---|---|
CN1191590C (en) | 2005-03-02 |
JP2001207229A (en) | 2001-07-31 |
KR20010077917A (en) | 2001-08-20 |
TW500813B (en) | 2002-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1191590C (en) | Copper alloy for electronic material | |
KR100876051B1 (en) | Copper alloy sheet for electric and electronic parts with bending workability | |
KR101113356B1 (en) | Copper alloy material, electric and electronic parts, and copper alloy material manufacturing method | |
US8257515B2 (en) | Copper alloy containing cobalt, nickel and silicon | |
JP4660735B2 (en) | Method for producing copper-based alloy sheet | |
KR101570556B1 (en) | Method for Producing Copper Alloy Material for Electrical/Electronic Component | |
KR100968717B1 (en) | ??-??-??-??-?? based copper alloy for electronic material and method for production thereof | |
EP1997920B1 (en) | Copper alloy for electric and electronic equipments | |
JP5448763B2 (en) | Copper alloy material | |
JP3962751B2 (en) | Copper alloy sheet for electric and electronic parts with bending workability | |
US5021105A (en) | Copper alloy for electronic instruments | |
JP2007169765A (en) | Copper alloy and its production method | |
JP3383615B2 (en) | Copper alloy for electronic materials and manufacturing method thereof | |
WO2013161351A1 (en) | Cu-Ni-Si TYPE COPPER ALLOY | |
JP3798260B2 (en) | Copper alloy for electric and electronic parts and electric and electronic parts | |
JP4100629B2 (en) | High strength and high conductivity copper alloy | |
JPH0641660A (en) | Cu alloy steel having fine structure for electric and electronic parts | |
JP2007246931A (en) | Copper alloy for electrical and electronic equipment parts having excellent electric conductivity | |
KR0175968B1 (en) | Copper alloy suited for electrical components and high strength electric conductivity | |
JP4493083B2 (en) | High-performance copper alloy for electronic equipment with excellent strength and conductivity and method for producing the same | |
KR102345805B1 (en) | Cu-Ni-Si-BASED ALLOY STRIP EXCELLENT IN STRENGTH AND BENDING WORKABILITY IN ROLLING PARALLEL DIRECTION AND ROLLING ORTHOGONAL DIRECTION | |
JP3779830B2 (en) | Copper alloy for semiconductor lead frames | |
JP3391492B2 (en) | High-strength, high-conductivity copper alloy for lead materials of semiconductor equipment and conductive spring materials | |
JP2764787B2 (en) | High strength and high conductivity copper alloy for electronic equipment | |
KR20010090780A (en) | A copper alloy with punchability, and a manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NIKKO METAL MFG. CO., LTD. Free format text: FORMER OWNER: NIPPON MINING AND METALS CO., LTD. Effective date: 20050304 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20050304 Address after: Kanagawa Patentee after: Nikko Metal Manufacturing Co.,Ltd. Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co.,Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: NIKKO MATERIALS CO. LTD Free format text: FORMER NAME OR ADDRESS: NIKKO METAL MFG. CO., LTD. Owner name: NIPPON MINING AND METALS CO., LTD. Free format text: FORMER NAME OR ADDRESS: NIKKO MATERIALS CO. LTD |
|
CP03 | Change of name, title or address |
Address after: Tokyo, Japan Patentee after: Nippon Mining & Metals Co.,Ltd. Address before: Tokyo, Japan Patentee before: NIKKO MATERIALS Co.,Ltd. Address after: Tokyo, Japan Patentee after: NIKKO MATERIALS Co.,Ltd. Address before: Kanagawa Patentee before: Nikko Metal Manufacturing Co.,Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORP. Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: JX Nippon Mining & Metals Corp. Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050302 Termination date: 20160122 |
|
EXPY | Termination of patent right or utility model |