CN1308365C - 一种含有硅氧烷结构单元的环氧树脂的制备方法 - Google Patents
一种含有硅氧烷结构单元的环氧树脂的制备方法 Download PDFInfo
- Publication number
- CN1308365C CN1308365C CNB2005100410717A CN200510041071A CN1308365C CN 1308365 C CN1308365 C CN 1308365C CN B2005100410717 A CNB2005100410717 A CN B2005100410717A CN 200510041071 A CN200510041071 A CN 200510041071A CN 1308365 C CN1308365 C CN 1308365C
- Authority
- CN
- China
- Prior art keywords
- chloropropyl
- epoxy
- siloxane
- reaction
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title abstract description 12
- 238000004519 manufacturing process Methods 0.000 title description 5
- -1 chloropropyl silicane Chemical compound 0.000 claims abstract description 72
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000004821 distillation Methods 0.000 claims abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 239000011541 reaction mixture Substances 0.000 claims abstract description 6
- 239000002798 polar solvent Substances 0.000 claims abstract description 5
- 238000007171 acid catalysis Methods 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 59
- 239000011347 resin Substances 0.000 claims description 59
- 239000004593 Epoxy Substances 0.000 claims description 55
- 238000006243 chemical reaction Methods 0.000 claims description 31
- 238000002360 preparation method Methods 0.000 claims description 15
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 14
- 239000000376 reactant Substances 0.000 claims description 6
- 230000035484 reaction time Effects 0.000 claims description 6
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 5
- DTOOTUYZFDDTBD-UHFFFAOYSA-N 3-chloropropylsilane Chemical compound [SiH3]CCCCl DTOOTUYZFDDTBD-UHFFFAOYSA-N 0.000 claims description 4
- YLKYDIRSLGEPQO-UHFFFAOYSA-N [3-chloropropyl(methyl)silyl]oxy-trimethylsilane Chemical class ClCCC[SiH](O[Si](C)(C)C)C YLKYDIRSLGEPQO-UHFFFAOYSA-N 0.000 claims description 3
- 229910017053 inorganic salt Inorganic materials 0.000 claims description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical group COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- 150000001348 alkyl chlorides Chemical class 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 239000003153 chemical reaction reagent Substances 0.000 claims description 2
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical compound O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 16
- 229920000647 polyepoxide Polymers 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 7
- 229920000642 polymer Polymers 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000006837 decompression Effects 0.000 abstract 1
- 238000003786 synthesis reaction Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 17
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 14
- CXBMSGCGKSYSDZ-UHFFFAOYSA-N [Na].OC(CC)(C1=CC=CC=C1)O Chemical compound [Na].OC(CC)(C1=CC=CC=C1)O CXBMSGCGKSYSDZ-UHFFFAOYSA-N 0.000 description 10
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 7
- 229960004643 cupric oxide Drugs 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 5
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000002924 oxiranes Chemical group 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 241000196324 Embryophyta Species 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 241000024287 Areas Species 0.000 description 2
- 235000001018 Hibiscus sabdariffa Nutrition 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 235000005291 Rumex acetosa Nutrition 0.000 description 2
- 240000007001 Rumex acetosella Species 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 235000003513 sheep sorrel Nutrition 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- AOJHDNSYXUZCCE-UHFFFAOYSA-N dimethylsilyloxy(trimethyl)silane Chemical compound C[SiH](C)O[Si](C)(C)C AOJHDNSYXUZCCE-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- DQYBDCGIPTYXML-UHFFFAOYSA-N ethoxyethane;hydrate Chemical compound O.CCOCC DQYBDCGIPTYXML-UHFFFAOYSA-N 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000006462 rearrangement reaction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Silicon Polymers (AREA)
Abstract
Description
应用例1 | 应用例2 | 应用例3 | 应用例4 | 应用例5 | 比较例1 | |
实施例5样(g) | 10 | |||||
实施例8样(g) | 10 | |||||
实施例9样(g) | 10 | |||||
实施例10样(g) | 10 | 8.15 | ||||
E-44(g) | 1.85 | 10 |
PA-651(g) | 2.4 | 3.2 | 2.2 | 1.8 | 2.6 | 6 | |
断裂伸长率(%) | 9.80 | 5.95 | 48.56 | 55.64 | 40.79 | 5.81 | |
拉伸强度(MPa) | 27.00 | 20.36 | 18.60 | 13.92 | 20.58 | 46.40 | |
剪切强度(Mpa) | 铝-铝 | 10.16 | 3.91 | 9.44 | 3.12 | 10.17 | 6.71 |
钢-钢 | 8.92 | 4.49 | 10.44 | 3.47 | 10.79 | 5.16 |
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100410717A CN1308365C (zh) | 2005-07-18 | 2005-07-18 | 一种含有硅氧烷结构单元的环氧树脂的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100410717A CN1308365C (zh) | 2005-07-18 | 2005-07-18 | 一种含有硅氧烷结构单元的环氧树脂的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1712425A CN1712425A (zh) | 2005-12-28 |
CN1308365C true CN1308365C (zh) | 2007-04-04 |
Family
ID=35718238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100410717A Expired - Fee Related CN1308365C (zh) | 2005-07-18 | 2005-07-18 | 一种含有硅氧烷结构单元的环氧树脂的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1308365C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101787132B (zh) * | 2010-03-29 | 2011-12-21 | 中科院广州化学有限公司 | 一种有机硅杂化环氧树脂及其制备方法和应用 |
CN102181059B (zh) * | 2011-05-23 | 2013-03-20 | 南京大学 | 一种含羧基硅氧烷和其组成的耐高温环氧树脂组合物及其制法 |
CN102391297B (zh) * | 2011-08-30 | 2013-11-13 | 华南理工大学 | 侧基带环氧基的聚硅氧烷低聚物及其制备方法 |
CN102690418A (zh) * | 2012-05-25 | 2012-09-26 | 上海富朗化工科技发展有限公司 | 一种有机硅改性环氧树脂及其制备方法 |
CN108841006B (zh) * | 2018-08-20 | 2020-09-29 | 贵阳学院 | 一种具有良好形变回复性能的生物基环氧树脂的制备方法 |
CN109851759B (zh) * | 2018-11-06 | 2022-03-22 | 中国神华能源股份有限公司 | 有机硅改性环氧树脂、其制备方法以及有机硅改性环氧树脂胶黏剂 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0320324A (ja) * | 1989-02-03 | 1991-01-29 | Sumitomo Durez Co Ltd | シリコーン変性エポキシ樹脂 |
CN1108343C (zh) * | 1999-06-30 | 2003-05-14 | 中国科学院化学研究所 | 聚硅氧烷改性环氧树脂组合物 |
CN1560106A (zh) * | 2004-03-10 | 2005-01-05 | 中国科学院广州化学研究所 | 有机硅改性环氧树脂和它的电子封装材料及其制法 |
-
2005
- 2005-07-18 CN CNB2005100410717A patent/CN1308365C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0320324A (ja) * | 1989-02-03 | 1991-01-29 | Sumitomo Durez Co Ltd | シリコーン変性エポキシ樹脂 |
CN1108343C (zh) * | 1999-06-30 | 2003-05-14 | 中国科学院化学研究所 | 聚硅氧烷改性环氧树脂组合物 |
CN1560106A (zh) * | 2004-03-10 | 2005-01-05 | 中国科学院广州化学研究所 | 有机硅改性环氧树脂和它的电子封装材料及其制法 |
Non-Patent Citations (1)
Title |
---|
有机硅高聚物改性环氧树脂的方法与机理 储九荣,高分子通报,第2卷 1999 * |
Also Published As
Publication number | Publication date |
---|---|
CN1712425A (zh) | 2005-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1308365C (zh) | 一种含有硅氧烷结构单元的环氧树脂的制备方法 | |
US5581008A (en) | Branched organosilicon compounds and a method for their preparation | |
JP6011230B2 (ja) | シロキサン系組成物およびその硬化物ならびにその用途 | |
CN110603283B (zh) | 氢化硅烷化可固化的有机硅树脂 | |
CN100500675C (zh) | 多氨基笼型倍半硅氧烷的合成方法 | |
WO2022105249A1 (zh) | 含硅氢的倍半硅氧烷及其相应聚合物的制备方法 | |
KR19990088673A (ko) | 카보실록산덴드리머 | |
US6225247B1 (en) | Polymer precursor composition, crosslinked polymers, thermosets and ceramics made with silyl and siloxyl substituted carboranes with unsaturated organic end groups | |
EP3318593B1 (en) | Heat dissipation material | |
CN102050950A (zh) | 含异三聚氰酸环的末端乙烯基聚硅氧烷 | |
JPH0730093B2 (ja) | シロキサンイミドジオールおよびこれから得られるシロキサンイミド有機ブロックポリマー | |
US7888446B2 (en) | Organopolysiloxanes and method for the production thereof | |
CN100349962C (zh) | 硅氧烷共聚物、其制备方法、和热固性树脂组合物 | |
KR20000057028A (ko) | 카보실록산 덴드리머 | |
JP6642324B2 (ja) | オルガノポリシロキサン化合物およびそれを含有するコーティング用組成物 | |
EP0484120B1 (en) | Hydrogenpolysiloxanes and methods of making them | |
JP6493268B2 (ja) | 主鎖にアリーレン基を有するオルガノポリシロキサンの製造方法 | |
EP0976775B1 (en) | Carbosiloxane dendrimers | |
EP3371244B1 (en) | Method of preparing organosiloxane | |
CN113968973A (zh) | 一种环氧基硅氧烷、环氧基聚硅氧烷-硅橡胶复合物、其制备方法及其用途 | |
CN113336945A (zh) | 一种主链含亚苯基(苯撑)的硅氧烷聚合物及其制备方法 | |
CN1118350A (zh) | 含呋喃基的有机硅化合物 | |
JPS5853655B2 (ja) | エポキシ官能性ポリシロキサン重合体の製法 | |
JP5387524B2 (ja) | オルガノハイドロジェンポリシロキサン及びその製造方法 | |
EP2066734B1 (en) | Diorganopolysiloxane and method of manufacturing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Anhui Lixing Chemical Co.,Ltd. Assignor: Nanjing University Contract record no.: 2011340000163 Denomination of invention: Production of Redix with siloxane structural unit Granted publication date: 20070404 License type: Exclusive License Open date: 20051228 Record date: 20110721 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070404 Termination date: 20170718 |
|
CF01 | Termination of patent right due to non-payment of annual fee |