CN1307024C - 高黏附力无铅焊锡膏 - Google Patents

高黏附力无铅焊锡膏 Download PDF

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Publication number
CN1307024C
CN1307024C CNB2004100231816A CN200410023181A CN1307024C CN 1307024 C CN1307024 C CN 1307024C CN B2004100231816 A CNB2004100231816 A CN B2004100231816A CN 200410023181 A CN200410023181 A CN 200410023181A CN 1307024 C CN1307024 C CN 1307024C
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China
Prior art keywords
acid
quality
resin
solder flux
soldering tin
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Expired - Fee Related
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CNB2004100231816A
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English (en)
Chinese (zh)
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CN1569383A (zh
Inventor
邓和升
于耀强
邓和军
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CHENZHOU GOLD ARROW SOLDER Co Ltd
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Individual
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Priority to CNB2004100231816A priority Critical patent/CN1307024C/zh
Publication of CN1569383A publication Critical patent/CN1569383A/zh
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Publication of CN1307024C publication Critical patent/CN1307024C/zh
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Expired - Fee Related legal-status Critical Current

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CNB2004100231816A 2004-05-09 2004-05-09 高黏附力无铅焊锡膏 Expired - Fee Related CN1307024C (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2004100231816A CN1307024C (zh) 2004-05-09 2004-05-09 高黏附力无铅焊锡膏

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100231816A CN1307024C (zh) 2004-05-09 2004-05-09 高黏附力无铅焊锡膏

Publications (2)

Publication Number Publication Date
CN1569383A CN1569383A (zh) 2005-01-26
CN1307024C true CN1307024C (zh) 2007-03-28

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CNB2004100231816A Expired - Fee Related CN1307024C (zh) 2004-05-09 2004-05-09 高黏附力无铅焊锡膏

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CN (1) CN1307024C (und)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100336626C (zh) * 2005-08-12 2007-09-12 北京工业大学 无铅焊膏用松香型无卤素助焊剂
CN100450700C (zh) * 2006-04-30 2009-01-14 北京市航天焊接材料厂 无铅无卤素锡焊膏及其制备方法
CN100435366C (zh) * 2006-06-08 2008-11-19 天津大学 以纳米银焊膏低温烧结封装连接大功率led的方法
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
CN101197224B (zh) * 2006-12-08 2011-11-16 比亚迪股份有限公司 一种助熔剂及含该助熔剂的温度保险丝
CN100455400C (zh) * 2007-01-16 2009-01-28 大连理工大学 一种SnZn系无铅钎料用助焊剂及其制备方法
CN101204762B (zh) * 2007-12-25 2011-02-16 昆山成利焊锡制造有限公司 铝及铝合金用软钎焊金属置换型无铅焊助焊剂
CN101532130B (zh) * 2009-01-12 2011-09-14 深圳市堃琦鑫华科技有限公司 熔融金属抗氧化还原剂及其制备方法和应用
CN101745760B (zh) * 2008-12-08 2012-07-04 厦门法拉电子股份有限公司 一种用于表贴薄膜电容器焊接的无铅焊料环保助焊剂
JP4920058B2 (ja) * 2009-06-03 2012-04-18 株式会社タムラ製作所 はんだ接合剤組成物
CN101716703B (zh) * 2009-11-30 2012-11-21 南京达迈科技实业有限公司 低银SnAgCuBi系无铅焊锡合金及其制备方法
CN101804532B (zh) * 2010-04-19 2012-01-11 北京达博长城锡焊料有限公司 一种可抗蠕变焊锡膏及制备方法
CN102172805B (zh) * 2011-01-18 2013-01-02 哈尔滨理工大学 一种电子封装用低成本抗老化钎料及其制备方法
BR112014032941A2 (pt) 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
CN102896436B (zh) * 2012-10-10 2014-10-29 常熟市华银焊料有限公司 含Nd、Se和Ga的Sn-Ag-Cu无铅钎料
CN103071944B (zh) * 2013-02-04 2014-12-10 江苏科技大学 一种无卤低飞溅焊锡丝及其制备方法
CN103433643A (zh) * 2013-09-03 2013-12-11 东莞市广臣金属制品有限公司 一种焊锡膏
CN104416298A (zh) * 2013-09-06 2015-03-18 苏州优诺电子材料科技有限公司 一种无卤无铅低温锡膏助焊剂
CN105772979A (zh) * 2016-04-13 2016-07-20 苏州伊飞特电子科技有限公司 一种高助焊剂环保型锡丝及其制备方法
CN105945455A (zh) * 2016-06-29 2016-09-21 沈根来 一种锡焊助焊剂及其制作方法
CN106736047B (zh) * 2017-01-13 2019-02-26 深圳市百佳电子有限公司 多用途复合助焊膏
CN108188616A (zh) * 2017-12-30 2018-06-22 刘滨 一种环保型无卤助焊剂的制备方法
CN109014652A (zh) * 2018-09-26 2018-12-18 深圳市安臣焊锡制品有限公司 一种环保型焊锡材料及其制备工艺
CN109732237A (zh) * 2019-01-02 2019-05-10 昆明理工大学 一种SnBiCuAgNiCe低温无铅焊料合金
CN113441867B (zh) * 2019-03-20 2022-06-14 中山翰华锡业有限公司 一种无卤无铅抗氧化锡膏及其制备方法
JP6795777B1 (ja) * 2020-03-27 2020-12-02 千住金属工業株式会社 洗浄用フラックス及び洗浄用ソルダペースト
CN115070259A (zh) * 2022-07-15 2022-09-20 深圳市同方电子新材料有限公司 一种新型超细焊锡粉的环保无铅焊锡膏

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209374A (zh) * 1997-08-22 1999-03-03 李圣波 低固含量免清洗助焊剂
US20020017337A1 (en) * 2000-04-13 2002-02-14 Sanyogita Arora Soldering flux with cationic surfactant
CN1398698A (zh) * 2001-07-25 2003-02-26 邓和升 免清洗液体助焊剂
CN1404959A (zh) * 2002-10-18 2003-03-26 深圳市唯特偶化工开发实业有限公司 无卤素低固含水基免清洗助焊剂

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209374A (zh) * 1997-08-22 1999-03-03 李圣波 低固含量免清洗助焊剂
US20020017337A1 (en) * 2000-04-13 2002-02-14 Sanyogita Arora Soldering flux with cationic surfactant
CN1398698A (zh) * 2001-07-25 2003-02-26 邓和升 免清洗液体助焊剂
CN1404959A (zh) * 2002-10-18 2003-03-26 深圳市唯特偶化工开发实业有限公司 无卤素低固含水基免清洗助焊剂

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CN1569383A (zh) 2005-01-26

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Patentee before: Deng Hesheng

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