CN1306061C - Planar magnetic sputtering-multi-station film coating apparatus - Google Patents
Planar magnetic sputtering-multi-station film coating apparatus Download PDFInfo
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- CN1306061C CN1306061C CNB2003101108462A CN200310110846A CN1306061C CN 1306061 C CN1306061 C CN 1306061C CN B2003101108462 A CNB2003101108462 A CN B2003101108462A CN 200310110846 A CN200310110846 A CN 200310110846A CN 1306061 C CN1306061 C CN 1306061C
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Abstract
The present invention aims to provide a planar magnetic control sputtering multi-station film coating device, which is composed of a planar magnetic-control sputtering target 14, a work holder 15, a heater 28, an inflating hole 29, a vacuum chamber 30 and a vacuum air exhausting group 32. The planar magnetic control sputtering multi-station film coating device is characterized in that the planar magnetic control sputtering multi-station film coating device is also composed of a rotary disk 16, a connecting rod 17, a pinion gear 18, a pinion gear 19, a connecting rod 20, an autorotation motor 21, a revolution motor 22, a connecting rod 23, a middle gear 24, a connecting rod 25, a big gear 26, a connecting rod 27, etc. The present invention has the characteristics of large workpiece loading capacity (namely multiple stations), good filming evenness, easy popularization and application, etc.
Description
Technical field:
The invention belongs to the electric mechanical technical field, particularly the magnetron sputtering film preparation device in the electric thin technology of preparing.
Background technology:
As everyone knows, the magnetron sputtering film preparation device in the existing electric thin technology of preparing can be realized plated films such as metal, non-metal simple-substance and compound.But the film size that existing planar magnetic control sputtering device is sputtered is less, homogeneity and consistence are relatively poor, is in particular in:
(1) area of the film homogeneous area that sputtered of existing magnetron sputtering equipment is less;
(2) in order to sputter film, need do the size of target very big usually with big homogeneous area;
(3) existing installation also has with public rotation, and as (as shown in Figure 1) such as z195224085.8, though improved the homogeneity of film to a certain extent, their public affairs, rotational velocity are than non-adjustable;
(4) present planar magnetic control sputtering equipment work-piece loading capacity is little, have only a workpiece clamp, and this equipment can load a plurality of workpiece clamp, each workpiece symmetry, thus improved the batch consistence of film greatly.
Summary of the invention:
Task of the present invention is at the existing deficiency of existing plane filming equipment, the planar magnetic control sputtering film coating apparatus that propose a kind of workpiece loading capacity and be greatly multi-work-station, plated film good uniformity, is easy to apply.
A kind of planar magnetic control sputtering provided by the invention-multi-station coating device (as shown in Figure 2), it comprises: the individual plane magnetic controlled sputtering target 14 of M (M is a natural number), the individual workpiece clamp 15 of N (N is a natural number), well heater 28, aeration aperture 29, vacuum film coating chamber 30, vacuum suction group 32 is characterized in that it also comprises: rotating disk 16, union lever 17, pinion(gear) 18, pinion(gear) 19, union lever 20, spinning motor 21, revoluting motor 22, union lever 23, middle gear 24, union lever 25, master wheel 26, union lever 27; M plane magnetic controlled sputtering target 14 is positioned at vacuum film coating chamber bottom 31; Well heater 28 is positioned at vacuum film coating chamber bottom 31; Aeration aperture 29 is positioned on the vacuum film coating chamber bottom 31; Vacuum suction group 32 is arranged at vacuum film coating chamber bottom 31; Rotating disk 16 usefulness union levers 27 are connected with external motor 22; N workpiece clamp 15 be evenly distributed on rotating disk 16 below, pass rotating disk 16 by connecting rod 17 and link together with gear 18, gear 18 is installed in above the rotating disk 16; Pinion(gear) 19 links together by union lever 20 and vacuum film coating chamber 30 external motor 21; Middle gear 24 is fixed in the vacuum film coating chamber 30 by union lever 23, middle gear 24 and pinion(gear) 19 interlocks; Master wheel 26 is fixed together by union lever 25 and middle gear 24.
Principle of work of the present invention is:
(1) rotation principle: external motor 21 drivening rods 20, connecting rod 20 drives pinion(gear) 19 and rotates, middle gear 24 and pinion(gear) 19 interlocks, pinion(gear) drives middle gear 24 and rotates, then middle gear 24 drives master wheel 26 rotations, and master wheel 26 is interlocked with N pinion(gear) 18, and master wheel 26 drives N pinion(gear) 18 rotations, N pinion(gear) drives N workpiece clamp 15 rotations, thereby finished the rotation process;
(2) revolution principle: external motor 22 drives rotating disk 16 by union lever 27 and rotates, and N workpiece clamp 15 and N pinion(gear) 18 are fixed on the rotating disk 16, thus workpiece clamp 15 and pinion(gear) 18 revolution, thus finished the revolution process.
(3) device of the present invention is that the N group substrate of N workpiece clamp 15 is done public affairs, rotation simultaneously, can carry out the plated film sputter to the substrate on N the workpiece clamp like this, so planar magnetic control sputtering provided by the invention-multi-station coating device has the characteristics of workpiece loading capacity big (being multi-work-station).Workpiece clamp 15 and target position and rotation process are as shown in Figure 3.
Working process of the present invention is: N group, by the vacuum suction group, is evacuated coating chamber 30 after vacuum film coating chamber 30 sealings by the sputter substrate workpiece clamp 15 of packing into; Simultaneously, start well heater 28, N is heated by the sputter substrate; Aeration aperture 29 is imported gas in vacuum film coating chamber 30; And drive the N group respectively by rotation of sputter substrate and revolution by the rotating speed of regulating motor 21,22; Start the planar magnetic control sputtering power supply, realize plated film.
Need to prove that the present invention is the planar magnetic control sputtering device, by regulating the rotating speed of spinning motor 21, revoluting motor 22, realize, rotational velocity is adjustable by the public affairs of sputter substrate.
Characteristics of the present invention are:
(1) apparatus of the present invention can realize that the N group is revolved round the sun and rotation by the sputter substrate;
(2) be with existing magnetic control sputtering device difference with public affairs, rotation: the present invention is the planar magnetic control sputtering device, and its public affairs, rotational velocity and public rotation rotating ratio are adjustable, thereby can make substrate realization face scanning substantially, prepares uniform film;
(3) have public affairs, rotation and adjustable-speed, substrate center does not overlap with target center simultaneously, so for same big target, improved the area of sputtered film greatly;
(4) number of the workpiece clamp of apparatus of the present invention is N, once can give many group (N group) substrate spatter film formings simultaneously, and the high conformity of thickness.
Description of drawings
Fig. 1 is the magnetron sputtering film preparation device structural representation in the existing electronic material technology of preparing
Wherein: at the bottom of 1-ring flange, 2-evaporation source, 3-well heater, 4-rotation and revolution mechanism, 5-power wheel, 6-vacuum film coating chamber top, 7-vacuum plating locular wall, 8-workpiece to be plated folder, 9-plane magnetic controlled sputtering target, the 10-vacuum film coating chamber, 11-liner, 12-aeration aperture, 13-vacuum film coating chamber;
Fig. 2 is planar magnetic control sputtering of the present invention-multi-station coating apparatus structure synoptic diagram
Wherein, at the bottom of 14-plane magnetic controlled sputtering target, 15-workpiece clamp, 16-rotating disk, 17-union lever, 18-pinion(gear), 19-pinion(gear), 20-union lever, 21-spinning motor, 22-revoluting motor, 23--union lever, 24-middle gear, 25-union lever, 26-master wheel, 27-union lever, 28-well heater, 29-aeration aperture, 30-vacuum film coating chamber, the 31-vacuum film coating chamber, 32-vacuum suction group;
Fig. 3 is that planar magnetic control sputtering of the present invention-multi-station coating device substrate rotates synoptic diagram
Wherein, 14-plane magnetic controlled sputtering target, 15-workpiece clamp, 18-pinion(gear), 26-master wheel.
Embodiment:
Preparation BST (strontium-barium titanate) film:
Planar magnetic control sputtering of the present invention-multi-station coating device, the number that adopts workpiece clamp is that N=6, target position are M=3, and the diameter of target is 120mm, and the center of target and substrate center are at a distance of 30mm, the rotation of selecting is 5.3 with revolution ratio, and the plated film time is 30 hours.Adopt apparatus of the present invention once to prepare 6 groups of BST (strontium-barium titanate) film, prepared BST (strontium-barium titanate) film thickness is 1 μ m, and the film thickness relative deviation is all less than 3% in the sheet and between sheet.
Claims (2)
1, a kind of planar magnetic control sputtering-multi-station coating device, it comprises: M plane magnetic controlled sputtering target (14), a N workpiece clamp (15), well heater (28), aeration aperture (29), vacuum film coating chamber (30), vacuum suction group (32), wherein M, N are natural number, it is characterized in that it also comprises: rotating disk (16), union lever (17), pinion(gear) (18), pinion(gear) (19), union lever (20), spinning motor (21), revoluting motor (22), union lever (23), middle gear (24), union lever (25), master wheel (26), union lever (27); M plane magnetic controlled sputtering target (14) is positioned at vacuum film coating chamber bottom (31); Well heater (28) is positioned at vacuum film coating chamber bottom (31); Aeration aperture (29) is positioned on the vacuum film coating chamber bottom (31); Vacuum suction group (32) is arranged at vacuum film coating chamber bottom (31); Rotating disk (16) is connected with external motor (22) with union lever (27); N workpiece clamp (15) be evenly distributed on rotating disk (16) below, pass rotating disk (16) and gear (18) by connecting rod (17) and link together, gear (18) is installed in above the rotating disk (16); Pinion(gear) (19) links together by union lever (20) and vacuum film coating chamber (30) external motor (21); Middle gear (24) is fixed in the vacuum film coating chamber (30) by union lever (23), middle gear (24) and pinion(gear) (19) interlock; Master wheel (26) is fixed together by union lever (25) and middle gear (24).
2, a kind of planar magnetic control sputtering according to claim 1-multi-station coating device is characterized in that by regulating spinning motor (21), the realization of revoluting motor (22) rotating speed by the public affairs of sputter substrate, rotational velocity adjusting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101108462A CN1306061C (en) | 2003-11-04 | 2003-11-04 | Planar magnetic sputtering-multi-station film coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101108462A CN1306061C (en) | 2003-11-04 | 2003-11-04 | Planar magnetic sputtering-multi-station film coating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1614078A CN1614078A (en) | 2005-05-11 |
| CN1306061C true CN1306061C (en) | 2007-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2003101108462A Expired - Fee Related CN1306061C (en) | 2003-11-04 | 2003-11-04 | Planar magnetic sputtering-multi-station film coating apparatus |
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| CN (1) | CN1306061C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100447292C (en) * | 2006-12-29 | 2008-12-31 | 上海工程技术大学 | Anti-pollution superhigh vacuum magnetron sputtering film-plating device |
| CN102268652B (en) * | 2010-06-04 | 2014-04-30 | 鸿富锦精密工业（深圳）有限公司 | Film-plating umbrella stand |
| CN104493792B (en) * | 2014-10-29 | 2019-01-22 | 重庆钱珑门业有限责任公司 | Process the station conversion device of interior door |
| CN105671489B (en) * | 2016-03-25 | 2018-08-21 | 沈阳大学 | A kind of device of preparation structure controllable function film |
| CN107699862B (en) * | 2017-11-14 | 2019-06-18 | 沈阳博帅材料科技有限公司 | A kind of rotary body coating clamp |
| CN111185886A (en) * | 2020-03-12 | 2020-05-22 | 宁波双德电子有限公司 | Adjustable operation table for sound production and processing |
| CN112481596B (en) * | 2020-11-27 | 2022-01-14 | 厦门大学 | Workpiece rotating device and ion beam physical vapor deposition device |
| CN115369369A (en) * | 2022-09-28 | 2022-11-22 | 潍坊科技学院 | Workpiece inner curved surface coating mechanism of magnetron sputtering coating machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178299A1 (en) * | 2002-03-14 | 2003-09-25 | Samsung Electronics Co., Ltd. | Rotation-magnetron-in-magnetron (RMIM) electrode, method of manufacturing the RMIM electrode, and sputtering apparatus including the RMIM electrode |
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2003
- 2003-11-04 CN CNB2003101108462A patent/CN1306061C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178299A1 (en) * | 2002-03-14 | 2003-09-25 | Samsung Electronics Co., Ltd. | Rotation-magnetron-in-magnetron (RMIM) electrode, method of manufacturing the RMIM electrode, and sputtering apparatus including the RMIM electrode |
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| CN1614078A (en) | 2005-05-11 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhongshan Kaixuan Vacuum Technology Project Co., Ltd. Assignor: University of Electronic Science and Technology of China Contract fulfillment period: 2007.6.28 to 2012.6.27 contract change Contract record no.: 2008440000525 Denomination of invention: Planar magnetic sputtering-multi-station film coating apparatus Granted publication date: 20070321 License type: Exclusive license Record date: 20081211 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.6.28 TO 2012.6.27; CHANGE OF CONTRACT Name of requester: ZHONGSHAN KAIXUAN VACUUM TECHNOLOGY ENGINEERING CO Effective date: 20081211 |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070321 Termination date: 20091204 |