CN211734462U - Curved surface screen magnetron sputtering subassembly - Google Patents
Curved surface screen magnetron sputtering subassembly Download PDFInfo
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- CN211734462U CN211734462U CN201922198954.9U CN201922198954U CN211734462U CN 211734462 U CN211734462 U CN 211734462U CN 201922198954 U CN201922198954 U CN 201922198954U CN 211734462 U CN211734462 U CN 211734462U
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Abstract
The utility model provides a curved surface screen magnetron sputtering subassembly, including public rotation parachute kit revolving rack and multiunit negative pole subassembly, multiunit negative pole subassembly and public rotation parachute kit revolving rack contactless, the circumference distribution of multiunit negative pole subassembly along public rotation parachute kit revolving rack, every group negative pole subassembly includes two cathode device, every cathode device includes the bar magnet, the magnetic field direction of two bar magnets of every group negative pole subassembly is adjustable, public rotation parachute kit revolving rack includes that rotation rack and multiunit are used for loading the public rotation rack of substrate, but rotation rack is around the setting of its center pin rotation, but the installation of public rotation rack rotation is on rotation rack, it winds to drive the public frame of multiunit during rotation rack rotation the center pin revolution. The utility model discloses the substrate frame drives the revolution simultaneously of substrate rotation, and the setting with adjustable the magnetic field direction of two bar magnets of every group negative pole subassembly, sputter deposit is more even.
Description
Technical Field
The utility model relates to a coating film production technical field specifically is a curved surface screen magnetron sputtering subassembly.
Background
Magnetron sputtering means that electrons collide with argon atoms in the process of flying to a substrate under the action of an electric field, so that the electrons are ionized to generate Ar positive ions and new electrons; new electrons fly to the substrate, Ar ions are accelerated to fly to the cathode target under the action of an electric field and bombard the surface of the target at high energy, so that the target is sputtered, and neutral target atoms or molecules in sputtered particles are deposited on the substrate to form a film.
When twin targets are adopted in the existing magnetron sputtering process, as shown in fig. 1, the magnetic field directions C of the two corresponding sets of magnetic rods are parallel, as shown in fig. 1, the sputtered particles generated thereby fly to the substrate in parallel, and the twin targets of this type are twin parallel twin targets, are suitable for planar substrates, and can enable the sputtered particles to be uniformly deposited on the planar substrates. However, for curved substrates such as curved cell phone screens, the twin parallel twin targets do not allow uniform deposition of sputtered particles on the substrate.
In addition, for the prior umbrella rotating frame or revolution substrate frame, the substrate frame rotates in a revolution mode to drive the substrate to rotate in a revolution mode, and for the curved substrate, the deviation of the magnetic field intensity of each part of the curved substrate is large along with the revolution, so that the deposition of sputtering particles is uneven.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, the utility model aims to provide a curved surface screen magnetron sputtering component, a substrate frame drives a substrate to rotate and revolve at the same time, so that the revolution number of the substrate rotating and the number of layers to be coated are far greater than the corresponding parameters of the substrate when only revolving under the condition that other conditions are the same, and the thickness of each layer of deposited film of the substrate is less than that of the substrate when only revolving; the magnetic field directions of the two magnetic rods of each group of cathode assemblies are arranged in an adjustable manner, so that the curved surface substrate can receive sputtering particles in a larger range in revolution at each angle, and sputtering deposition is more uniform.
In order to realize the purpose, the utility model discloses the technical scheme who adopts is:
including revolution and rotation parachute kit revolving rack, multiunit negative pole subassembly and at least a set of belt cleaning device, multiunit negative pole subassembly and revolution and rotation parachute kit revolving rack contactless, multiunit negative pole subassembly and belt cleaning device distribute along the circumference of revolution and rotation parachute kit revolving rack, every group negative pole subassembly includes two negative pole devices, every negative pole device includes the bar magnet, the magnetic field direction of two bar magnets of every group negative pole subassembly is adjustable, revolution and rotation parachute kit revolving rack includes the revolution and rotation revolving rack that the multiunit is used for loading the substrate, but the setting of rotation frame around its center pin rotation, but installing on the revolving rack of revolution and rotation frame rotation, it winds to drive multiunit revolution and rotation frame revolution center pin rotation during the rotation of rotation frame
The further improvement of the technical scheme is as follows:
the included angle of the magnetic field directions of the two magnetic rods of each group of cathode assemblies towards one side of the substrate frame is alpha, alpha is more than 0 degree and less than 180 degrees, and the size of the included angle alpha can be adjusted.
The rotation frame comprises a first rotation disc, a second rotation disc and a plurality of connecting rods, the first rotation disc and the second rotation disc are arranged in parallel at intervals and are perpendicular to the central shaft, the connecting rods are located between the first rotation disc and the second rotation disc, and two ends of the connecting rods are respectively and perpendicularly connected with the first rotation disc and the second rotation disc.
The first self-rotating disc comprises a circular ring and a plurality of radiation rods, and the circular ring and the plurality of radiation rods are connected to form a hub-shaped structure.
The radiation rods are symmetrically arranged relative to the center line of the circular ring, the radiation rods and the circular ring are located in the same plane, the radiation rods are rod-shaped, one end of each radiation rod is connected with the center of the circular ring, and the other end of each radiation rod is connected with the circular ring.
The connecting rods are symmetrically arranged relative to the central shaft, the number of the connecting rods is consistent with that of the radiation rods, one end of each connecting rod is connected with one radiation rod, and the other end of each connecting rod is connected with the second self-rotating disc.
The revolution and rotation frame comprises a substrate frame and a revolution and rotation shaft, the substrate frame is arranged on the revolution frame through the revolution and rotation shaft, and the substrate frame can rotate around the revolution and rotation shaft.
The multiple groups of public rotation shafts are symmetrically arranged relative to the central shaft, and the public rotation shafts are parallel to the central shaft.
The substrate frame is a cylinder, and the central line of the substrate frame is superposed with the public rotation shaft.
One end of the revolution axis is connected with the ring, and the other end is connected with the second self-rotation disc.
The sputtering component further comprises a driving device, the driving device comprises a driving motor, a driving gear and a rotating base, the driving gear is fixedly sleeved outside a driving shaft of the driving motor, the rotating base is annular, the rotating base is located below the second self-rotating disc and parallel to the first self-rotating disc, the central line of the rotating base coincides with the central shaft, the rotating base is fixedly connected to the bottom of the self-rotating frame, the bottom of the rotating base is slidably arranged on an annular track, a circle of gear teeth are arranged on the inner circle of the annular rotating base along the circumferential direction, and the driving gear is meshed with the gear teeth on the inner circle of the rotating base.
The driving device further comprises a plurality of revolution and rotation gears, the revolution and rotation gears are parallel to the first rotation disc, one end of each revolution and rotation shaft, which extends out of the second rotation disc, is fixedly sleeved with one revolution and rotation gear, the rotating base is positioned inside a circle formed by the revolution and rotation gears in a surrounding mode, and the revolution and rotation gears are meshed with gears on the outer ring of the rotating base.
Compared with the prior art, the beneficial effects of the utility model are that: the substrate frame drives the substrate to rotate and revolve at the same time, so that the rotating speed of the substrate and the number of layers of the coated film are far greater than corresponding parameters of the substrate only revolving under the condition of the same other conditions, and the thickness of the film deposited on each layer of the substrate is smaller than that of the film deposited on the substrate only revolving; in addition, the magnetic field directions of the two magnetic rods of each group of cathode assemblies are arranged in an adjustable manner, so that the curved-surface substrate can receive sputtering particles in a larger range in revolution at each angle, and sputtering deposition is more uniform; the driving device only needs one motor, and simultaneously drives the rotation of the rotating frame and the revolution and rotation of the substrate frame through the meshing of the rotating base, so that the operation is stable and accurate, the structure is simple, and the cost is low.
Drawings
FIG. 1 is a schematic view of the magnetic field directions of twin parallel twin targets;
fig. 2 is a schematic structural diagram of an embodiment of the present invention;
FIG. 3 is a schematic view of a cathode assembly according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a cathode device;
fig. 5 is a schematic view of the magnetic field direction of a cathode assembly according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a revolution and rotation umbrella rotating stand according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of a rotation frame of a revolution and rotation umbrella according to an embodiment of the present invention;
FIG. 8 is an enlarged view of the structure at A in FIG. 7;
fig. 9 is a bottom schematic view of the structure according to an embodiment of the present invention.
Detailed Description
The following provides a detailed and complete description of the curved-surface screen magnetron sputtering component according to the present invention. The following description of the embodiments is merely exemplary in nature and is in no way intended to limit the invention.
A magnetron sputtering component of a curved screen is shown in figures 2-9 and comprises a revolution and rotation umbrella rotating frame 1 and a plurality of groups of cathode components 2, wherein the rotation umbrella rotating frame 1 and the plurality of groups of cathode components 2 are installed in coating chambers in corresponding coating boxes, each coating box is provided with a door body 3 for opening or closing the coating chamber, and the wall of each coating box is further provided with a molecular pump for performing vacuum pumping operation in the coating chamber so as to facilitate subsequent vacuum coating operation. The above-mentioned vacuum-pumping operation can adopt the existing vacuum-pumping technology known to those skilled in the art, and does not affect the technical solution claimed herein, and is not described herein again.
The multiple groups of cathode assemblies 2 are not in contact with the revolution and rotation umbrella rotating frame 1, and the multiple groups of cathode assemblies 2 are distributed along the circumferential direction of the revolution and rotation umbrella rotating frame 1. The preferred, including five groups of negative pole subassemblies 2, wherein install a set of negative pole subassembly 2 on the door body, still install a set of belt cleaning device 4 on the door body 3, the preferred, belt cleaning device 4 is the plasma cleaning machine, and the plasma cleaning machine is used for wasing the substrate to guarantee the cleanness of substrate, thereby prevent that impurity from appearing and leading to the coating film failure. The cleaning principle of the plasma cleaning machine is well known in the prior art by those skilled in the art, and does not affect the technical scheme claimed herein, and is not described herein again. The mode of installing the cathode assembly 2 and the cleaning device 4 on the door body 3 can fully utilize the space of the coating chamber in the box body.
As shown in fig. 3, each set of cathode assemblies 2 includes a cathode mount 23 and two cathode arrangements, which are provided on the cathode mount 23. Each cathode device comprises a magnetic rod 21 and a target 22, the target 22 is cylindrical, the magnetic rod 21 is positioned in the target 22, the magnetic rod 21 comprises two magnets 211, the two magnets 211 are installed in opposite polarities, namely the N pole and the S pole of the two magnets 211 are installed in opposite directions, as shown in fig. 4, the magnetic field direction C of each magnetic rod 21 is shown in fig. 5, and the magnetic field direction C of the two magnetic rods 21 of each group of cathode assemblies 2 can be adjusted. The included angle between the two magnetic field directions C of the two magnetic rods 21 and one side of the substrate frame is alpha, alpha is more than 0 degrees and less than 180 degrees, and the size of the included angle alpha is adjustable, namely the angle of the magnetic field direction C is adjustable. With the arrangement, the sputtering angle of the sputtering particles is alpha, the width covered by the sputtering particles sputtered on the substrate is larger than the distance between the two magnetic rods 21, in other words, compared with a twin parallel twin target, the two magnetic rods 21 of the cathode assembly 2 of the technical scheme expand the coverage range of the sputtering particles, and the curved substrates of different shapes can be determined to be a proper magnetic field angle C through experiments or calculation, so that the curved substrates such as curved glass and the like can be sputtered more uniformly. The adjustment of the magnetic field direction C can be achieved by rotating and moving the magnetic bar 21.
As shown in fig. 6 and 7, the revolution-rotation umbrella turret 1 includes a self-turret, a plurality of revolution-rotation turrets 12 for loading substrates. The rotation frame is arranged in a manner that the rotation frame can rotate around a central shaft, and specifically, the rotation frame comprises a first rotation disc 111, a second rotation disc 112 and a plurality of connecting rods 113, the first rotation disc 111 and the second rotation disc 112 are arranged in parallel at intervals and are perpendicular to the central shaft, the plurality of connecting rods 113 are arranged between the first rotation disc 111 and the second rotation disc 112, and two ends of each connecting rod 113 are respectively and vertically connected with the first rotation disc 111 and the second rotation disc 112. The first spinning disk 111 includes a ring 1111 and a plurality of radiation rods 1112, and the ring 1111 and the plurality of radiation rods 1112 are connected to form a hub-like structure. Specifically, a plurality of radiation rods 1112 are symmetrically arranged relative to the center line of the ring 1111, the radiation rods 1112 and the ring 1111 are located in the same plane, the radiation rods 1112 are rod-shaped, one end of each radiation rod 1112 is connected with the center of the ring 1111, and the other end of each radiation rod 1112 is connected with the ring 1111.
The second rotation disc 112 is a non-hollow structure, and preferably, the second rotation disc 112 includes a disc and two rings integrally connected to the circumference of the disc, the two rings are not parallel and level, specifically, the inner ring of the first ring is integrally connected to the circumference of the disc, and the inner ring of the second ring is integrally connected to the outer ring of the first ring. The two circular rings and the circular disc are not parallel and level, in other words, the circular disc, the first circular ring and the second circular ring are not in the same plane, and when the revolution and rotation umbrella rotating frame 1 is horizontally placed, the heights of the circular disc, the first circular ring and the second circular ring are sequentially reduced.
As can be seen from the above, the first rotating disc 111 has a hollow structure, so as to facilitate weight reduction of the rotating frame, facilitate rotation of the rotating frame, and save more energy and improve efficiency; the second autorotation disk 112 is a non-hollow structure to separate the space above and below the second autorotation disk 112 and reduce the contamination of the sputtering ions to the parts below the second autorotation disk 112.
A plurality of connecting rods 113 are symmetrically arranged with respect to the central axis, the number of the connecting rods 113 is the same as the number of the radiation rods 1112, and one end of the connecting rod 113 is connected to one radiation rod 1112 and the other end is connected to the second spinning disk 112. The connecting rod 113 is used for connecting the first rotation disc 111 and the second rotation disc 112, and can reduce the vibration when the rotation frame rotates.
The revolution and rotation frames 12 are arranged on the rotation frames in a rotation mode, and the rotation frames drive the revolution and rotation frames 12 to revolve around the central shaft when rotating. The revolution and rotation frame 12 can realize synchronous rotation and revolution. The revolution and rotation stand 12 includes a substrate stand 121 and a revolution and rotation shaft 122, the substrate stand 121 is mounted on the revolution and rotation stand through the revolution and rotation shaft 122, and the substrate stand 121 is disposed to be rotatable around the revolution and rotation shaft 122. The plural sets of the common rotation shafts 122 are symmetrically arranged with respect to the central axis, and the common rotation shafts 122 are parallel to the central axis. One end of the rotating shaft 122 is connected to the ring 1111, and the other end is connected to the second rotating disc 112. Specifically, the substrate holder 121 is fixedly sleeved in the middle of the revolution shaft 122, two ends of the revolution shaft 122 are respectively connected to the first revolution plate 111 and the second revolution plate 112 through bearings, a bearing is arranged between one end of the revolution shaft 122 and the ring 1111, and a bearing is arranged between the other end of the revolution shaft 122 and the second revolution plate 112, that is, the revolution shaft 122 can rotate relative to the rotation holder through the bearings at the two ends and drive the substrate holder 121 to rotate. The substrate holder 121 is a cylinder, and the center line of the substrate holder 121 coincides with the common rotation axis 122. As can be seen from the above, the substrate holder 121 revolves while rotating, and the rotation speed is 5 to 15 times the revolution speed. Preferably, the substrate holder 121 is a hexagonal prism. The substrate to be coated is mounted on the side surface of the substrate holder 121, and specifically, the substrate to be coated is adhered to the side surface of the substrate holder 121.
The sputtering assembly further comprises a driving device comprising a driving motor 51, a driving gear 52, a rotating base 53 and a plurality of revolution and rotation gears 54. As shown in fig. 8 and 9, the drive gear 52 is fixedly sleeved outside the drive shaft of the drive motor 51. The revolution/rotation gear 54 is sleeved on one end of the revolution/rotation shaft 122 extending out of the second autorotation disk 112, and the revolution/rotation gear 54 is parallel to the first autorotation disk 111. Each revolution and rotation shaft 122 is fixedly sleeved with one revolution and rotation gear 54, that is, the revolution and rotation gear 54 and the corresponding revolution and rotation shaft 122 move together, the revolution and rotation gears 54 are uniformly distributed on the circumference of a circle at intervals, and the center of the circle is located on the central shaft.
The rotating base 53 is annular, the rotating base 53 is positioned below the second spinning disk 112 and is parallel to the first spinning disk 111, and the central line of the rotating base 53 coincides with the central axis. The rotating base 53 is fixedly connected to the bottom of the rotating frame, and preferably, the top of the rotating base 53 is fixedly connected with the second spinning disk 112, that is, the rotating base 53 and the second spinning disk 112 move together. The bottom of the rotating base 53 is slidably disposed on an annular track, and the central line of the annular track coincides with the central axis. A circle of gear teeth are arranged on the inner ring and the outer ring of the annular rotating base 53 along the circumferential direction. The turntable 53 is positioned inside a circle in which the plurality of revolution/rotation gears 54 are located, the plurality of revolution/rotation gears 54 mesh with gears on the outer ring of the turntable 53, and the drive gear 52 meshes with gears on the inner ring of the turntable 53. The driving gear 52, the rotating base 53 and the plurality of revolution and rotation gears 54 sequentially transmit drive: the driving motor 51 drives the driving gear 52 to rotate, the driving gear 52 drives the rotating base 53 engaged with the driving gear to rotate, so that the annular rotating base 53 is slidably disposed on the annular track, in other words, the rotating base 53 drives the rotating rack to rotate around the central shaft, the revolution and rotation gears 54 rotate synchronously around the central shaft, meanwhile, the outer ring of the rotating base 53 drives the revolution and rotation gears 54 to rotate, and the revolution and rotation gears 54 drive the revolution and rotation shaft 122 and the substrate holder 121 fixedly connected with the revolution and rotation gears 54 to rotate. As can be seen from the above, the rotating base 53 supports the self-revolving rack and the revolving rack 12 on the one hand, and drives the self-revolving rack and the revolving rack 12 to rotate on the other hand. The annular track is arranged in the film coating chamber.
The working process of the utility model is as follows: the substrate to be coated is arranged on the substrate frame 121, the vacuumizing is finished, when the vacuum degree reaches a set value and sputtering coating is prepared, the rotation of the rotation frame is driven by the driving device, the rotation frame drives the plurality of substrate frames 121 to revolve around the central line of the rotation frame, meanwhile, the driving device drives the substrate frame 121 to rotate around the revolution shaft 122, namely, the substrate frame 121 drives the substrate to rotate and revolve at the same time, and the direction C of the magnetic field formed by the two magnetic rods 21 of each group of cathode assemblies 2 can be adjusted. The included angle between the two magnetic field directions C of the two magnetic rods 21 and the side of the substrate frame is alpha, alpha is more than 0 degrees and less than 180 degrees, the size of the included angle alpha can be adjusted, so the width of the coverage range of the sputtering particles is more than the distance between the two magnetic rods 21, and the sputtering particles of each cathode assembly 2 are deposited on the substrate along with the rotation and the revolution of the substrate. The substrate frame 121 drives the substrate to rotate and revolve at the same time, so that the rotation number of the substrate and the number of the coated layers are far larger than the corresponding parameters of the substrate only revolving under the same other conditions, and the thickness of each layer of the deposited film of the substrate is smaller than that of the substrate only revolving. In other words, when the total film thickness is the same, the number of the film layers plated by the substrate in the rotation and revolution mode is more, each layer is thinner, and the finally obtained film is more uniform. In addition, the magnetic field directions of the two magnetic rods 21 of each group of cathode assemblies 2 are arranged in an adjustable manner, so that the coverage range and the angle of sputtering particles are increased, the sputtering particles can be received by the curved-surface substrate at all angles during revolution, and the sputtering deposition is more uniform.
Finally, it must be said here that: the above embodiments are only used for further detailed description of the technical solutions of the present invention, and should not be understood as limiting the scope of the present invention, and the modifications and adjustments made by those skilled in the art according to the above-mentioned contents of the present invention are all included in the scope of the present invention.
Claims (10)
1. The utility model provides a curved surface screen magnetron sputtering subassembly which characterized in that: the device comprises a revolution and rotation umbrella rotating frame (1), a plurality of groups of cathode assemblies (2) and at least one group of cleaning devices (4), wherein the plurality of groups of cathode assemblies (2) are not in contact with the revolution and rotation umbrella rotating frame (1), the plurality of groups of cathode assemblies (2) and the cleaning devices (4) are distributed along the circumferential direction of the revolution and rotation umbrella rotating frame (1), each group of cathode assemblies (2) comprises two cathode devices, each cathode device comprises a magnetic rod (21), the magnetic field directions of the two magnetic rods (21) of each group of cathode assemblies (2) are adjustable, the revolution and rotation umbrella rotating frame (1) comprises a revolution and a plurality of groups of revolution and rotation frames (12) used for loading substrates, the revolution and rotation frames are arranged around the central shaft of the revolution and rotation frames, the revolution and rotation frames (12) are arranged on the revolution and rotation frames, and the rotation frames drive the plurality of groups of revolution and rotation frames (12) to revolve around the.
2. The curved screen magnetron sputtering assembly of claim 1, wherein: the included angle of the magnetic field directions of the two magnetic rods (21) of each group of cathode assemblies (2) towards one side of the substrate frame is alpha, alpha is more than 0 degree and less than 180 degrees, and the size of the included angle alpha can be adjusted.
3. The curved screen magnetron sputtering assembly of claim 1, wherein: the rotation frame comprises a first rotation disc (111), a second rotation disc (112) and a plurality of connecting rods (113), the first rotation disc (111) and the second rotation disc (112) are arranged in parallel at intervals and are perpendicular to the central shaft, the connecting rods (113) are located between the first rotation disc (111) and the second rotation disc (112), and two ends of each connecting rod (113) are respectively and vertically connected with the first rotation disc (111) and the second rotation disc (112).
4. The curved screen magnetron sputtering assembly of claim 3, wherein: the first self-rotation disc (111) comprises a circular ring (1111) and a plurality of radiation rods (1112), and the circular ring (1111) and the plurality of radiation rods (1112) are connected to form a hub-shaped structure.
5. The curved screen magnetron sputtering assembly of claim 4, wherein: the revolution frame (12) comprises a substrate frame (121) and a revolution shaft (122), the substrate frame (121) is arranged on the revolution frame through the revolution shaft (122), and the substrate frame (121) can rotate around the revolution shaft (122).
6. The curved screen magnetron sputtering assembly of claim 5, wherein: the multiple groups of the common rotating shafts (122) are symmetrically arranged relative to the central shaft, and the common rotating shafts (122) are parallel to the central shaft.
7. The curved screen magnetron sputtering assembly of claim 5, wherein: the substrate frame (121) is a cylinder, and the central line of the substrate frame (121) is superposed with the revolution axis (122).
8. The curved screen magnetron sputtering assembly of claim 5, wherein: one end of the revolution axis (122) is connected with the ring (1111), and the other end is connected with the second rotation disc (112).
9. The curved screen magnetron sputtering assembly of claim 5, wherein: the sputtering component further comprises a driving device, the driving device comprises a driving motor (51), a driving gear (52) and a rotating base (53), the driving gear (52) is fixedly sleeved outside a driving shaft of the driving motor (51), the rotating base (53) is annular, the rotating base (53) is located below the second self-rotating disc (112) and is parallel to the first self-rotating disc (111), the central line of the rotating base (53) is coincident with the central axis, the rotating base (53) is fixedly connected to the bottom of the self-rotating frame, the bottom of the rotating base (53) is slidably arranged on an annular track, a circle of gear teeth are arranged on the inner ring of the annular rotating base (53) along the circumferential direction, and the driving gear (52) is meshed with the gear teeth of the inner ring of the rotating base (53).
10. The curved screen magnetron sputtering assembly of claim 9, wherein: the driving device further comprises a plurality of revolution and rotation gears (54), the revolution and rotation gears (54) are parallel to the first rotation disc (111), one end, extending out of the second rotation disc (112), of each revolution and rotation shaft (122) is fixedly sleeved with one revolution and rotation gear (54), the rotating base (53) is located inside a circle formed by the revolution and rotation gears (54) in a surrounding mode, and the revolution and rotation gears (54) are meshed with gears on the outer ring of the rotating base (53).
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| CN201922198954.9U CN211734462U (en) | 2019-12-10 | 2019-12-10 | Curved surface screen magnetron sputtering subassembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112281127A (en) * | 2020-10-30 | 2021-01-29 | 湘潭宏大真空技术股份有限公司 | Bearing device for magnetron sputtering coating machine |
| CN112877668A (en) * | 2021-01-13 | 2021-06-01 | 湘潭大学 | Large-area variable-radius curved surface film substrate frame |
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2019
- 2019-12-10 CN CN201922198954.9U patent/CN211734462U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112281127A (en) * | 2020-10-30 | 2021-01-29 | 湘潭宏大真空技术股份有限公司 | Bearing device for magnetron sputtering coating machine |
| CN112877668A (en) * | 2021-01-13 | 2021-06-01 | 湘潭大学 | Large-area variable-radius curved surface film substrate frame |
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