CN1296871A - 工件切削装置和切削方法 - Google Patents
工件切削装置和切削方法 Download PDFInfo
- Publication number
- CN1296871A CN1296871A CN00133362A CN00133362A CN1296871A CN 1296871 A CN1296871 A CN 1296871A CN 00133362 A CN00133362 A CN 00133362A CN 00133362 A CN00133362 A CN 00133362A CN 1296871 A CN1296871 A CN 1296871A
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- CN
- China
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- workpiece
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 429
- 238000000034 method Methods 0.000 title claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 8
- 150000002910 rare earth metals Chemical class 0.000 claims abstract description 8
- 239000002826 coolant Substances 0.000 claims abstract description 6
- 239000012809 cooling fluid Substances 0.000 claims description 76
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 9
- 239000006061 abrasive grain Substances 0.000 abstract description 3
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 230000035611 feeding Effects 0.000 description 21
- 238000010586 diagram Methods 0.000 description 11
- 229910003460 diamond Inorganic materials 0.000 description 11
- 239000010432 diamond Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000004094 surface-active agent Substances 0.000 description 9
- 239000000314 lubricant Substances 0.000 description 8
- -1 Sulfuric acid ester Chemical class 0.000 description 6
- 230000006378 damage Effects 0.000 description 6
- 238000005323 electroforming Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 230000003137 locomotive effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000013556 antirust agent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000012634 fragment Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000583 Nd alloy Inorganic materials 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- OYWRDHBGMCXGFY-UHFFFAOYSA-N 1,2,3-triazinane Chemical compound C1CNNNC1 OYWRDHBGMCXGFY-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010775 animal oil Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 239000010773 plant oil Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
切削刀片 | 金刚石磨粒+镍+钴+其它合金磨粒:金刚石(人造)磨粒直径:30μm-40μm尺寸:外径: 150mm刀片厚度:0.3mm内径: 60mm一组刀片中装有两个刀片 |
隔离件 | 尺寸:外径: 110mm厚度: 2.0mm内径: 60mm |
冷却液 | 输出压力:2kgf/cm2-4kgf/cm2冷却液类型:化学溶液式2%稀释度表面张力:25dyn/cm2-60dyn/cm2 |
容器 | 容积:2升尺寸:150mm×190mm×70mm |
工件 | 稀土合金磁性件(R-Fe-B磁铁)尺寸:60mm×40mm×20mm目标厚度:2.1mm |
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33211899 | 1999-11-22 | ||
JP332118/99 | 1999-11-22 | ||
JP332118/1999 | 1999-11-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1296871A true CN1296871A (zh) | 2001-05-30 |
CN1265925C CN1265925C (zh) | 2006-07-26 |
Family
ID=18251365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001333623A Expired - Lifetime CN1265925C (zh) | 1999-11-22 | 2000-11-22 | 工件切削装置和切削方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US6463920B1 (zh) |
CN (1) | CN1265925C (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1549472B1 (en) * | 2002-08-05 | 2008-09-24 | Nxp B.V. | Method for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
CN101480781B (zh) * | 2008-01-09 | 2010-09-29 | 财团法人金属工业研究发展中心 | 具加工油槽的切削加工机 |
CN101745863B (zh) * | 2008-11-05 | 2014-01-15 | 信越化学工业株式会社 | 用于多重切割机加工稀土磁体块的方法和设备、切割流体进料喷嘴以及磁体块固定夹具 |
CN107962686A (zh) * | 2017-12-22 | 2018-04-27 | 珠海东锦石英科技有限公司 | 数控多刀机及运用数控多刀机进行石英晶块加工的工艺 |
CN110640928A (zh) * | 2019-08-21 | 2020-01-03 | 雷谢明 | 一种紫外高阻隔含氟塑料粒子的制备设备 |
CN110756116A (zh) * | 2019-10-30 | 2020-02-07 | 牛月波 | 一种人造石英石环保回收装置 |
CN111417482A (zh) * | 2017-11-30 | 2020-07-14 | 伊斯卡有限公司 | 单面四向可转位正切削刀片及所用的刀片式铣刀 |
CN114683508A (zh) * | 2022-03-22 | 2022-07-01 | 杭州中祥通讯器材有限公司 | 一种带引线加强型通讯管材的制备工艺 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6595094B1 (en) * | 1999-01-29 | 2003-07-22 | Sumitomo Special Metals Co., Ltd. | Working cutting apparatus and method for cutting work |
EP1844913A3 (en) * | 2004-02-23 | 2010-06-30 | Towa-Intercon Technology, Inc. | Apparatus for cutting semiconductor devices |
US8065995B2 (en) * | 2008-11-25 | 2011-11-29 | Cambridge Energy Resources Inc | Method and apparatus for cutting and cleaning wafers in a wire saw |
US8261730B2 (en) * | 2008-11-25 | 2012-09-11 | Cambridge Energy Resources Inc | In-situ wafer processing system and method |
MY155758A (en) * | 2010-01-06 | 2015-11-30 | Shinetsu Chemical Co | Rare earth magnet holding jig and cutting machine |
MY157471A (en) * | 2010-01-06 | 2016-06-15 | Shinetsu Chemical Co | Rare earth magnet holding jig, cutting machine and cutting method |
JP5594238B2 (ja) * | 2011-06-27 | 2014-09-24 | 信越化学工業株式会社 | 磁石固定治具 |
MY174975A (en) * | 2011-11-28 | 2020-05-30 | Shinetsu Chemical Co | Saw blade and method for multiple sawing of rare earth magnet |
ITTO20120346A1 (it) * | 2012-04-18 | 2013-10-19 | Turmond S P A | Coltello multiplo rotante per il taglio longitudinale di nastri |
MY178343A (en) * | 2015-09-30 | 2020-10-08 | Shinetsu Chemical Co | Apparatus for continuously cutoff machining sintered magnet blocks |
CN109773989B (zh) * | 2019-03-15 | 2020-12-22 | 灵璧县浩翔信息科技有限公司 | 一种半导体晶棒处理设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2511962A (en) * | 1946-07-17 | 1950-06-20 | Linde Air Prod Co | Forming jewel bearing blanks |
US2967381A (en) * | 1958-04-07 | 1961-01-10 | Bendix Corp | Means for cutting |
FR1240358A (fr) * | 1959-04-10 | 1960-09-02 | Intermetall | Procédé de découpage de matériaux semi-conducteurs et éléments conformes à ceux obtenus |
US3240243A (en) * | 1961-07-27 | 1966-03-15 | Alexander J Golick | Mist lubricated ripsawing method and mechanisms |
DE3216200A1 (de) * | 1982-04-30 | 1983-11-03 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum saegen von kristallstaeben und mehrblattinnenlochsaege zur durchfuehrung des verfahrens |
JPH0787522B2 (ja) | 1986-01-31 | 1995-09-20 | 株式会社東芝 | フアクシミリシステム |
US4920946A (en) * | 1987-03-03 | 1990-05-01 | Applied Magnetic Lab. Co., Ltd. | Blade cutting apparatus for hard brittle material |
US4962748A (en) * | 1987-11-09 | 1990-10-16 | Schweickhardt Karl B | Diamond abrasive saw blade and method of dry sawing concrete |
JP3213393B2 (ja) | 1992-07-29 | 2001-10-02 | ダイセル化学工業株式会社 | 生分解性に優れた酢酸セルロース |
US5711287A (en) * | 1996-08-14 | 1998-01-27 | Speer; Radleigh J. | Reciprocating slurry saw |
US6012977A (en) * | 1997-12-22 | 2000-01-11 | Shin-Etsu Chemical Co., Ltd. | Abrasive-bladed cutting wheel |
-
2000
- 2000-11-16 US US09/712,905 patent/US6463920B1/en not_active Expired - Lifetime
- 2000-11-22 CN CNB001333623A patent/CN1265925C/zh not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1549472B1 (en) * | 2002-08-05 | 2008-09-24 | Nxp B.V. | Method for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
CN101480781B (zh) * | 2008-01-09 | 2010-09-29 | 财团法人金属工业研究发展中心 | 具加工油槽的切削加工机 |
CN101745863B (zh) * | 2008-11-05 | 2014-01-15 | 信越化学工业株式会社 | 用于多重切割机加工稀土磁体块的方法和设备、切割流体进料喷嘴以及磁体块固定夹具 |
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