CN1292129A - 一种带有无接触电子存储器的电子器件及其制作方法 - Google Patents

一种带有无接触电子存储器的电子器件及其制作方法 Download PDF

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Publication number
CN1292129A
CN1292129A CN 99803383 CN99803383A CN1292129A CN 1292129 A CN1292129 A CN 1292129A CN 99803383 CN99803383 CN 99803383 CN 99803383 A CN99803383 A CN 99803383A CN 1292129 A CN1292129 A CN 1292129A
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CN
China
Prior art keywords
microelectronic circuit
paper
screening glass
adhesive linkage
electron device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 99803383
Other languages
English (en)
Chinese (zh)
Inventor
L·奥多
R·弗雷曼
S·阿雅拉
M·扎夫拉尼
P·帕特里斯
G·布尔内克斯
D·马丁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Publication of CN1292129A publication Critical patent/CN1292129A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
CN 99803383 1998-02-27 1999-02-10 一种带有无接触电子存储器的电子器件及其制作方法 Pending CN1292129A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR98/02727 1998-02-27
FR9802727A FR2775533B1 (fr) 1998-02-27 1998-02-27 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif

Publications (1)

Publication Number Publication Date
CN1292129A true CN1292129A (zh) 2001-04-18

Family

ID=9523715

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 99803383 Pending CN1292129A (zh) 1998-02-27 1999-02-10 一种带有无接触电子存储器的电子器件及其制作方法

Country Status (8)

Country Link
EP (1) EP1057139A1 (fr)
JP (1) JP2002505488A (fr)
CN (1) CN1292129A (fr)
AU (1) AU2428699A (fr)
BR (1) BR9907751A (fr)
CA (1) CA2321893A1 (fr)
FR (1) FR2775533B1 (fr)
WO (1) WO1999044172A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322467C (zh) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 一种非接触式智能低频卡制造方法
CN1322468C (zh) * 2003-03-27 2007-06-20 株式会社电装 Ic卡
CN100363950C (zh) * 2003-01-31 2008-01-23 瓦尔达微电池有限责任公司 薄电子芯片卡
CN1647104B (zh) * 2002-04-19 2010-05-12 艾利丹尼森公司 激光可成像的rfid标签/标牌
CN111491790A (zh) * 2017-10-13 2020-08-04 斯道拉恩索公司 生产具有集成导电图案的标签的方法和装置

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FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US6915551B2 (en) 2002-08-02 2005-07-12 Matrics, Inc. Multi-barrel die transfer apparatus and method for transferring dies therewith
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US7233498B2 (en) * 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
WO2004112096A2 (fr) 2003-06-12 2004-12-23 Symbol Technologies, Inc. Procede et systeme pour transferer un grand volume de des sur des substrats
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7051923B2 (en) 2003-09-12 2006-05-30 Visa U.S.A., Inc. Method and system for providing interactive cardholder rewards image replacement
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
CA2553203A1 (fr) 2004-01-12 2005-08-04 Symbol Technologies, Inc. Tri d'incrustations d'etiquette d'identification par radiofrequence et ensemble
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
US7187293B2 (en) 2004-08-17 2007-03-06 Symbol Technologies, Inc. Singulation of radio frequency identification (RFID) tags for testing and/or programming
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
FR2877462B1 (fr) 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
US7578053B2 (en) 2004-12-03 2009-08-25 Hallys Corporation Interposer bonding device
JP2006277178A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
US8025086B2 (en) 2005-04-06 2011-09-27 Hallys Corporation Electronic component manufacturing apparatus
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
DE102005028066B3 (de) 2005-06-16 2006-12-07 Deutsche Exide Gmbh Polbrücke für eine Batterie
DE102006026105B4 (de) * 2005-06-28 2011-07-07 Mühlbauer AG, 93426 Verfahren und Vorrichtung zur Herstellung von selbstklebenden RFID-Transpondern
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US7992781B2 (en) 2009-12-16 2011-08-09 Visa International Service Association Merchant alerts incorporating receipt data
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
FR3049739B1 (fr) * 2016-03-30 2021-03-12 Linxens Holding Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce
CN113147094A (zh) * 2021-03-18 2021-07-23 淮安赫德兹彩色印刷包装有限公司 带装饰贴的包装纸袋加工设备

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FR2724040B1 (fr) * 1994-08-25 1996-09-27 Schlumberger Ind Sa Procede de fabrication d'une carte a puce et carte ainsi obtenue
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EP0706152B1 (fr) * 1994-11-03 1998-06-10 Fela Holding AG Feuille de base pour carte à puce
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1647104B (zh) * 2002-04-19 2010-05-12 艾利丹尼森公司 激光可成像的rfid标签/标牌
CN100363950C (zh) * 2003-01-31 2008-01-23 瓦尔达微电池有限责任公司 薄电子芯片卡
CN1322468C (zh) * 2003-03-27 2007-06-20 株式会社电装 Ic卡
CN1322467C (zh) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 一种非接触式智能低频卡制造方法
CN111491790A (zh) * 2017-10-13 2020-08-04 斯道拉恩索公司 生产具有集成导电图案的标签的方法和装置

Also Published As

Publication number Publication date
EP1057139A1 (fr) 2000-12-06
FR2775533B1 (fr) 2003-02-14
JP2002505488A (ja) 2002-02-19
WO1999044172A1 (fr) 1999-09-02
BR9907751A (pt) 2000-10-17
AU2428699A (en) 1999-09-15
FR2775533A1 (fr) 1999-09-03
CA2321893A1 (fr) 1999-09-02

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication