CN100363950C - 薄电子芯片卡 - Google Patents

薄电子芯片卡 Download PDF

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CN100363950C
CN100363950C CNB2003101207082A CN200310120708A CN100363950C CN 100363950 C CN100363950 C CN 100363950C CN B2003101207082 A CNB2003101207082 A CN B2003101207082A CN 200310120708 A CN200310120708 A CN 200310120708A CN 100363950 C CN100363950 C CN 100363950C
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S·费尔斯特
M·莫泽
H·施泰尔茨格
C·拉斯曼
F·比尔克-萨拉姆
D·伊利克
U·博施
T·韦尔勒
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Abstract

一种带有IC芯片和作为能量存储件的原电池(3)的薄电子芯片卡，该电子芯片卡包括芯膜(1)，原电池(3)具有至少一个锂插入电极和一个包括两片金属箔的薄柔性外壳，金属箔直接贴靠在该电极上并通过粘合剂或密封层以密封的方式相互连接，该原电池(3)设置在芯膜(1)的凹槽中，原电池(3)和芯膜(1)的两面上都覆盖了塑料覆膜(2)，塑料覆膜牢固地粘合在芯膜(1)和原电池(3)上，其特征在于，通过一种同时粘附在金属和塑料上的弹性应力补偿型粘合剂(4)，塑料覆膜(2)牢固地粘合在芯膜(1)和原电池(3)上；该粘合剂(4)具有35℃到70℃之间的玻璃化转变温度以及符合DIN ISO 527的40-52%的断裂伸长率。

Description

薄电子芯片卡
技术领域
本发明的主题涉及一种带有IC芯片和作为能量存储件的原电池的薄电子芯片卡，该电子芯片卡包括芯膜，所述原电池具有至少一个锂插入电极并两片金属箔的薄的柔性外壳，金属箔直接贴在电极上并通过粘合剂或密封层以密封的方式相互连接。
背景技术
在“有源智能卡”中，需要总厚度例如小于0.5毫米的非常薄的柔性原电池作为能量存储件。在这种薄电子芯片卡的情况中，提供了扁平的能量存储件以便为IC芯片或其它元器件如集成式微型传感器或转发器提供能量。在根据DIN-ISO 7816-1和DIN-ISO/IEC 10373的弯曲阻抗方面，这种智能卡在其包括卡主体、元件及能量存储件在内的整体形式上必须符合ISO标准，即必须满足根据DIN-ISO7816-1的ISO弯曲测试和根据DIN ISO/IEC 10373的测试标准。在动态弯曲测试中，这种卡在每分钟弯曲30次的频率(＝0.5赫兹)下在2厘米的长度和1厘米的宽度上弯曲。在这种测试中，卡必须能够在四个可能方向的各方向上承受至少250次弯曲(即总共1000次弯曲)而不受损坏。在动态扭曲测试中，卡在围绕其纵向轴线成±15°的方向上以每分钟30次弯曲的频率(＝0.5赫兹)来承受载荷。标准是要求可进行1000次扭曲而芯片功能不会失效，或在卡上看不见任何机械损伤。
在先前使用的热层压和冷层压的方法中，原电池的金属外壳经常受损，使得整个卡系统无法使用。如果利用已知的粘合剂如常用的双组分聚氨酯粘合剂通过冷层压来将外壳引入到芯片卡内，那么在进行ISO弯曲测试时经常会发生破裂。
文献EP 0997959B1介绍了带有非水性电解质的原电池，其具有包含层合薄膜的外壳。这种层合薄膜通常包括涂覆在双面上的复合铝箔，其可容易地被深拉拔至5毫米，基于这种特性，它可以直接通过ISO测试。因此，这种塑料封装可防止撕裂。
在专利申请DE 10102125.9中介绍了一种电子芯片卡的机械加固装置，其通过由金属或纤维增强塑料构成的部分或完整的覆层来将原电池设置在卡内。
在德国专利申请10226848.7中提出了用于使金属外壳稳定化的另一可能性。在该申请中，原电池带有至少一个锂插入电极以及薄的柔性外壳，外壳由两片金属箔构成，金属箔直接贴在电极上并通过粘合剂或密封层以密封的方式相互连接，在这种情况下，将至少一片金属箔设置在具有一层可提高稳定性和强度的塑料层的外侧上，并在金属箔和塑料层之间设置粘合层。然而，这种原电池必须在另外的工序步骤中转换成层压结构。
发明内容
本发明尤其基于提供一种有源芯片卡的目的，其可满足与弯曲应力和扭曲应力相关的机械稳定性方面的高要求，并且可容易地生产出来，且仅由少许层即可构建而成。
在本文开篇所述类型的芯片卡的情况下，这个目的可通过下述特征来实现。本发明有利的改进新型也可从下述介绍中获得。
特别是，提出一种带有IC芯片和作为能量存储件的原电池的薄电子芯片卡，所述电子芯片卡包括芯膜，所述原电池具有至少一个锂插入电极和一个包括两片金属箔的薄柔性外壳，所述两片金属箔直接贴靠在所述电极上并通过粘合剂或密封层以密封的方式相互连接，所述原电池设置在所述芯膜的凹槽中，所述原电池和芯膜的两面上都覆盖了塑料覆膜，所述塑料覆膜牢固地粘合在所述芯膜和原电池上，其特征在于，通过一种同时粘附在金属和塑料上的弹性应力补偿型粘合剂，塑料覆膜牢固地粘合在所述芯膜和所述原电池上；所述粘合剂具有35℃到70℃之间的玻璃化转变温度以及符合DINISO 527的40-52％的断裂伸长率。
根据本发明，将原电池层压到智能卡内是在环境温度下通过弹性粘合剂来进行的，该原电池具有至少一个锂插入电极和包括两片金属箔的薄柔性外壳，金属箔直接贴在电极上并通过粘合剂或密封层以密封的方式相互连接。在这种情况下，智能卡或芯片卡是多层的柔性塑料复合物，其具有诸如传感器技术、数据存储和检索的功能。
原电池设置在芯膜的凹槽中，在芯膜和原电池的两面上都覆盖了塑料覆膜，该塑料覆膜通过同时粘附在金属和塑料上的弹性应力补偿型粘合剂而牢固地粘合在芯膜和原电池上。塑料覆膜通过冷层压来施加。
在热层压的情况下，塑料层通过压力和相对较高温度(通常超过100℃)的同时作用而相互熔合在其表面区域上；在这种情况下，该区域保持永久的相互粘附，并得到了包括所用塑料膜的复合物。比热层压更节约能量的一种选择是所谓的冷层压。如同热层压一样，压力施加在薄膜上，薄膜置于另一薄膜之上；然而将这些待粘合区域粘结在一起是在环境温度(室温)下或在最多达50℃的加热温度下进行的。根据本发明的单组分粘合剂是可自由流动的粘性组合物，其封装了原电池并将智能卡嵌入在其中，并且在聚合(固化)之后产生了与卡和原电池的金属外壳表面的薄膜相关的永久性的区域粘合。
根据DIN ISO 527，粘合剂应当具有处于35℃到70℃之间的玻璃化转变温度，以及40-52％的断裂伸长率，并且可光致固化。特别是，粘合剂为环氧树脂或热塑性的聚氨酯基材料。
塑料覆膜最好由PVC构成。粘合剂粘合在卡中的所有区域，即从覆膜到芯膜上、从外壳的金属表面到覆膜上以及从金属外壳到芯膜上的所有区域均通过冷层压来产生。
根据本发明对弹性粘合剂的使用以及发生在室温下的固化使得整个智能卡-粘合剂-扁平电池系统可转换成机械性能稳定的系统，其被整体地设计用于ISO弯曲测试过程中的高承载容量，弹性粘合剂是一种应力补偿型粘合剂。
当利用其它通常更脆的粘合剂来进行测试时，将会获得20％-100％的废品率。当使用符合DIN EN ISO 527的40％-52％的断裂伸长率和45℃-49℃的玻璃化转变温度的应力补偿型的光激环氧树脂时，不会对原电池或电池或卡造成破坏。
玻璃化温度或玻璃化转变温度(Tg)是非晶态或部分晶态聚合物从橡胶弹性态或液态转变到硬弹性态或玻璃态的温度，或者是与之相反的转变的温度。这一现象基于聚合物昆布的较长链段的布朗分子运动的凝固和熔化。如果达到玻璃化温度，物理性质就会显著地改变。这种物理性质的例子为粘度或硬度。对于弯曲测试中的特征来说特别有利的是，根据本发明所优选使用的环氧树脂具有相对较低的大约为50℃的玻璃化温度，这种环氧树脂在测试中呈现出有利的性质。因此，这些固化的环氧树脂比那些具有如140℃的玻璃化温度并因此在ISO弯曲测试中易碎和产生裂纹的环氧树脂更具弹性。环氧树脂是有机的通常为低聚的化合物，其尤其具有环氧基并可通过聚合方法转化成所谓的热固性材料(“固化”)。固化过程中的收缩率很小，固化产品是无应力且抗撕裂的，这对弯曲测试来说非常有利。此外，这些环氧树脂粘附在金属表面例如铜上，并将本身被认为是机械性能不稳定的薄铜转化成弹性且稳定的环氧树脂和铜的整体复合物。
附图说明
在图1中示意性地显示了根据本发明的薄电子芯片卡，其带有IC芯片和作为能量存储件的原电池。
具体实施方式
可用作卡的材料的是包含PVC/ABS共混物的芯膜1(其中PVC是聚氯乙烯，ABS是丙烯腈-丁二烯-苯乙烯共聚物)，芯膜1包括位于凹槽内的原电池3。覆膜2由PVC构成。优选的粘合剂4是一种改性的单组分环氧树脂(例如德国DELO公司的Katiobond产品)。固化过程通过利用可见光的光激化来进行。对于在智能卡中使用带铜外壳的原电池来说非常重要的一项突出性质是粘结到金属表面上的优良粘合性能。在24小时之后可获得最终的强度。
环氧树脂具有良好的耐化学性，并且是无毒的。这些特殊的环氧树脂在固化过程中具有较小的收缩率，并可在固化后形成无应力且抗撕裂的塑料；这在弯曲测试中提供了显著的优点。
作为根据本发明的另一粘合剂，可以成功地使用热塑性的聚氨酯基粘合剂，例如Henkel TPU QR 4663。
为了生产这种薄电子芯片卡，应冲压出芯膜1以将原电池3放入其中。然后，通过刮刀将一定量的粘合剂铺展在芯膜1的全部区域上；在这种情况下，粘合剂4也会流入到芯膜1和原电池3之间的空腔内。之后将覆膜2放置在上面，并将层压卡的这种初期子组件翻转过来，然后重复进行刮刀操作并将第二覆膜2放置在上面。在对卡施压之后(不引入热量)，将其暴露在光线下以开始进行固化操作。

Claims (6)

1.一种带有IC芯片和作为能量存储件的原电池(3)的薄电子芯片卡，
所述电子芯片卡包括芯膜(1)，
所述原电池(3)具有至少一个锂插入电极和一个包括两片金属箔的薄柔性外壳，所述两片金属箔直接贴靠在所述电极上并通过粘合剂或密封层以密封的方式相互连接，
所述原电池(3)设置在所述芯膜(1)的凹槽中，
所述原电池(3)和芯膜(1)的两面上都覆盖了塑料覆膜(2)，所述塑料覆膜牢固地粘合在所述芯膜(1)和原电池(3)上，
其特征在于，通过一种同时粘附在金属和塑料上的弹性应力补偿型粘合剂(4)，塑料覆膜(2)牢固地粘合在所述芯膜(1)和所述原电池(3)上；
所述粘合剂(4)具有35℃到70℃之间的玻璃化转变温度以及符合DIN ISO 527的40-52％的断裂伸长率。
2.根据权利要求1所述的薄电子芯片卡，其特征在于，所述粘合剂粘合在所述卡中的所有区域，即从所述覆膜到所述芯膜上、从所述金属外壳的表面到所述覆膜上以及从所述金属外壳到所述芯膜上的所有区域均通过冷层压来产生。
3.根据权利要求1所述的薄电子芯片卡，其特征在于，所述粘合剂是可光致固化的。
4.根据权利要求1所述的薄电子芯片卡，其特征在于，所述粘合剂是环氧树脂。
5.根据权利要求1所述的薄电子芯片卡，其特征在于，所述粘合剂是热塑性的聚氨酯基材料。
6.根据权利要求1所述的薄电子芯片卡，其特征在于，所述塑料覆膜由聚氯乙烯构成。
CNB2003101207082A 2003-01-31 2003-11-28 薄电子芯片卡 Expired - Fee Related CN100363950C (zh)

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