AU2428699A - Electronic device with contactless electronic memory, and method for making same - Google Patents

Electronic device with contactless electronic memory, and method for making same

Info

Publication number
AU2428699A
AU2428699A AU24286/99A AU2428699A AU2428699A AU 2428699 A AU2428699 A AU 2428699A AU 24286/99 A AU24286/99 A AU 24286/99A AU 2428699 A AU2428699 A AU 2428699A AU 2428699 A AU2428699 A AU 2428699A
Authority
AU
Australia
Prior art keywords
making same
electronic device
contactless
electronic
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU24286/99A
Other languages
English (en)
Inventor
Stephane Ayala
Gerard Bourneix
Ray Freeman
David Martin
Laurent Oddou
Philippe Patrice
Michael Zafrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SCA
Gemplus Card International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SCA, Gemplus Card International SA filed Critical Gemplus SCA
Publication of AU2428699A publication Critical patent/AU2428699A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
AU24286/99A 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same Abandoned AU2428699A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9802727 1998-02-27
FR9802727A FR2775533B1 (fr) 1998-02-27 1998-02-27 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
PCT/FR1999/000291 WO1999044172A1 (fr) 1998-02-27 1999-02-10 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif

Publications (1)

Publication Number Publication Date
AU2428699A true AU2428699A (en) 1999-09-15

Family

ID=9523715

Family Applications (1)

Application Number Title Priority Date Filing Date
AU24286/99A Abandoned AU2428699A (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same

Country Status (8)

Country Link
EP (1) EP1057139A1 (fr)
JP (1) JP2002505488A (fr)
CN (1) CN1292129A (fr)
AU (1) AU2428699A (fr)
BR (1) BR9907751A (fr)
CA (1) CA2321893A1 (fr)
FR (1) FR2775533B1 (fr)
WO (1) WO1999044172A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108885709A (zh) * 2016-03-30 2018-11-23 兰克森控股公司 制造芯片卡和芯片卡天线支撑件的方法

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US6851617B2 (en) 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US6915551B2 (en) 2002-08-02 2005-07-12 Matrics, Inc. Multi-barrel die transfer apparatus and method for transferring dies therewith
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US7233498B2 (en) * 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
DE10304824A1 (de) * 2003-01-31 2004-08-12 Varta Microbattery Gmbh Dünne elektronische Chipkarte
JP4103653B2 (ja) * 2003-03-27 2008-06-18 株式会社デンソー Ｉｃカード
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
WO2004112096A2 (fr) 2003-06-12 2004-12-23 Symbol Technologies, Inc. Procede et systeme pour transferer un grand volume de des sur des substrats
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7051923B2 (en) 2003-09-12 2006-05-30 Visa U.S.A., Inc. Method and system for providing interactive cardholder rewards image replacement
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
CN1322467C (zh) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 一种非接触式智能低频卡制造方法
CA2553203A1 (fr) 2004-01-12 2005-08-04 Symbol Technologies, Inc. Tri d'incrustations d'etiquette d'identification par radiofrequence et ensemble
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
US7187293B2 (en) 2004-08-17 2007-03-06 Symbol Technologies, Inc. Singulation of radio frequency identification (RFID) tags for testing and/or programming
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
FR2877462B1 (fr) 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
US7578053B2 (en) 2004-12-03 2009-08-25 Hallys Corporation Interposer bonding device
JP2006277178A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
US8025086B2 (en) 2005-04-06 2011-09-27 Hallys Corporation Electronic component manufacturing apparatus
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
DE102005028066B3 (de) 2005-06-16 2006-12-07 Deutsche Exide Gmbh Polbrücke für eine Batterie
DE102006026105B4 (de) * 2005-06-28 2011-07-07 Mühlbauer AG, 93426 Verfahren und Vorrichtung zur Herstellung von selbstklebenden RFID-Transpondern
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US7992781B2 (en) 2009-12-16 2011-08-09 Visa International Service Association Merchant alerts incorporating receipt data
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
SE1751265A1 (en) * 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern
CN113147094A (zh) * 2021-03-18 2021-07-23 淮安赫德兹彩色印刷包装有限公司 带装饰贴的包装纸袋加工设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2641102B1 (fr) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
NL9301457A (nl) * 1993-08-23 1995-03-16 Nedap Nv Contactloze identificatiekaart of smart card.
FR2724040B1 (fr) * 1994-08-25 1996-09-27 Schlumberger Ind Sa Procede de fabrication d'une carte a puce et carte ainsi obtenue
ES2120229T3 (es) * 1994-09-30 1998-10-16 Siemens Ag Disposicion de soporte para su integracion en una tarjeta de chip sin contacto.
EP0706152B1 (fr) * 1994-11-03 1998-06-10 Fela Holding AG Feuille de base pour carte à puce
DE19509233A1 (de) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Elektronik-Komponenten enthaltenden Kunststoffkarten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108885709A (zh) * 2016-03-30 2018-11-23 兰克森控股公司 制造芯片卡和芯片卡天线支撑件的方法

Also Published As

Publication number Publication date
EP1057139A1 (fr) 2000-12-06
FR2775533B1 (fr) 2003-02-14
JP2002505488A (ja) 2002-02-19
WO1999044172A1 (fr) 1999-09-02
CN1292129A (zh) 2001-04-18
BR9907751A (pt) 2000-10-17
FR2775533A1 (fr) 1999-09-03
CA2321893A1 (fr) 1999-09-02

Similar Documents

Publication Publication Date Title
AU2428699A (en) Electronic device with contactless electronic memory, and method for making same
HK1032882A1 (en) Electronic device manufacturing method and electronic device.
HK1027638A1 (en) Data storage device and data storage method.
EP0971311A4 (fr) Dispositif memoire, controleur et dispositif electronique
AU7050498A (en) Method for making smart card or similar electronic device
HK1008595A1 (en) Display device, electronic device and method for manufacturing electronic device.
AU4268799A (en) Integrated electronic micromodule and method for making same
HK1043678A1 (en) Method and system for communicating data between an integrated circuit and other devices
AU4557799A (en) On-chip circuit and method for testing memory devices
GB2344222B (en) Chip type electronic part and method for the manufacture thereof
GB2345778B (en) Sense amplifier circuit,memory device using the circuit and method for reading the memory device
AU3841999A (en) Preloaded ic-card and method for authenticating the same
AU2277900A (en) Method and device for object recognition
GB2340305B (en) Electronic device and method for producing the same
AU3185199A (en) Immunoassay device and method
HK1048178A1 (en) Device for processing data and corresponding method.
EP1055980A4 (fr) Dispositif electronique et procede de commande associe
AU1278300A (en) Contactless electronic module, chip card comprising same, and methods for makingsame
AU2973999A (en) Transponder insertion device and method
AU5424999A (en) Method for implementing a queue in a memory, and memory arrangement
EP1143627A4 (fr) Procede et dispositif d'emission de donnees
HK1028819A1 (en) Portable electronic device and control method for the same
AU5410399A (en) Electronic component and method for the production thereof
AU2002218092A1 (en) Vddq integrated circuit testing system and method
AU7454500A (en) Ic card and manufacturing method for ic card

Legal Events

Date Code Title Description
MK5 Application lapsed section 142(2)(e) - patent request and compl. specification not accepted