CN1285589A - 光头及其制造方法 - Google Patents
光头及其制造方法 Download PDFInfo
- Publication number
- CN1285589A CN1285589A CN00121786A CN00121786A CN1285589A CN 1285589 A CN1285589 A CN 1285589A CN 00121786 A CN00121786 A CN 00121786A CN 00121786 A CN00121786 A CN 00121786A CN 1285589 A CN1285589 A CN 1285589A
- Authority
- CN
- China
- Prior art keywords
- light source
- laser light
- laser
- groove
- vibration wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B21/00—Head arrangements not specific to the method of recording or reproducing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
- G11B7/127—Lasers; Multiple laser arrays
- G11B7/1275—Two or more lasers having different wavelengths
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B2007/0003—Recording, reproducing or erasing systems characterised by the structure or type of the carrier
- G11B2007/0006—Recording, reproducing or erasing systems characterised by the structure or type of the carrier adapted for scanning different types of carrier, e.g. CD & DVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Head (AREA)
- Semiconductor Lasers (AREA)
- Lasers (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11232136A JP2001056952A (ja) | 1999-08-19 | 1999-08-19 | 光ヘッド装置およびその製造方法 |
JP232136/1999 | 1999-08-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1285589A true CN1285589A (zh) | 2001-02-28 |
CN1129123C CN1129123C (zh) | 2003-11-26 |
Family
ID=16934568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00121786A Expired - Fee Related CN1129123C (zh) | 1999-08-19 | 2000-08-01 | 光学头及其制造方法、光信息记录/再现设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7292519B2 (zh) |
JP (1) | JP2001056952A (zh) |
KR (1) | KR100632860B1 (zh) |
CN (1) | CN1129123C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1297974C (zh) * | 2003-07-01 | 2007-01-31 | 夏普株式会社 | 光学拾取装置和包含其的光盘驱动器 |
CN111090038A (zh) * | 2018-10-24 | 2020-05-01 | 三星电子株式会社 | 探测装置及包括探测装置的测试装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10160378A1 (de) * | 2001-12-10 | 2003-06-18 | Thomson Brandt Gmbh | Wiedergabe- oder Aufzeichnungsgerät für unterschiedliche optische Aufzeichnungsträger |
TWI261244B (en) | 2003-05-12 | 2006-09-01 | Hon Hai Prec Ind Co Ltd | Optical pick-up system |
US7307940B2 (en) * | 2003-06-30 | 2007-12-11 | Semiconductor Energy Laboratory Co., Ltd. | Optical pick-up device |
JP2005327395A (ja) | 2004-05-14 | 2005-11-24 | Sony Corp | 光ピックアップ及びこれを用いた記録及び/又は再生装置 |
JP4215703B2 (ja) * | 2004-11-04 | 2009-01-28 | パナソニック株式会社 | 光学デバイスおよびその製造方法 |
JP4595818B2 (ja) * | 2006-01-18 | 2010-12-08 | パナソニック株式会社 | 光ピックアップの調整方法 |
KR100715287B1 (ko) * | 2006-04-26 | 2007-05-08 | 삼성전자주식회사 | 반도체 메모리 모듈 |
KR101362163B1 (ko) * | 2007-11-12 | 2014-02-12 | 엘지디스플레이 주식회사 | 백라이트 유닛 및 이의 제조 방법 |
JP5799686B2 (ja) * | 2011-09-07 | 2015-10-28 | ソニー株式会社 | 対物レンズ、光ピックアップ装置、及び光ディスク装置 |
JP7267524B2 (ja) * | 2018-10-10 | 2023-05-02 | 国立研究開発法人情報通信研究機構 | ガスセルおよびガスセルの製造方法 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3668404A (en) * | 1970-09-29 | 1972-06-06 | Kurt Lehovec | Electro-optical microtransducer comprising diffractive element monolithically integrated with photoelectric device |
CA1255382A (en) * | 1984-08-10 | 1989-06-06 | Masao Kawachi | Hybrid optical integrated circuit with alignment guides |
JPH07118087B2 (ja) | 1987-12-07 | 1995-12-18 | 松下電器産業株式会社 | 光ヘッド装置 |
JPH0642501B2 (ja) | 1987-12-18 | 1994-06-01 | 富士通株式会社 | 微小半導体チップの位置合わせ方法 |
JP3140085B2 (ja) | 1991-05-28 | 2001-03-05 | 松下電子工業株式会社 | 半導体レーザ装置 |
CA2088701C (en) * | 1992-02-05 | 1998-01-27 | Yoshio Yoshida | Optical information reproducing apparatus |
JPH06232226A (ja) | 1993-02-02 | 1994-08-19 | Matsushita Electron Corp | 半導体装置の検査装置およびその検査方法 |
JPH07134829A (ja) | 1993-11-12 | 1995-05-23 | Matsushita Electron Corp | 半導体レーザ装置 |
US5621714A (en) * | 1994-02-12 | 1997-04-15 | Olympus Optical Co., Ltd. | Optical pick-up apparatus having hologram and beam splitter with birefringent member and polarizing film |
US5721605A (en) * | 1994-03-29 | 1998-02-24 | Nikon Corporation | Alignment device and method with focus detection system |
JPH07326083A (ja) * | 1994-06-01 | 1995-12-12 | Olympus Optical Co Ltd | 光情報再生装置 |
JP2806293B2 (ja) * | 1994-10-06 | 1998-09-30 | 松下電器産業株式会社 | 光ピックアップ及びその製造方法 |
US5727111A (en) * | 1995-06-19 | 1998-03-10 | Sony Corporation | Optical pick-up and light detecting cover therefor |
JPH1021577A (ja) | 1996-07-03 | 1998-01-23 | Seiko Epson Corp | 複合光学素子および光学ヘッドおよび光メモリ装置 |
JPH1064078A (ja) * | 1996-08-20 | 1998-03-06 | Mitsubishi Electric Corp | 光ヘッド |
US6125087A (en) * | 1996-11-07 | 2000-09-26 | Hitachi, Ltd. | Optical pickup for optical disk apparatus |
JPH10149559A (ja) * | 1996-11-19 | 1998-06-02 | Sankyo Seiki Mfg Co Ltd | レーザビーム出射装置 |
JPH10283652A (ja) | 1997-02-24 | 1998-10-23 | Hoetron Inc | 異なった波長の2個の半導体レーザを用いた光学ヘッド |
JPH10326421A (ja) | 1997-05-26 | 1998-12-08 | Sony Corp | 光学ピックアップ |
JPH1153759A (ja) | 1997-06-05 | 1999-02-26 | Hitachi Ltd | 光学ヘッドおよびそれを用いた光ディスク装置 |
US6160774A (en) * | 1997-09-22 | 2000-12-12 | Seagate Technology Llc | Position sensor for tracking system for optical data storage |
US6100944A (en) * | 1997-10-10 | 2000-08-08 | Boulder Nonlinear Systems, Inc. | Polarizing interferometer using multiorder and zero order birefringence switches |
JPH11126869A (ja) | 1997-10-22 | 1999-05-11 | Rohm Co Ltd | 積層チップの製造方法 |
JP3638417B2 (ja) * | 1997-10-24 | 2005-04-13 | 富士通株式会社 | 光ピックアップ |
JP2000011422A (ja) * | 1998-04-24 | 2000-01-14 | Sony Corp | 集積化受発光装置 |
JP2000011417A (ja) | 1998-06-26 | 2000-01-14 | Toshiba Corp | 半導体レーザアレイ及びその製造方法、光集積ユニット、光ピックアップ並びに光ディスク駆動装置 |
DE69900013T2 (de) * | 1998-09-14 | 2001-06-07 | Matsushita Electric Ind Co Ltd | Neigungserkennungsvorrichtung, optisches Speicher und Wiedergabe-Plattengerät, und Neigungserkennungserfahren |
EP0990927A3 (en) * | 1998-09-28 | 2000-12-13 | Sharp Kabushiki Kaisha | Diffraction grating having multiple gratings with different cycles for generating multiple beams and optical pickup using such diffraction grating |
JP2000123403A (ja) | 1998-10-19 | 2000-04-28 | Victor Co Of Japan Ltd | 光ピックアップ及び光デバイス |
US6195485B1 (en) * | 1998-10-26 | 2001-02-27 | The Regents Of The University Of California | Direct-coupled multimode WDM optical data links with monolithically-integrated multiple-channel VCSEL and photodetector |
TW411454B (en) | 1998-10-28 | 2000-11-11 | Ind Tech Res Inst | Optical read/write head for dual wavelength |
-
1999
- 1999-08-19 JP JP11232136A patent/JP2001056952A/ja active Pending
-
2000
- 2000-07-18 KR KR1020000040908A patent/KR100632860B1/ko not_active IP Right Cessation
- 2000-08-01 CN CN00121786A patent/CN1129123C/zh not_active Expired - Fee Related
-
2005
- 2005-01-04 US US11/028,325 patent/US7292519B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1297974C (zh) * | 2003-07-01 | 2007-01-31 | 夏普株式会社 | 光学拾取装置和包含其的光盘驱动器 |
CN111090038A (zh) * | 2018-10-24 | 2020-05-01 | 三星电子株式会社 | 探测装置及包括探测装置的测试装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20010021094A (ko) | 2001-03-15 |
KR100632860B1 (ko) | 2006-10-16 |
CN1129123C (zh) | 2003-11-26 |
US7292519B2 (en) | 2007-11-06 |
US20050122880A1 (en) | 2005-06-09 |
JP2001056952A (ja) | 2001-02-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130718 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130718 Address after: Tokyo, Japan Patentee after: Hitachi Consumer Electronics Co.,Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Manufacturing Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031126 Termination date: 20130801 |