CN1277138A - Equipment for producing semi-conductor products - Google Patents

Equipment for producing semi-conductor products Download PDF

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Publication number
CN1277138A
CN1277138A CN00120086A CN00120086A CN1277138A CN 1277138 A CN1277138 A CN 1277138A CN 00120086 A CN00120086 A CN 00120086A CN 00120086 A CN00120086 A CN 00120086A CN 1277138 A CN1277138 A CN 1277138A
Authority
CN
China
Prior art keywords
loading
unload station
pay
equipment
transfer system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN00120086A
Other languages
Chinese (zh)
Inventor
J·埃尔格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of CN1277138A publication Critical patent/CN1277138A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

An equipment for producing semiconductor product is provided to transfer semiconductor products efficiently and economically by providing a transfer system provided with a supply system, which travels at the same height as a loading/unloading station in a clean room and which is positioned above the walking height of an operator. A supply system includes a roller conveyor(4) travels above the walking height of an operator and at the same height of a loading/unloading station(6), so that the operator can move freely on a floor(7) of a clean room, under the roller conveyor(4). All loading/unloading stations(6) are positioned at the same height on the floor(7) of the clean room, and in this case the height is three meters in general. The roller conveyor(4) travels immediately in front of each loading/unloading station.

Description

Be used to produce the equipment of semiconductor product
The present invention relates to a kind ofly to be used to produce semiconductor product, especially for the equipment of processed wafer, it has a plurality of pay units and a delivery system that is used to carry semiconductor product at least one decontamination chamber, wherein said pay unit has at least one loading-unload station that is used for loading and unloading semiconductor product respectively.
Such equipment can be used as the equipment of processed wafer especially.This equipment comprises a plurality of pay units, finishes different production processes by these pay units.In these production processes, particularly etching work procedure, wet chemical method, diffusing procedure and various purification method, for example CMP-method (chemical mechanical polishing).For each operation one or more pay units can be set, in these pay units, will finish the different production steps of a production process.
In addition, in such pay unit, also to finish test step, be used for the crudy of the one or more production stages in the production process is checked.
Whole process of production all has strict degree of purity requirement, so all pay units all are set in the decontamination chamber or are arranged in the system that is made of several decontamination chambers.
Transfer system is supplied to each pay unit to box-packed wafer by predetermined batch.After these wafer processs are finished, by this transfer system box is transported again.
This transfer system has a delivery system usually, and this delivery system for example is designed to the form of roller path.In this case, the box that wafer is housed lies on the roller path and transmits.Perhaps, this delivery system can also be made up of continuous conveyor, overhead chain conveyer or allied equipment.
Pay unit has at least one loading-unload station respectively.This loading-unload station is sent into the box that wafer is housed the pay unit from delivery system.After in this pay unit wafer process being finished, loading-unload station also will be moved box and offer delivery system from pay unit.
In the equipment of known type, the loading-unload station of pay unit is in the lower height place on the floor of decontamination chamber, and like this, loading-unload station can be operated by operating personal.Usually, such loading-unload station is installed in the height place of the about 0.9m in top, floor of decontamination chamber.
Usually delivery system abuts against loam cake below, decontamination chamber, at the height place of about 3m.In this case, the box that wafer is housed on delivery system is sent to pay unit always.With jaw or allied equipment box is moved and by an elevator system or by manipulator it lowered from delivery system then, be in the height place of loading-unload station up to box separately.Box returned from pay unit transport to delivery system and also carry out in the corresponding way.
The design and manufacture cost of this vertical transmission between delivery system and the loading-unload station is high and the operation expenditure is very high.In addition, because the expense costliness, so can not realize box to the transporting automatically and transporting of loading-unload station with rational cost, therefore, the loading and unloading of loading-unload station have to be operated by operating personal.
In addition, the transmission of box can also be carried out at lower height place above the floor of decontamination chamber.So transfer system is positioned at the height place of loading-unload station substantially, highly always have about 0.9m this this.If transfer system has a delivery system, this system then must be placed in to stationkeeping in the passage area between the pay unit.Yet the delivery system of An Zhiing can need a very big space like this, and this can cause very big passage width and next can cause undesirable not only big but also expensive decontamination chamber's area.The transmission that can also use vehicle to replace delivery system that the box of wafer is housed in addition.This vehicle normally driverless operation transmits vehicle.But this vehicle is very expensive.In the decontamination chamber, always exist the danger that this vehicle and operating personal collide in addition.
Task of the present invention is to provide a kind of efficient and economic as far as possible semiconductor product transfer system for the equipment of prior art.
In order to reach this purpose, described transfer system has a delivery system, and this delivery system is arranged on the height place of loading-unload station of the walking elevation-over of operating personal in the decontamination chamber.The preferred embodiment of the present invention and suitable variation structure have been described in the dependent claims.
According to the present invention, a transfer system is set, this system has the delivery system of a loading-unload station height place operation in the decontamination chamber.At this, this delivery system is positioned at the walking elevation-over of operating personal, preferably at the about height place of 3m.
The major advantage of this set is that described delivery system and loading-unload station not only are arranged on the radius of action of operating personal, but also is arranged on the vehicle that may travel in the passage of decontamination chamber.Therefore the vehicle that the transmission of by delivery system semiconductor product being carried out can not damage operating personal and travel on clean room floor.In addition advantageously, delivery system is positioned at the height place of the loading-unload station of pay unit.
Therefore,, do not need to be provided with many devices that semiconductor product is vertically transmitted of being used for, thus remarkable cost-cutting for semiconductor product is supplied to each loading-unload station from delivery system.Further advantageously, can not use expensive auxiliary device, semiconductor product be transported a pay unit from delivery system by loading-unload station.Can realize that full automaticity transports semiconductor product from delivery system to each pay unit like this.Oppositely directed transmission is carried out equally in the corresponding way automatically.
Because delivery system can move above the passage of operating personal, so the passage in the decontamination chamber can be rather narrow, and can significantly save the area of decontamination chamber thus.
To set forth the present invention by accompanying drawing below.In the accompanying drawing:
Fig. 1 is the cross-sectional view with decontamination chamber of wafer process equipment.
Fig. 2 is the skiagraph that is provided with the pay unit of delivery system in the decontamination chamber of Fig. 1 in its front.
Fig. 1 has illustrated to describe a kind of section that is used for making the equipment of semiconductor product, and what relate in the present embodiment is a kind of equipment that is used for processed wafer.
This equipment has a plurality of pay units 1.These pay units 1 are used to finish different production stages in the required production process of processed wafer.These production processes are particularly including etching work procedure, wet chemical method, diffusing procedure and purification method.For each production process, the production stage to be performed of corresponding some can be provided with one or more pay units 1.Implement test step but also several pay units 1 can be set, can check the crudy of production stage performed in other pay units 1 by test step at this.
All pay units 1 all are arranged in the decontamination chamber 2, provide wafer by a transfer system to it.Perhaps, these pay units 1 can also be arranged in the system that constitutes by several decontamination chambers 2.
Transfer system mainly is made up of a memory system and a delivery system.
Described memory system is made up of a plurality of memory storages 3, and the wafer transfer is stored in wherein.Memory storage 3 for example can constitute accumulator.
Described delivery system is made up of the system of a roller path 4 in the present embodiment.Perhaps, this delivery system can also be made of continuous conveyor, overhead chain conveyer or allied equipment.Roller path 4 road along the line in decontamination chamber 2 is moved and each pay unit 1 and memory storage 3 is connected.At this, the wafer in the box 5 is transmitted by certain batch by delivery system, and is fed to each pay unit 1 and memory storage 3 or transports from these devices.
At this, pay unit 1 and memory storage 3 have at least one loading-unload station 6 respectively.In addition this loading-unload station 6 also have at least one preferably automatically the osed top access door so that box 5 is transported and is transported.
According to the present invention, delivery system moves at the height place identical with loading-unload station 6 on the walking height of operating personal, so that operating personal can freely walked about on the floor 7 in decontamination chamber 2 below delivery system and the loading-unload station 6.
In principle, each loading-unload station 6 can be in the differing heights place of 2 tops, decontamination chamber.In this case, delivery system is located to move too at various height, but will guarantee like this delivery system before loading-unload station 6 partly is arranged on the height place roughly the same with this loading-unload station 6.
In a particularly preferred form of implementation, all loading-unload stations 6 all are in the sustained height place of 7 tops, floor of decontamination chamber 2, and wherein this highly is typically about 3m.So this delivery system just moves at sustained height place roughly, at this, the mobile of delivery system is chosen such that promptly these systems can be close to before each loading-unload station 6 and pass by.
In case before the box 5 that on delivery system one is equipped with wafer was fed to a loading-unload station 6, this loading-unload station 6 will automatically be transported this box 5 in pay unit 1 or the memory storage 3 always.For a box 5 is transported, can automatically it be transported on the delivery system from loading-unload station 6 equally.For this reason, also be provided with a cross conveyor in a kind of particularly preferred form of implementation, this conveyer is born the transmission task between delivery system and loading-unload station 6.This alongside transfer operation is represented by corresponding two-sided arrow in Fig. 1.
Because the distance between delivery system and the loading-unload station 6 is very little and delivery system and loading-unload station 6 all are in the sustained height place, the design cost that therefore is used for transmission operation between delivery system and the loading-unload station 6 is very little.Particularly can realize this transmission operation with high reliability not using under the artificial situation.
In order between delivery system and loading-unload station 6, to transmit box 5, for example can add a cross conveyor as shown in Figure 2.Fig. 2 has shown a pay unit 1 that has loading-unload station 6, and this loading-unload station is arranged on the height place of the about 3m in 7 tops, floor of decontamination chamber 2.The box 5 that the delivery system that is made of roller path 4 will be equipped with wafer is sent to this pay unit 1, and at this, the preceding side wall apart from pay unit 1 has only very little distance to roller path 4 at the height place of loading-unload station 6.
Roller path 4 is made of the driven roller 8 that two row extend in parallel, and at this, each roller 8 in the row is equidistant one by one settings.The distance between the two row rollers 8 and the width of roller 8 are chosen such that promptly the box 5 that wafer is housed is placed on its lower edge respectively on the one row roller 8.
Be right after above the roller 8 of roller path loading-unload station 6 the door lower edge under.
Before loading-unload station 6, between two row of roller path 4, be mounted with a cross conveyor.This cross conveyor is made of belt conveyer 9 and is fixed on roller path 4 next doors with unshowned anchor fitting.The throughput direction of belt conveyer 9 is at this throughput direction perpendicular to roller path 4.In this transmission of conversion belt conveyer 9 like this, that is, allow belt conveyer 9 on face loading-unload station 6 direction move or outwards move from this loading-unload station.
At this, the height of belt conveyer 9 height level of roller path 4 is relatively regulated.On position shown in Figure 2, be right after above the belt conveyer 9 on roller path 4 under, box 5 is being positioned on the roller path 4 above the roller path 4 at a certain distance like this.
In case before box 5 was come loading-unload station 6 with roller path 4, belt conveyer 9 just was thus lifted to a second place, the top top very little distance of just stretching out roller path 4 of belt conveyer 9 like this.So belt conveyer 9 following correspondingly is in the height place of lower edge of the door of loading-unload station 6.By belt conveyer 9 is promoted on the roller path 4, the box 5 that wafer is housed mentioned from roller path 4 and lie in belt conveyer 9 above on.So the conveying by belt conveyer 9 is moved, box 5 is transported pay unit 1.In the present embodiment, box 5 is delivered on another belt conveyer 10 in pay unit 1.
In pay unit 1, be provided with unshowned conveyer, for example manipulator and allied equipment, these devices individually or by the gross are fed to wafer on the same unshowned process units in pay unit 1.Meanwhile can also in pay unit 1, carry out the particularly vertical transmission operation of wafer by conveyer.
After wafer process is finished, again these wafers are offered belt conveyer 10 in pay unit 1 by conveyer.By cross conveyor the box 5 that wafer is housed is offered delivery system therefrom.At this, in case box 5 enters the desired location of roller path 4 tops, belt conveyer 9 just descends, and box 5 is parked on the two row rollers 8 of roller path 4 again thus.
Shown in Fig. 2 was detailed, pay unit 1 had a maintenance inlet 11, and this inlet for example is made of Yishanmen.Be easy to pay unit is carried out maintenance activity by these maintenance inlet 11 operating personals.
It is upper below loading-unload station 6 at the preceding side wall of pay unit 1 to keep in repair inlet 11 at this.So be arranged on by setting height(from bottom) more than the walking height of operating personal, maintenance inlet 11 and loading-unload station 6 can be arranged on the same side of pay unit 1 with loading-unload station 6.If loading-unload station 6 is positioned at the floor area of decontamination chamber 2, then maintenance inlet 11 for example must be arranged on the parados of pay unit 1.
By this loading-unload station 6 and maintenance inlet 11 are arranged on the setting of the same side of pay unit 1, the location of pay unit 1 in decontamination chamber 2 can greatly save space.
Fig. 1 has described an example.Pay unit 1 is configured to back-to-back each other two row in decontamination chamber 2 there, and delivery system or operating personal are always only from front contact pay unit 1 like this.And need to stay the gap hardly in two pay unit 1 centres that are listed as dos-placement each other, because operating personal there is no need the back side near pay unit 1.Can save the area of decontamination chamber thus significantly.
As clearly shown in Figure 1, pay unit 1 and memory storage 3 in decontamination chamber 2 are all lined up row, at this, between each row the passage 12 that uses for operating personal are arranged.Delivery system is extended above this passage 12, so do not take additional decontamination chamber's area.In addition, delivery system and setting height(from bottom) have guaranteed that passage that operating personal can be below being arranged in it 12 is not subjected to the dried condition of this delivery system when mobile.Equally also be suitable for the vehicle that in decontamination chamber 2, travels along passage 12.
Under normal conditions, the box 5 that wafer is housed in transfer system be transmit automatically and without operating personal.
Yet under special circumstances, also be necessary the box 5 that wafer is housed to be put on the delivery system or from delivery system and move by operating personal.In addition can be in decontamination chamber 2 on the position of regulation, some be set at this unshowned elevator, on the contrary these elevators the box 5 that wafer is housed from the decontamination chamber 2 floor 7 be directed on the delivery system or.These elevators can also have hoistway in floor area in addition.The box 5 that wafer is housed is transported into hoistway by operating personal subsequently or moves from hoistway.Carrying box 5 between elevator and delivery system is that height in delivery system carries out, and preferably finishes automatically by cross conveyor or allied equipment.

Claims (16)

  1. One kind be used to produce semiconductor product, especially for the equipment of processed wafer, it has a plurality of pay units and a transfer system that is used to transmit semiconductor product at least one decontamination chamber, wherein said pay unit has at least one loading-unload station that is used for loading and unloading semiconductor product respectively, it is characterized in that, described transfer system has a delivery system, and this delivery system is arranged on the height place of loading-unload station (6) of the walking elevation-over of operating personal in decontamination chamber (2).
  2. 2. equipment according to claim 1 is characterized in that, the height place of described transfer system about 3m in top, floor (7) of (2) in the decontamination chamber.
  3. 3. according to one of them described equipment of claim 1 and 2, it is characterized in that, semiconductor product is contained in the box (5) and transmits on transfer system, can it be transported in the pay unit by loading-unload station (6) and transport from these pay units in (1) and again.
  4. 4. equipment according to claim 3 is characterized in that, a cross conveyor is set is used for carrying box (5) between the loading-unload station (6) of a transfer system and a pay unit (1).
  5. 5. according to the equipment of one of claim 3 or 4, it is characterized in that, described transfer system is made of roller path (4), wherein roller path (4) has two row respectively and extends in parallel and the driven roller (8) of each interval, box (5) is pressed thereon with its lower edge, and described cross conveyor is made of a belt conveyer (9), and this belt conveyer is arranged between two row of roller path (4), at this, its throughput direction is perpendicular to the throughput direction of transfer system.
  6. 6. equipment according to claim 5 is characterized in that, described belt conveyer (9) can rise to more than the upper limb of roller path (4), so that loading-unload station (6) is transported or transported to box (5).
  7. 7. according to one of them described equipment of claim 4 to 6, it is characterized in that described belt conveyer (9) nestles up that to be arranged on loading-unload station (6) preceding.
  8. 8. according to one of them described equipment of claim 6 and 7, it is characterized in that the top height place that is in the lower edge of affiliated loading-unload station (6) substantially of the cross conveyor that raises up.
  9. 9. according to one of them described equipment of claim 1 to 8, it is characterized in that described pay unit (1) has a maintenance inlet (11), is arranged on the preceding side wall of pay unit (1) with loading-unload station (6) at this this inlet.
  10. 10. equipment according to claim 9 is characterized in that, described maintenance inlet (11) is arranged on the below of loading-unload station (6).
  11. 11. one of them the described equipment according to claim 9 and 10 is characterized in that, two pay units (1) always back-to-back are provided with, and passage (12) adjacency always used with operating personal of the front wall of each pay unit.
  12. 12. one of them the described equipment according to claim 1 to 11 is characterized in that, described transfer system is in the top of the passage (12) of operating personal use.
  13. 13. one of them the described equipment according to claim 1 to 12 is characterized in that, elevator the floor (7) of (2) leads to transfer system from the decontamination chamber.
  14. 14. equipment according to claim 13 is characterized in that, described elevator loads and unloads semiconductor product by operating personal.
  15. 15., it is characterized in that the inside in pay unit (1) is provided with the conveyer that is used for the vertical transfer of semiconductor product according to one of them described equipment of claim 1 to 14.
  16. 16. one of them described equipment according to claim 1 to 15, it is characterized in that, this equipment has one or more memory storages (3) that are used for placing semiconductor product, and said memory storage (3) has the loading-unload station (6) at least one height place that is arranged on transfer system respectively.
CN00120086A 1999-05-19 2000-05-19 Equipment for producing semi-conductor products Pending CN1277138A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19922937.6 1999-05-19
DE19922937 1999-05-19

Publications (1)

Publication Number Publication Date
CN1277138A true CN1277138A (en) 2000-12-20

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ID=7908492

Family Applications (1)

Application Number Title Priority Date Filing Date
CN00120086A Pending CN1277138A (en) 1999-05-19 2000-05-19 Equipment for producing semi-conductor products

Country Status (3)

Country Link
JP (1) JP2000353735A (en)
KR (1) KR20010014928A (en)
CN (1) CN1277138A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101767719B (en) * 2008-12-31 2015-11-25 英属开曼群岛商精曜有限公司 The disposal system of substrate, transmission system and transmission method and mobile transverse chamber
CN106166793A (en) * 2016-07-22 2016-11-30 成都银线电杆有限公司 Efficiently Workshop Production system
CN107640584A (en) * 2017-09-16 2018-01-30 合肥惠科金扬科技有限公司 A kind of delivery cartridge of liquid crystal panel conveying device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100475120B1 (en) * 2002-11-27 2005-03-10 삼성전자주식회사 Fabrication system having double layered clean room for producing semiconductor device
KR100663157B1 (en) * 2004-11-26 2007-01-03 이동헌 Apparatus for transferring cassette of display device
JP2008159784A (en) * 2006-12-22 2008-07-10 Sumitomo Heavy Ind Ltd Stage apparatus
ITMI20122179A1 (en) * 2012-12-19 2014-06-20 Pirelli METHOD TO VERIFY THE CORRECT FORMATION OF HEELS IN A PROCESS AND IN A PLANT TO PACK VEHICLE WHEELS TIRES.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101767719B (en) * 2008-12-31 2015-11-25 英属开曼群岛商精曜有限公司 The disposal system of substrate, transmission system and transmission method and mobile transverse chamber
CN106166793A (en) * 2016-07-22 2016-11-30 成都银线电杆有限公司 Efficiently Workshop Production system
CN106166793B (en) * 2016-07-22 2019-01-18 成都银线电杆有限公司 Efficient workshop production system
CN107640584A (en) * 2017-09-16 2018-01-30 合肥惠科金扬科技有限公司 A kind of delivery cartridge of liquid crystal panel conveying device

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Publication number Publication date
JP2000353735A (en) 2000-12-19
KR20010014928A (en) 2001-02-26

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