CN1274700A - 压电陶瓷材料及由其制成的压电陶瓷烧结体 - Google Patents
压电陶瓷材料及由其制成的压电陶瓷烧结体 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 28
- 229910010293 ceramic material Inorganic materials 0.000 title abstract description 5
- 230000008878 coupling Effects 0.000 claims abstract description 24
- 238000010168 coupling process Methods 0.000 claims abstract description 24
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- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 33
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- 229910052748 manganese Inorganic materials 0.000 claims description 9
- 229910052758 niobium Inorganic materials 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052712 strontium Inorganic materials 0.000 claims description 8
- 229910052726 zirconium Inorganic materials 0.000 claims description 8
- 229920006395 saturated elastomer Polymers 0.000 claims description 7
- 239000002075 main ingredient Substances 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 15
- 239000010955 niobium Substances 0.000 description 14
- 239000011572 manganese Substances 0.000 description 13
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000013068 control sample Substances 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000024287 Areas Species 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910008651 TiZr Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Abstract
本发明的目的是提供能制造压电陶瓷烧结体的压电陶瓷材料,这种压电陶瓷烧结体具有设计窄带滤波器所需的机电耦合系数小、谐振电阻小和谐振频率对温度依赖性小之类的性能,该压电陶瓷材料含有用通式(PbaSrb)(ZrcTidMneNbf)O3表示且组成满足如下关系的主要组分:0.93≤a≤1.01,0.01≤b≤0.04,0.37≤c≤0.47,0.48≤d≤0.58,0.0105≤e≤0.06,0.02≤f≤0.06以及1.05≤2e/f≤2,相对于主要组分还含有大于等于0.003%重量至小于等于0.1%重量的SiO2和大于等于0.003%重量至小于等于0.1%重量的Al2O3的次要组分。
Description
本发明涉及压电陶瓷材料及由其制成的压电陶瓷烧结体。具体地说,本发明涉及适用于需要较低机电耦合系数和较小谐振电阻的压电应用装置的压电陶瓷材料以及用这种压电陶瓷材料制得的压电陶瓷烧结体。
由于Pb[(Mn1/3Nb2/3),Zr,Ti]O3基压电陶瓷材料具有良好的谐振性能,所以它们已广泛用作制造压电应用装置中所用压电陶瓷器件的材料。上述器件包括利用体积波或表面波的滤波器、振荡器和陷波器。
例如日本专利公开5-327397揭示了实际上可用一种压电陶瓷材料制造具有良好谐振性能、谐振性能对温度的依从关系和耐热性的表面波装置。上述的压电陶瓷材料用通式(Pb1-xMex){(Mn1/3Nb2/3)aTibZrc}O3表示,式中Me表示至少一种选自Ca、Ba或Sr的元素,x、a和b满足如下关系:
0.005≤x≤0.10
0.01≤a≤0.14
0.40≤b≤0.60
0.26≤c≤0.59,且
a+b+c=1.00
日本专利公开5-24916揭示了一种改进了电学性能不规则性的{PbSr}{(TiZr)(MnNb)}O3基材料。这种材料含有0.005-0.040%重量SiO2和0.005-0.040%重量Al2O3中的至少一种成分。
然而,常规Pb[(Mn1/3Nb2/3),Zr,Ti]O3基压电陶瓷材料的问题是由于这种材料在饱和极化状态下的机电耦合系数大,所以其在饱和极化状态下不能用于需要较小机电耦合系数的窄带滤波器。另一个问题是当为了减小机电耦合系数使极化度处于饱和状态时,由于谐振电阻的增加而增加滤波器插入损耗。
窄带滤波器的谐振频率的温度稳定性需要优于宽带滤波器。对于这个问题,常规的Pb[(Mn1/3Nb2/3),Zr,Ti]O3基压电陶瓷材料不可能具有窄带滤波器所需的优良温度稳定性。
因此,本发明的一个目的是提供能满足设计窄带滤波器所需这些性能的压电陶瓷材料,特别是能满足机电耦合系数小、谐振电阻小和谐振频率对温度依赖性小之类性能的压电陶瓷材料,以及提供通过烧制这些压电陶瓷材料制成的压电陶瓷烧结体。
在一个方面,本发明提供至少含Pb、Sr、Zr、Mn、Nb、Si和Al的压电陶瓷材料,该压电陶瓷材料含有用通式(PbaSrb)(ZrcTidMneNbr)O3表示且组成满足如下关系的主要组分:0.93≤a≤1.01,0.01≤b≤0.04,0.37≤c≤0.47,0.48≤d≤0.58,0.0105≤e≤0.06,0.02≤f≤0.06以及1.05≤2e/f≤2,相对于主要组分它还含有大于等于0.003%重量至小于等于0.1%重量的SiO2和大于等于0.003%重量至小于等于0.1%重量的Al2O3的次要组分。
本发明的压电陶瓷材料较好在氧气氛中进行烧制。因此,本发明也涉及在氧气氛中烧制上述压电陶瓷材料而制得的压电陶瓷烧结体。
压电陶瓷烧结体较好用于机电耦合系数为饱和极化状态下的80%或更小的不饱和极化状态。
用上述的本发明方法可以制成机电耦合系数小、谐振电阻小和谐振频率对温度依赖性小的压电陶瓷烧结体。用这种适用于滤波器的压电陶瓷烧结体也可制得窄带插入损耗小和通带频率温度稳定性优良的滤波器。
主要组分中的含铅量(a)较好为0.93≤a≤1.01,因为当a小于0.93时,烧结性能就会降低,从而不能制得具有足够密度的烧结体,而当a大于1.01时,烧结体可能变形。
含锶量(b)较好为0.01≤b≤0.04,因为当b小于0.01时,由于极化度的降低使烧结体中的电学性能变得不均匀,而当b大于0.04时,机电耦合系数增加到很大,使烧结体不能用作需有较小机电耦合系数的窄带滤波器中所用的压电陶瓷材料。
当含锆量(c)和含钛量(d)分别超出如下范围时:0.37≤c≤0.47和0.48≤d≤0.58,谐振频率的温度依赖性小的温度范围就偏离滤波器常用的-20℃至80℃的环境温度范围。因此,含锆量(c)和含钛量(d)较好分别为0.37≤c≤0.47和0.48≤d≤0.58,以便制备适用于制造环境温度下温度稳定性好、实用性高的压电陶瓷烧结体的压电陶瓷材料。
含锰量(e)较好为0.0105≤e≤0.06,因为当e小于0.0105时,谐振电阻Zr就要增加,从而提高了滤波器插入损耗,而当e大于0.06,烧结体的绝缘电阻就会降低,从而难以进行极化处理。
含铌量(f)较好为0.02≤f≤0.06,因为当f小于0.02,就会发生不正常的晶粒生长,而当f大于0.06时,烧结温度就会增加到1250℃以上,从而明显促进PbO的挥发,结果引起烧结体变形的问题。
对于含锰量(e)和含铌量(f)的关系,2e/f之比限定在1.05≤2e/f≤2,因为当2e/f之比小于1.05时,谐振频率的温度依赖性就会增加,而2e/f之比大于2时,绝缘电阻就会减小,从而不能进行极化处理。
对于SiO2和Al2O3次要组分,SiO2和Al2O3的含量较好都为大于等于0.003%重量至小于等于0.1%重量,因为当SiO2或Al2O3的含量低于上述范围时,烧结体的机械强度就会不够,从而在以后的烧结体加工中造成损坏,而当它们的含量高于上述范围时,烧结性能会变劣,从而不能制得密实的烧结体,而且会增加谐振电阻Zr。
本发明的压电陶瓷烧结体较好用于机电耦合系数为上述饱和极化状态下的80%或更小的不饱和极化状态。其目的是用降低极化度的方法来获得窄带滤波器所需的低机电耦合系数。本发明的压电陶瓷烧结体较好在氧气氛下烧制而得,因为甚至在氧气氛下烧制烧结体来降低极化度,使机电耦合系数为饱和极化状态下的80%或更低时,也不会增加谐振频率,从而抑制滤波器的插入损耗大大增加。
图1是表示当压电陶瓷烧结体的极化度降低时机电耦合系数k15和谐振电阻Zr之间关系的图。上述的压电陶瓷烧结体具有本发明实施例中制得的3号试样的组成。
图2是表示当在本发明实施例中制得的2号试样中含锰量(e)和含铌量(f)之间的2e/f之比变化时谐振频率的温度依从关系的图。
实施例
制备原料Pb3O4、SrCrO3、ZrO2、TiO2、MnCO3、Nb2O5、Al2O3和SiO2。
按表1中所示的组成对这些原料进行称量,湿研磨混合后,在800-1100℃将这种混合物煅烧4小时。将煅烧后所得的粉末碾碎,加入合适的粘合剂进行造粒,然后经压模制成尺寸为20毫米×30毫米×8.5毫米的长方体模压件。
表1
试样号 | a | b | c | d | e | f | SiO2(%重量) | Al2O3(%重量) |
1*2345* | 0.910.930.981.011.03 | 0.020.020.020.020.02 | 0.4200.4200.4200.4200.420 | 0.5300.5300.5300.5300.530 | 0.020000.020000.020000.020000.02000 | 0.03000.03000.03000.03000.0300 | 0.0200.0200.0200.0200.020 | 0.0200.0200.0200.0200.020 |
6*789* | 1.000.990.960.94 | 0.000.010.040.06 | 0.4200.4200.4200.420 | 0.5300.5300.5300.530 | 0.020000.020000.020000.02000 | 0.03000.03000.03000.0300 | 0.0200.0200.0200.020 | 0.0200.0200.0200.020 |
10*111213* | 0.980.980.980.98 | 0.020.020.020.02 | 0.3500.3700.4700.490 | 0.6000.5800.4800.460 | 0.020000.020000.020000.02000 | 0.03000.03000.03000.0300 | 0.0200.0200.0200.020 | 0.0200.0200.0200.020 |
14*15*16*17*18* | 0.980.980.980.980.98 | 0.020.020.020.020.02 | 0.4350.4350.4350.4350.435 | 0.5490.5490.5490.5490.549 | 0.005000.005250.006700.010000.01033 | 0.01000.01000.01000.01000.0100 | 0.0200.0200.0200.0200.020 | 0.0200.0200.0200.0200.020 |
19*20212223* | 0.980.980.980.980.98 | 0.020.020.020.020.02 | 0.4270.4270.4270.4270.427 | 0.5390.5390.5390.5390.539 | 0.010000.010500.013330.020000.02067 | 0.02000.02000.02000.02000.0200 | 0.0200.0200.0200.0200.020 | 0.0200.0200.0200.0200.020 |
24*252627* | 0.980.980.980.98 | 0.020.020.020.02 | 0.4200.4200.4200.420 | 0.5300.5300.5300.530 | 0.015000.015750.030000.03100 | 0.03000.03000.03000.0300 | 0.0200.0200.0200.020 | 0.0200.0200.0200.020 |
28*29303132* | 0.980.980.980.980.98 | 0.020.020.020.020.02 | 0.3980.3980.3980.3980.398 | 0.5020.5020.5020.5020.502 | 0.030000.031500.040000.060000.06200 | 0.06000.06000.06000.06000.0600 | 0.0200.0200.0200.0200.020 | 0.0200.0200.0200.0200.020 |
33*34*35*36*37* | 0.980.980.980.980.98 | 0.020.020.020.020.02 | 0.3830.3830.3830.3830.383 | 0.4840.4840.4840.4840.484 | 0.040000.042000.053330.080000.08267 | 0.08000.08000.08000.08000.0800 | 0.0200.0200.0200.0200.020 | 0.0200.0200.0200.0200.020 |
38*39404142* | 0.980.980.980.980.98 | 0.020.020.020.020.02 | 0.4200.4200.4200.4200.420 | 0.5300.5300.5300.5300.530 | 0.020000.020000.020000.020000.02000 | 0.03000.03000.03000.03000.0300 | 0.0200.0200.0200.0200.020 | 0.0020.0030.0200.1000.120 |
43*444546* | 0.980.980.980.98 | 0.020.020.020.02 | 0.4200.4200.4200.420 | 0.5300.5300.5300.530 | 0.020000.020000.020000.02000 | 0.03000.03000.03000.0300 | 0.0020.0030.1000.120 | 0.0200.0200.0200.020 |
然后在1050-1250℃和氧气氛中将这些模压件烧制1-5小时,制成烧结体。将这些烧结体重叠和磨光后,通过在80-100℃的硅油浴中对其施加1-3千伏/毫米的电场30-60分钟进行极化处理,从而在烧结体上形成极化电极。
极化处理后,用切割锯沿与烧结体长边方向一致的方向从烧结体上切下尺寸为5.1毫米×1.7毫米×0.3毫米的矩形板。评价每一块按上述方法制得的矩形板经施加纵向振动后所得的压电性能。
在2千伏/毫米电场下极化的试样纵向振动上的机电耦合系数k15(%)、谐振电阻Zr(Ω)、-20℃至80℃温度范围内谐振频率温度系数|fr-TC|(ppm/℃)的绝对值和三点弯曲试验中的弯曲强度(MPa)列于表2中。标有(*)号的试样相当于不包括在本发明范围内的试样。
表2
试样号 | k15(%) | Zr(Ω) | |fr-TC|(ppm/℃) | 弯曲强度(MPa) | 备注 |
1*2345* | ***283031*** | **4.04.13.9*** | ***282527*** | ***120110105*** | 烧结不充分不能加工 |
6*789* | 27283142 | 4.04.03.73.8 | 25242625 | 110110104115 | 谐振频率的分布是3号试样的3.5倍 |
10*111213* | 24283234 | 4.23.93.63.5 | 41353642 | 119115110115 | |
14*15*16*17*18* | *************** | *************** | *************** | *************** | 不能加工不能加工不能加工不能加工不能加工 |
19*20212223* | 28272929*** | 5.34.94.64.2*** | 44342623*** | 107112114110*** | 不能极化 |
24*252627* | 313132*** | 4.54.23.9*** | 423222*** | 110105111*** | 不能极化 |
28*29303132* | 33323234*** | 3.93.93.53.6*** | 41312420*** | 115111114119*** | 不能极化 |
33*34*35*36*37* | *************** | *************** | *************** | *************** | 不能加工不能加工不能加工不能加工不能加工 |
38*39404142* | 3131303028 | 3.73.83.94.57.5 | 2525252525 | 92105110115155 | |
43*444546* | 32312928 | 3.83.74.87.8 | 25252525 | 90107122186 |
对于没有控制烧制气氛和在氧气氛中烧结模压件的情况,图1表示当降低表1所示3号试样的极化度时机电耦合系数k15和谐振电阻Zr之间的关系。
图1清楚地表明,在产生相同机电耦合系数的极化度条件下,在氧气氛下烧制模压件时的谐振电阻Zr小于没有控制烧制气氛时的谐振电阻。因此,当在氧气氛下烧制模压件时可获得谐振电阻低的低损耗材料,从而可通过控制极化度来制造机电耦合系数低的材料。
由表1和表2可知,当含铅量(a)降低到本发明范围以下0.91时,不能获得所需的烧结体,如1号试样所示。另一方面,当含铅量(a)增加到本发明范围以上1.03时,由于烧结体变形很大而不能对烧结体进行加工。因此,含铅量(a)显然较好为0.93≤a≤1.01,以便在实用变形范围内获得密度足够高的烧结体。
所有含锶量(b)为0.01或更高的试样,即6号和7号试样以外的试样都没有实用性问题,因为极化度降低时烧结体内谐振频率的不规则性是在3号对比试样的不规则性的1.5倍之内。然而,含锶量(b)降低到零并不是优选的,因为虽然其含量在本发明的范围内,但极化度降低时烧结体内谐振频率的不规则性是在3号对比试样的不规则性的3.5倍。另一方面,当含锶量(b)超过本发明的范围,达0.06时,该材料就不适用作窄带滤波器中所用的压电陶瓷材料,因为机电耦合系数k15增加了40%以上。因此,含锶量(b)较好为0.01≤b≤0.04。
如10或13号试样所示,当含锆量(c)和含钛量(d)分别超出如下范围时:0.37≤c≤0.47和0.48≤d≤0.58,谐振频率对温度依赖性小的温度范围就偏离滤波器常用的-20℃至80℃的环境温度范围。因此,|fr-TC|的绝对值增加并超过40ppm/℃,这样损害了该陶瓷烧结材料在窄带滤波器中的实用值,因为该材料需要有高精度的谐振频率对温度的依赖关系。因此,c值和d值较好分另别为0.37≤c≤0.47和0.48≤d≤0.58。
由19号试样可知,当含锰量(e)小于0.0105时,插入损耗增加到许可值以外,因为谐振电阻Zr增加至超过5Ω。另一方面,如32号试样所示,当含锰量(e)超过0.06时,烧结体不能用作压电材料,因为烧结体的绝缘电阻降低,使其难于进行极化处理。因此,由上述结果可知,含锰量(e)较好为0.0105≤e≤0.06,以便获得易于进行极化处理和谐振电阻Zr在实用范围内的压电陶瓷烧结体。
如14号至18号试样所示,当含铌量(f)降低到本发明范围以下0.01时,由于不正常的晶粒生长而经常出现粗的晶粒,从而在以后的加工过程中在加工表面上产生明显的缺陷。因此,存在一些工业应用加工性方面的问题。另一方面,如33-37号试样所示,当含铌量(f)增加到超过0.06达0.08时,烧结温度增加到1250℃以上,大大地促进了PbO的蒸发,从而使烧结体变形,以后就难以进行加工。因此,含铌量(f)较好为0.02≤f≤0.06。
图2表明当含锰量(e)和含铌量(f)之间的2e/f之比变化时谐振频率随温度的变化率。
如图2所示,当2e/f之比增加时,谐振频率对温度的依赖性降低。如19、24和28号试样所示,对于要求谐振频率对温度的高精度依赖关系的窄带滤波器材料来说,2e/f之比较好不超过1(该值不包括在本发明的范围内),因为|fr-TC|的绝对值增加至40ppm/℃以上。另一方面,如23、27和32号试样所示,当2e/f之比超过本发明的范围,达2.1时,由于绝缘电阻的减小而不能进行极化处理。因此,为了获得易于进行极化处理和具有良好温度性能的压电陶瓷烧结体,2e/f之比较好为1.05≤2e/f≤2。
如38或43号试样所示,次要组分SiO2或Al2O3的含量较好不小于本发明的范围,因为当烧结体的机械强度降低到100MPa或更低时,会在以后的加工过程中引起损坏。另一方面,如42或46号试样所示,当SiO2或Al2O3的含量大于本发明的范围时,除谐振电阻Zr增加至5Ω以上,烧结性能变差。因此,SiO2和Al2O3的含量较好分别为0.003-0.1%重量。
虽然已参照具体的实施例描述了本发明,但用相同方法制得的压电陶瓷材料和压电陶瓷烧结体并不局限于实施例中所述的压电陶瓷材料和压电陶瓷烧结体,在本发明的范围内可作各种变化。
例如,用本发明压电陶瓷烧结体所作的压电元件振动方式不必局限于纵向振动,也可以施加任何振动方式,包括膨胀振动、垂直振动和表面波。
本发明的压电陶瓷烧结体不仅可用于滤波器,也可用于其它压电应用装置的所有应用领域,如要求有低机电耦合系数的陷波器和振荡器。
虽然指定的氧化物和碳酸盐(如Pb3O4或SrCO3)已用作上述实施例中压电陶瓷材料的原料,但也可使用其它氧化物或最终转变成氧化物的其它化合物。
如上所述,通过烧制本发明的压电陶瓷材料可以获得机电耦合系数小、谐振电阻小和谐振频率对温度依赖性小的压电陶瓷烧结体。因此,通过使用上述的压电陶瓷烧结体可以获得窄带插入损耗小而谐振频率的温度稳定性好的压电元件,如滤波器。
当通过烧制本发明的压电陶瓷材料来获得压电陶瓷烧结体时,可以减少滤波器的插入损耗,而即使在机电耦合系数为饱和极化状态下的80%的不饱和极化状态时也不会使谐振电阻很大。因此,在不降低极化度的条件下,可较好地获得要求机电耦合系数低的窄带滤波器。
Claims (3)
1.一种至少含Pb、Sr、Zr、Mn、Nb、Si和Al的压电陶瓷材料,该压电陶瓷材料含有用通式(PbaSrb)(ZrcTidMneNbf)O3表示且组成满足如下关系的主要组分:
0.93≤a≤1.01
0.01≤b≤0.04
0.37≤c≤0.47
0.48≤d≤0.58
0.0105≤e≤0.06
0.02≤f≤0.06以及
1.05≤2e/f≤2,
其中相对于主要组分含有大于等于0.003%重量至小于等于0.1%重量的SiO2和大于等于0.003%重量至小于等于0.1%重量的Al2O3的次要组分。
2.一种压电陶瓷烧结体,它通过在氧气氛下烧制如权利要求1所述的压电陶瓷材料而得。
3.如权利要求2所述的压电陶瓷烧结体,它处于机电耦合系数低至饱和极化状态下的80%或更低的不饱和极化状态。
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US7045075B2 (en) * | 2000-12-28 | 2006-05-16 | Bosch Automotive Systems Corporation | Ceramic material and piezoelectric element using the same |
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JP5392603B2 (ja) * | 2009-03-13 | 2014-01-22 | 株式会社村田製作所 | 圧電セラミック電子部品の製造方法 |
JP5675503B2 (ja) * | 2011-06-03 | 2015-02-25 | 日本碍子株式会社 | 圧電/電歪素子 |
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