CN1274006C - 插入组件和方法 - Google Patents
插入组件和方法 Download PDFInfo
- Publication number
- CN1274006C CN1274006C CNB028132343A CN02813234A CN1274006C CN 1274006 C CN1274006 C CN 1274006C CN B028132343 A CNB028132343 A CN B028132343A CN 02813234 A CN02813234 A CN 02813234A CN 1274006 C CN1274006 C CN 1274006C
- Authority
- CN
- China
- Prior art keywords
- contact
- arm
- assembly
- plate
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/897,332 | 2001-07-02 | ||
| US09/897,332 US6730134B2 (en) | 2001-07-02 | 2001-07-02 | Interposer assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1529901A CN1529901A (zh) | 2004-09-15 |
| CN1274006C true CN1274006C (zh) | 2006-09-06 |
Family
ID=25407777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028132343A Expired - Lifetime CN1274006C (zh) | 2001-07-02 | 2002-05-03 | 插入组件和方法 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US6730134B2 (enExample) |
| EP (1) | EP1402563B1 (enExample) |
| JP (1) | JP4116539B2 (enExample) |
| KR (1) | KR100899518B1 (enExample) |
| CN (1) | CN1274006C (enExample) |
| AT (1) | ATE447247T1 (enExample) |
| BR (1) | BR0210485A (enExample) |
| CA (1) | CA2447814C (enExample) |
| DE (1) | DE60234182D1 (enExample) |
| MX (1) | MXPA03011230A (enExample) |
| WO (1) | WO2003005419A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463873A (zh) * | 2014-09-22 | 2017-02-22 | 安芬诺尔互连系统股份有限公司 | 插入器组件和方法 |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070020960A1 (en) * | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
| US7114961B2 (en) | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
| US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
| US7597561B2 (en) | 2003-04-11 | 2009-10-06 | Neoconix, Inc. | Method and system for batch forming spring elements in three dimensions |
| US7113408B2 (en) * | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
| US7628617B2 (en) | 2003-06-11 | 2009-12-08 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
| US7056131B1 (en) | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
| US8584353B2 (en) | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
| US20050120553A1 (en) * | 2003-12-08 | 2005-06-09 | Brown Dirk D. | Method for forming MEMS grid array connector |
| US7758351B2 (en) | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
| US6869290B2 (en) * | 2003-06-11 | 2005-03-22 | Neoconix, Inc. | Circuitized connector for land grid array |
| TW572403U (en) * | 2003-06-25 | 2004-01-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
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| US20050227510A1 (en) * | 2004-04-09 | 2005-10-13 | Brown Dirk D | Small array contact with precision working range |
| US6832917B1 (en) * | 2004-01-16 | 2004-12-21 | Intercon Systems, Inc. | Interposer assembly |
| US6981879B2 (en) | 2004-03-18 | 2006-01-03 | International Business Machines Corporation | Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture |
| US7025601B2 (en) * | 2004-03-19 | 2006-04-11 | Neoconix, Inc. | Interposer and method for making same |
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| US7347698B2 (en) | 2004-03-19 | 2008-03-25 | Neoconix, Inc. | Deep drawn electrical contacts and method for making |
| US7383632B2 (en) | 2004-03-19 | 2008-06-10 | Neoconix, Inc. | Method for fabricating a connector |
| US7189079B2 (en) * | 2004-05-28 | 2007-03-13 | Molex Incorporated | Electro-formed ring interconnection system |
| DE602005003351T2 (de) * | 2004-05-28 | 2008-09-11 | Molex Inc., Lisle | Flexibler scrub-ring-kontakt |
| US20060000642A1 (en) * | 2004-07-01 | 2006-01-05 | Epic Technology Inc. | Interposer with compliant pins |
| US7354276B2 (en) * | 2004-07-20 | 2008-04-08 | Neoconix, Inc. | Interposer with compliant pins |
| US7048549B1 (en) | 2005-03-04 | 2006-05-23 | Fci Americas Technology, Inc. | Dual compression contact and interposer connector comprising same |
| KR100725542B1 (ko) * | 2005-12-01 | 2007-06-08 | 삼성전자주식회사 | 인터포저 조립체 |
| US7357644B2 (en) * | 2005-12-12 | 2008-04-15 | Neoconix, Inc. | Connector having staggered contact architecture for enhanced working range |
| US7381060B2 (en) * | 2006-05-25 | 2008-06-03 | Lotes Co., Ltd. | Electrical connector array |
| US7402049B2 (en) * | 2006-08-24 | 2008-07-22 | Hon Hai Precision Ind. Co., Ltd. | Contact for an interposer-type connector array |
| US20080293308A1 (en) * | 2007-05-24 | 2008-11-27 | Tribotek, Inc. | Pivoting wafer connector |
| US7695286B2 (en) | 2007-09-18 | 2010-04-13 | Delaware Capital Formation, Inc. | Semiconductor electromechanical contact |
| JP5064205B2 (ja) * | 2007-12-27 | 2012-10-31 | タイコエレクトロニクスジャパン合同会社 | コンタクトおよびインタポーザ |
| JP5334997B2 (ja) * | 2008-01-17 | 2013-11-06 | アンフェノル・コーポレーション | インターポーザ・アセンブリ及び方法 |
| US7806699B2 (en) * | 2008-01-31 | 2010-10-05 | Methode Electornics, Inc. | Wound coil compression connector |
| US7794235B2 (en) | 2008-01-31 | 2010-09-14 | Methode Electronics, Inc. | Continuous wireform connector |
| US7806737B2 (en) * | 2008-02-04 | 2010-10-05 | Methode Electronics, Inc. | Stamped beam connector |
| US7775804B2 (en) | 2008-04-15 | 2010-08-17 | Amphenol Corporation | Interposer assembly with flat contacts |
| US8263879B2 (en) | 2009-11-06 | 2012-09-11 | International Business Machines Corporation | Axiocentric scrubbing land grid array contacts and methods for fabrication |
| US8007287B1 (en) * | 2010-03-22 | 2011-08-30 | Tyco Electronics Corporation | Connector system having contact overlapping vias |
| JP5788166B2 (ja) * | 2010-11-02 | 2015-09-30 | 新光電気工業株式会社 | 接続端子構造及びその製造方法、並びにソケット |
| JP2012248812A (ja) * | 2011-05-31 | 2012-12-13 | Sumitomo Electric Ind Ltd | 半導体光集積素子の製造方法 |
| US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
| US8672688B2 (en) * | 2012-01-17 | 2014-03-18 | International Business Machines Corporation | Land grid array interposer with compressible conductors |
| US8758026B2 (en) | 2012-02-06 | 2014-06-24 | Touchsensor Technologies, Llc | System for connecting a first substrate to a second substrate |
| US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
| DE102013213497A1 (de) * | 2013-05-24 | 2014-11-27 | Continental Teves Ag & Co. Ohg | Verfahren zur Fertigung eines Kontaktelements, Kontaktelement sowie dessen Verwendung |
| TWM468808U (zh) * | 2013-06-07 | 2013-12-21 | Kingston Digital Inc | 連接器及電子裝置 |
| KR101566365B1 (ko) * | 2014-05-20 | 2015-11-05 | 주식회사 기가레인 | 접속단자 |
| JP7142425B2 (ja) | 2017-10-23 | 2022-09-27 | タイコエレクトロニクスジャパン合同会社 | インタポーザ組立体 |
| CN108306138A (zh) * | 2018-01-09 | 2018-07-20 | 番禺得意精密电子工业有限公司 | 电连接器 |
| CN117080801A (zh) | 2018-07-20 | 2023-11-17 | 富加宜(美国)有限责任公司 | 具有反冲件的高频连接器 |
| WO2020150235A1 (en) | 2019-01-14 | 2020-07-23 | Amphenol Corporation | Small form factor interposer |
| WO2020150218A1 (en) | 2019-01-14 | 2020-07-23 | Amphenol Corporation | Midboard cable termination assembly |
| JP7365099B2 (ja) * | 2019-07-23 | 2023-10-19 | タイコエレクトロニクスジャパン合同会社 | インターポーザ |
| TWI693414B (zh) * | 2019-09-10 | 2020-05-11 | 矽品精密工業股份有限公司 | 檢測設備及其測試裝置 |
| CN113258325A (zh) | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
| US12469994B2 (en) | 2021-10-28 | 2025-11-11 | Amphenol Corporation | High performance interposer |
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| FR2809871B1 (fr) * | 2000-06-05 | 2002-07-19 | Itt Mfg Entpr S Inc | Connecteur electrique a lames de contact perfectionnees pour le raccordement d'une carte a circuit(s) integre(s) |
-
2001
- 2001-07-02 US US09/897,332 patent/US6730134B2/en not_active Expired - Lifetime
-
2002
- 2002-05-03 EP EP02725900A patent/EP1402563B1/en not_active Expired - Lifetime
- 2002-05-03 WO PCT/US2002/013940 patent/WO2003005419A1/en not_active Ceased
- 2002-05-03 KR KR1020037017192A patent/KR100899518B1/ko not_active Expired - Lifetime
- 2002-05-03 BR BRPI0210485-7A patent/BR0210485A/pt not_active IP Right Cessation
- 2002-05-03 CA CA2447814A patent/CA2447814C/en not_active Expired - Lifetime
- 2002-05-03 MX MXPA03011230A patent/MXPA03011230A/es active IP Right Grant
- 2002-05-03 AT AT02725900T patent/ATE447247T1/de not_active IP Right Cessation
- 2002-05-03 CN CNB028132343A patent/CN1274006C/zh not_active Expired - Lifetime
- 2002-05-03 DE DE60234182T patent/DE60234182D1/de not_active Expired - Lifetime
- 2002-05-03 JP JP2003511288A patent/JP4116539B2/ja not_active Expired - Lifetime
-
2003
- 2003-04-04 US US10/407,040 patent/US6905343B1/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463873A (zh) * | 2014-09-22 | 2017-02-22 | 安芬诺尔互连系统股份有限公司 | 插入器组件和方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE60234182D1 (de) | 2009-12-10 |
| EP1402563A4 (en) | 2007-04-11 |
| MXPA03011230A (es) | 2004-02-26 |
| JP4116539B2 (ja) | 2008-07-09 |
| BR0210485A (pt) | 2006-05-23 |
| WO2003005419A1 (en) | 2003-01-16 |
| US20030003784A1 (en) | 2003-01-02 |
| EP1402563A1 (en) | 2004-03-31 |
| EP1402563B1 (en) | 2009-10-28 |
| US6905343B1 (en) | 2005-06-14 |
| CA2447814A1 (en) | 2003-01-16 |
| ATE447247T1 (de) | 2009-11-15 |
| KR20040020949A (ko) | 2004-03-09 |
| KR100899518B1 (ko) | 2009-05-27 |
| CA2447814C (en) | 2010-01-26 |
| US6730134B2 (en) | 2004-05-04 |
| JP2004534366A (ja) | 2004-11-11 |
| CN1529901A (zh) | 2004-09-15 |
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