KR20040020949A - 인터포저 조립체 및 방법 - Google Patents
인터포저 조립체 및 방법 Download PDFInfo
- Publication number
- KR20040020949A KR20040020949A KR10-2003-7017192A KR20037017192A KR20040020949A KR 20040020949 A KR20040020949 A KR 20040020949A KR 20037017192 A KR20037017192 A KR 20037017192A KR 20040020949 A KR20040020949 A KR 20040020949A
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- contacts
- interposer assembly
- pair
- corner
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (16)
- 조립체의 위와 아래에 위치된 기판들 상의 접속 패드와의 중복된 전기적인 연결을 형성하기 위한 인터포저 조립체이며,a) 상부 및 바닥 측면과, 플레이트의 두께를 통해 연장되는 복수의 통로를 갖는 절연 플레이트와,b) 각각 상기 통로들 중 하나 내에 배치된 복수의 금속 접속체를 포함하고,각각의 접속체는 플레이트의 상부 측면에서의 이격된 접점의 제1 쌍과, 플레이트의 바닥 측면에서의 이격된 접점의 제2 쌍과, 상기 제1 쌍의 접점과 상기 제2 쌍의 접점 사이에서 연장되는 스프링부를 포함하고,상기 스프링부는 스프링부가 응력을 받지 않을 때 상기 접점 쌍들을 플레이트의 두께보다 더 큰 거리로 이격시키고,각각의 접점 쌍은 기판 상의 접속 패드와의 중복된 전기적인 연결을 형성하는 것을 특징으로 하는 인터포저 조립체.
- 제1항에 있어서, 각각의 접속체 내에서, 각각의 접점 쌍의 접점들은 접속체를 가로질러 측방향으로 이격되고 접속체 위로 연장되는 것을 특징으로 하는 인터포저 조립체.
- 제1항 또는 제2항에 있어서, 각각의 접점은 라운딩된 코너를 포함하는 것을특징으로 하는 인터포저 조립체.
- 상기 항들 중 어느 한 항에 있어서, 각각의 접속체는 전단 원주 모서리를 갖는 균일한 두께의 스트립 스톡으로부터 형성되고, 각각의 접점은 상기 원주 모서리의 코너 상에 위치되는 것을 특징으로 하는 인터포저 조립체.
- 상기 항들 중 어느 한 항에 있어서, 각각의 스프링부는 중심부와 한 쌍의 비임을 포함하고, 각각의 비임은 중심부와 한 쌍의 접점 사이에 위치되고, 상기 비임은 상기 통로 내로 탄성적으로 구부러질 수 있는 것을 특징으로 하는 인터포저 조립체.
- 상기 항들 중 어느 한 항에 있어서, 각각의 접점은 비임의 일 측면으로 구부러지는 것을 특징으로 하는 인터포저 조립체.
- 제6항에 있어서, 각각의 접점은 모서리 코너의 길이를 따라 라운딩된 것을 특징으로 하는 인터포저 조립체.
- 제7항에 있어서, 상기 라운딩된 코너는 약 0.0152 내지 0.0254 mm(0.0006 내지 0.0010 인치)의 횡방향 곡률 반경을 갖는 것을 특징으로 하는 인터포저 조립체.
- 제7항에 있어서, 각각의 접속체는 중심부의 각각의 측면에 대해 대칭인 것을 특징으로 하는 인터포저 조립체.
- 상기 항들 중 어느 한 항에 있어서, 상기 스트립 스톡은 약 0.0432 mm(0.0017 인치)의 두께를 갖는 것을 특징으로 하는 인터포저 조립체.
- 상기 항들 중 어느 한 항에 있어서, 플레이트는 각각의 통로 내로 연장되는 돌출부를 포함하고, 각각의 접속체는 접속체를 통로 내에 보유하도록 돌출부의 대향 측면 상에 위치되는 두 개의 보유부를 포함하는 것을 특징으로 하는 인터포저 조립체.
- 제1항에 있어서, 각각의 접속체는 대향 전단 모서리를 포함하고, 각각의 접점은 라운딩된 전단 모서리 코너를 포함하는 것을 특징으로 하는 인터포저 조립체.
- 제12항에 있어서, 각각의 접점은 구부러진 돌출부를 포함하는 것을 특징으로 하는 인터포저 조립체.
- 접속 패드와의 중복된 전기적인 연결을 형성하기 위한 스프링 접속체를 제조하는 방법이며,a) 원주 모서리, 모서리 코너, 및 대향 단부를 갖는 예비 성형품을 형성하도록 균일한 두께의 금속 스톡의 스트립으로부터 예비 성형품을 절단하는 단계와,b) 각각의 단부에서 한 쌍의 인접한 접속 표면을 형성하도록 각각의 예비 성형품 단부에서 하나의 모서리 코너를 라운딩하는 단계와,c) 각각의 단부에서 두 개의 이격된 접점을 형성하기 위해 각각의 단부의 접속 표면을 예비 성형품의 일 측면에 위치시키도록 예비 성형품을 구부리는 단계를 포함하는 것을 특징으로 하는 방법.
- 제14항에 있어서, d) 아치형 비임을 형성하도록 예비 성형품을 접점으로부터 멀리 구부리는 단계를 포함하는 것을 특징으로 하는 방법.
- 제14항에 있어서, e) 상기 접점의 모서리 코너를 그의 길이를 따라 라운딩하는 단계를 포함하는 것을 특징으로 하는 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/897,332 | 2001-07-02 | ||
US09/897,332 US6730134B2 (en) | 2001-07-02 | 2001-07-02 | Interposer assembly |
PCT/US2002/013940 WO2003005419A1 (en) | 2001-07-02 | 2002-05-03 | Interposer assembly and method |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040020949A true KR20040020949A (ko) | 2004-03-09 |
KR100899518B1 KR100899518B1 (ko) | 2009-05-27 |
Family
ID=25407777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037017192A KR100899518B1 (ko) | 2001-07-02 | 2002-05-03 | 인터포저 조립체 및 방법 |
Country Status (11)
Country | Link |
---|---|
US (2) | US6730134B2 (ko) |
EP (1) | EP1402563B1 (ko) |
JP (1) | JP4116539B2 (ko) |
KR (1) | KR100899518B1 (ko) |
CN (1) | CN1274006C (ko) |
AT (1) | ATE447247T1 (ko) |
BR (1) | BR0210485A (ko) |
CA (1) | CA2447814C (ko) |
DE (1) | DE60234182D1 (ko) |
MX (1) | MXPA03011230A (ko) |
WO (1) | WO2003005419A1 (ko) |
Cited By (2)
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KR100725542B1 (ko) * | 2005-12-01 | 2007-06-08 | 삼성전자주식회사 | 인터포저 조립체 |
KR101460839B1 (ko) * | 2008-01-17 | 2014-11-11 | 암페놀 코포레이션 | 인터포저 조립체 및 방법 |
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2001
- 2001-07-02 US US09/897,332 patent/US6730134B2/en not_active Expired - Lifetime
-
2002
- 2002-05-03 AT AT02725900T patent/ATE447247T1/de not_active IP Right Cessation
- 2002-05-03 KR KR1020037017192A patent/KR100899518B1/ko active IP Right Grant
- 2002-05-03 BR BRPI0210485-7A patent/BR0210485A/pt not_active IP Right Cessation
- 2002-05-03 CA CA2447814A patent/CA2447814C/en not_active Expired - Lifetime
- 2002-05-03 EP EP02725900A patent/EP1402563B1/en not_active Expired - Lifetime
- 2002-05-03 JP JP2003511288A patent/JP4116539B2/ja not_active Expired - Lifetime
- 2002-05-03 CN CNB028132343A patent/CN1274006C/zh not_active Expired - Lifetime
- 2002-05-03 MX MXPA03011230A patent/MXPA03011230A/es active IP Right Grant
- 2002-05-03 DE DE60234182T patent/DE60234182D1/de not_active Expired - Lifetime
- 2002-05-03 WO PCT/US2002/013940 patent/WO2003005419A1/en active Application Filing
-
2003
- 2003-04-04 US US10/407,040 patent/US6905343B1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100725542B1 (ko) * | 2005-12-01 | 2007-06-08 | 삼성전자주식회사 | 인터포저 조립체 |
KR101460839B1 (ko) * | 2008-01-17 | 2014-11-11 | 암페놀 코포레이션 | 인터포저 조립체 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
EP1402563A4 (en) | 2007-04-11 |
MXPA03011230A (es) | 2004-02-26 |
CA2447814C (en) | 2010-01-26 |
JP4116539B2 (ja) | 2008-07-09 |
DE60234182D1 (de) | 2009-12-10 |
WO2003005419A1 (en) | 2003-01-16 |
US6730134B2 (en) | 2004-05-04 |
US20030003784A1 (en) | 2003-01-02 |
JP2004534366A (ja) | 2004-11-11 |
KR100899518B1 (ko) | 2009-05-27 |
ATE447247T1 (de) | 2009-11-15 |
CN1529901A (zh) | 2004-09-15 |
BR0210485A (pt) | 2006-05-23 |
US6905343B1 (en) | 2005-06-14 |
CA2447814A1 (en) | 2003-01-16 |
EP1402563B1 (en) | 2009-10-28 |
EP1402563A1 (en) | 2004-03-31 |
CN1274006C (zh) | 2006-09-06 |
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