BR0210485A - conjunto de contato e método de fazer um contato de mola para formar conexões elétricas redundantes com uma pastilha de contato - Google Patents

conjunto de contato e método de fazer um contato de mola para formar conexões elétricas redundantes com uma pastilha de contato

Info

Publication number
BR0210485A
BR0210485A BRPI0210485-7A BR0210485A BR0210485A BR 0210485 A BR0210485 A BR 0210485A BR 0210485 A BR0210485 A BR 0210485A BR 0210485 A BR0210485 A BR 0210485A
Authority
BR
Brazil
Prior art keywords
contact
electrical connections
making
pad
redundant electrical
Prior art date
Application number
BRPI0210485-7A
Other languages
English (en)
Inventor
Douglas A Neidich
Original Assignee
Intercon Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intercon Systems Inc filed Critical Intercon Systems Inc
Publication of BR0210485A publication Critical patent/BR0210485A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Die Bonding (AREA)

Abstract

"CONJUNTO DE CONTATO E MéTODO DE FAZER UM CONTATO DE MOLA PARA FORMAR CONEXõES ELéTRICAS REDUNDANTES COM UMA PASTILHA DE CONTATO". Um conjunto intercalador (10) inclui uma placa dielétrica (12) que possui uma pluralidade de passagens de contato (14) que se estendem através da placa, com um contato (20) em cada passagem. Cada contato inclui um par de pontos de contato espaçados lateralmente (50) no topo e na base da placa. A prensagem do conjunto intercalador entre dois substratos (86) coloca os pontos de contato em cada braço de mola (42) em encaixe com uma pastilha (84), dobra elasticamente os contados e forma conexões elétricas corrediças de alta pressão redundantes entre os pontos de contato e as pastilhas.
BRPI0210485-7A 2001-07-02 2002-05-03 conjunto de contato e método de fazer um contato de mola para formar conexões elétricas redundantes com uma pastilha de contato BR0210485A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/897,332 US6730134B2 (en) 2001-07-02 2001-07-02 Interposer assembly
PCT/US2002/013940 WO2003005419A1 (en) 2001-07-02 2002-05-03 Interposer assembly and method

Publications (1)

Publication Number Publication Date
BR0210485A true BR0210485A (pt) 2006-05-23

Family

ID=25407777

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0210485-7A BR0210485A (pt) 2001-07-02 2002-05-03 conjunto de contato e método de fazer um contato de mola para formar conexões elétricas redundantes com uma pastilha de contato

Country Status (11)

Country Link
US (2) US6730134B2 (pt)
EP (1) EP1402563B1 (pt)
JP (1) JP4116539B2 (pt)
KR (1) KR100899518B1 (pt)
CN (1) CN1274006C (pt)
AT (1) ATE447247T1 (pt)
BR (1) BR0210485A (pt)
CA (1) CA2447814C (pt)
DE (1) DE60234182D1 (pt)
MX (1) MXPA03011230A (pt)
WO (1) WO2003005419A1 (pt)

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KR101566365B1 (ko) * 2014-05-20 2015-11-05 주식회사 기가레인 접속단자
KR101918833B1 (ko) * 2014-09-22 2018-11-14 암페놀 인터콘 시스템즈, 아이엔씨. 인터포저 조립체 및 방법
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CN108306138A (zh) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 电连接器
CN110739585B (zh) 2018-07-20 2023-09-05 富加宜（美国）有限责任公司 具有反冲件的高频连接器
CN113491035A (zh) 2019-01-14 2021-10-08 安费诺有限公司 中板线缆端接组件
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Also Published As

Publication number Publication date
EP1402563A1 (en) 2004-03-31
EP1402563A4 (en) 2007-04-11
CA2447814C (en) 2010-01-26
US6905343B1 (en) 2005-06-14
CA2447814A1 (en) 2003-01-16
US6730134B2 (en) 2004-05-04
MXPA03011230A (es) 2004-02-26
KR20040020949A (ko) 2004-03-09
CN1529901A (zh) 2004-09-15
JP4116539B2 (ja) 2008-07-09
CN1274006C (zh) 2006-09-06
US20030003784A1 (en) 2003-01-02
DE60234182D1 (de) 2009-12-10
EP1402563B1 (en) 2009-10-28
ATE447247T1 (de) 2009-11-15
WO2003005419A1 (en) 2003-01-16
JP2004534366A (ja) 2004-11-11
KR100899518B1 (ko) 2009-05-27

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFIRO O PEDIDO DE ACORDO COM O ART .8O COMBINADO COM ART. 13 DA LPI

B12B Appeal against refusal [chapter 12.2 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]