CN1251866A - 蒸镀装置 - Google Patents
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Abstract
一种用于在薄膜镀覆设备中在一个薄膜(8)上蒸镀上成长条形状的分离剂条的蒸镀装置,它具有一个用电加热器(5)加热的分离剂蒸发容器和一个具有将所产生的分离剂蒸汽引向薄膜(8)的喷口(7)的喷管体(3)。喷管体(3)被设计成空心体,蒸发容器(1)借助一个截流装置(4)可截断地与喷管体(3)相连。
Description
本发明涉及一种在薄膜镀覆设备中在薄膜上蒸镀上长条形状的分离剂条的蒸镀装置，它具有一个用电加热器加热的分离剂蒸发容器和一个具有将所产生的分离剂蒸汽引向薄膜的喷口的喷管体。
一种现有技术的蒸镀装置是DE4309717的主题。此文献所述的蒸镀装置由一个作为蒸发容器的平放圆筒构成，它在面向薄膜的侧面上具有裂缝，所述裂缝被一个设计成压板形式的喷管体盖住。沿此压板传送待蒸镀膜。因此，蒸发容器长度必须至少和薄膜宽度一样。为在尤其是为了装入新的一卷备用待镀覆薄膜而本来灌满镀覆设备时才又必须补充分离剂，则将蒸发容器体积设计得如此大，以便存于容器中的贮存分离剂够用。
这种已知蒸镀装置的缺点是，由于蒸发容器具有大量的贮存分离剂，因而在灌满容器和随后将镀覆设备抽空时完全无用地蒸发了比较多的分离剂，并且通过冷凝润湿了设备部件。在这种情况下要考虑，分离剂沸腾温度在抽空时因降低的压力而降低，因此在没有相应地减弱蒸发容器的加热时，蒸发量增加了。这是由于蒸镀装置容积大而在实践中可能不够快。已知蒸镀装置的另一个缺点是，蒸镀装置的加热周期因贮存分离剂多且蒸镀装置体积庞大而不希望地慢长，结果工作准备时间相应地慢长。
本发明的任务是如此设计上述类型的蒸镀装置，即在镀覆设备灌注和抽空时分离剂损失尽可能地低，并且尽可能快速地使蒸镀装置作好准备工作。
根据本发明，这些问题是如此解决的，即喷管体被设计成空心体，蒸发容器借助一个截流装置可截断地与喷管体相连。
由于根据本发明将蒸发容器可截断地与喷管体相连并将其设计成独立构件，所以如果不需要薄膜冷凝蒸气，则人们可以成本低地可靠阻止蒸气流出蒸镀装置。因此，人们可以在灌注和抽空镀覆设备时防止蒸汽流入设备并因而冷凝在设备部分上，由此可以明显降低在镀覆过程中的分离剂用量。在空间上分开蒸发容器和喷管体防止了分离剂雾气或其他不洁物通过不受控制的冷凝而出现在薄膜上。另外，人们可以通过连续加热蒸发容器而使蒸镀装置始终保持准备工作状态。在起用设备时，为了紧随其后地使蒸汽流向待处理薄膜，人们只需要开启截流装置就行了。本发明的蒸镀装置尤其适用于生产电容器箔片。代替在薄膜上镀覆长条状的分离剂，人们还可以给可截断的蒸发容器配备一个常见的样片座，以便在薄膜上给纵向中断的表面镀覆上分离剂。这样的一种具有蒸发容器和样片座的布局例如在DE4311581中示出了。由于根据本发明地分开了蒸发容器和喷管体，所以蒸发容器不需要具有待镀覆薄膜的宽度。因此，它可以是体积特别小的，由此可以根据改变的工艺条件如金属蒸汽比例波动或薄膜速度波动来快速改变蒸发率。人们例如可以借助本发明通过改变蒸发容器温度来准确调节镀覆分离剂条的宽度。
如果喷管体被设计成平放的圆筒，则可以与目前的蒸发容器外壳相一致地设计喷管体。
当根据本发明的另一个改进方案将蒸发容器布置在喷管体下面且通过一条具有截流阀的管路连接喷管体和蒸发容器时，人们可以将指定用于管路的截流阀用作截流装置。这样的管路截流阀即使在高真空下(其在工作过程中存在于镀覆设备中)也能可靠地工作。
蒸发容器可以是体积特别小的，由此当一个装有分离液的贮存容器与蒸发容器相连以便将分离液补注入蒸发容器中时，蒸镀装置的功率调节能够特别快速地做出反应。
当贮存容器通过一条补注管路和一条压力补偿管路与蒸发容器相连时，蒸发容器的分离液补注可以在设备工作时进行。
当按本发明的一个改进贮存容器被布置得高于蒸发容器且一个截流阀位于补注管路中时，分离液补充可以根据要求只通过开启截流阀就可以实现了，而不用强制输送分离液。
当根据本发明的另一个实施例地将贮存容器和蒸发容器布置在同一高度上并且补注管路是永久开放的时候，补液无须操作截流阀地也可以连续地进行。
当喷口具有矩形横截面时，蒸镀装置的用油特别少。另外，由这样的喷口形状在待镀覆的薄膜上形成了较少的余油和特别好的镀覆区棱锋。
喷管体具有一个电热器，由此可以简单地避免蒸汽冷凝在喷管体中。
本发明允许有各种实施例。为了继续说明本发明的原理，示意地在附图中示出了其中两个实施例并在下文中对其进行描述，其中：
图1是本发明蒸镀装置的透视图；
图2是蒸镀装置的第二实施例的侧视图。
图1所示的蒸镀装置具有一个蒸发容器1，它通过一条管路2与喷管体3相连。在管路2中连入了一个截流装置4，由此可以防止蒸汽从蒸发容器1流入喷管体3。
蒸发容器1具有一个电加热器5并且为了调节温度和进而调节分离剂率而具有一个温度探头6。
喷管体3在其上表面具有一列连续的且横截面呈矩形的喷口7，分离剂蒸汽通过此喷口流向虚线所示的薄膜8并通过冷凝而在薄膜上形成了沿薄膜8纵向延伸的条。此条在随后的镀覆过程中未被涂上金属，因为分离剂在镀覆过程中蒸发并由此防止了金属镀覆。如图所示，薄膜8在喷口7区域内接触喷管体3并且通过其一个很小的外周面区包绕喷管体。为了加热喷管体3，可以使电流流经其外壳。但是也可以间接加热喷管体3，这是为了避免流入喷管体的蒸气冷凝在喷管体3中。
蒸发容器1可以被设计成大容积的容器，从而将充入容器中的贮存分离剂至少足够一次在工作周期内要镀覆的料量。但是，也可以设置一个未受加热的且充有分离液的贮存容器9，它通过补注管路10与蒸发容器1相连。在图1所示的实施例中，在补注管路10中接入一个截流阀11。气密地封闭贮存容器9，但它在其分离液液面上方通过一条压力补偿管路12与蒸发容器1上侧面相连。人们将贮存容器9布置得高于蒸发容器1，因此，分离液在开启截流阀11之后流出贮存容器9而流入蒸发容器1。贮存容器9允许具有很少分离液的蒸发容器1仍然工作并且在工作过程中允许分离液随后流入蒸发容器1。
在图2的实施例中，蒸发容器1和贮存容器9处于同一高度上。因此，人们可以省去补注管路10中的截流阀。和在上述实施例中一模一样地，压力补偿管路12总是开启的。液体液面通过补注管路10而在蒸发容器1和贮存容器9中总是一样高。为了改变蒸发率不需要加热所有分离液，只要或多或少地加热蒸发容器1中的少量分离液就行了。
附图标记一览表1-蒸发容器；2-管路；3-喷管体；4-截流装置；5-加热器；6-温度探头；7-喷口；8-薄膜；9-贮存容器；10-补注管路；11-截流阀；12-压力补偿管路；
Claims (9)
1.一种用于在薄膜镀覆设备中在一个薄膜上蒸镀上成长条形状的分离剂条的蒸镀装置，它具有一个用电加热器加热的分离剂蒸发容器和一个具有将所产生的分离剂蒸汽引向薄膜的喷口的喷管体，其特征在于，喷管体(3)被设计成空心体，蒸发容器(1)借助一个截流装置(4)可截断地与喷管体(3)相连。
2.如权利要求1所述的蒸镀装置，其特征在于，喷管体(3)被设计成平放的圆筒。
3.如权利要求1和2所述的蒸镀装置，其特征在于，蒸发容器(1)布置在喷管体(3)下面并且它通过一条具有截流装置(4)的管路(2)与喷管体(1)相连。
4.如前述权利要求之一所述的蒸镀装置，其特征在于，一个装有分离液的贮存容器(9)与蒸发容器(1)相连以便将分离液补注入蒸发容器(1)中。
5.如权利要求4所述的蒸镀装置，其特征在于，贮存容器(9)通过一条补注管路(10)和一条压力补偿管路(12)与蒸发容器(1)相连。
6.如权利要求4所述的蒸镀装置，其特征在于，贮存容器(9)布置得高于蒸发容器(1)，一个截流阀位于补注管路(10)中。
7.如权利要求5所述的蒸镀装置，其特征在于，贮存容器(9)和蒸发容器(1)布置在同一高度上并且补注管路(10)是永久开放的。
8.如至少前述权利要求之一所述的蒸镀装置，其特征在于，喷口(7)具有矩形横截面。
9.如至少前述权利要求之一所述的蒸镀装置，其特征在于，喷管体(3)具有一个电热器。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19848177.2 | 1998-10-20 | ||
| DE19848177A DE19848177A1 (de) | 1998-10-20 | 1998-10-20 | Bedampfungsvorrichtung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1251866A true CN1251866A (zh) | 2000-05-03 |
| CN1240872C CN1240872C (zh) | 2006-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB991215710A Expired - Fee Related CN1240872C (zh) | 1998-10-20 | 1999-10-19 | 蒸镀装置 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP4230068B2 (zh) |
| KR (1) | KR100614131B1 (zh) |
| CN (1) | CN1240872C (zh) |
| DE (1) | DE19848177A1 (zh) |
| GB (1) | GB2342929B (zh) |
| IT (1) | IT1313766B1 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325693C (zh) * | 2003-07-04 | 2007-07-11 | 应用材料股份有限两合公司 | 局部涂覆分离剂的方法和装置 |
| CN102686765A (zh) * | 2009-11-30 | 2012-09-19 | 维易科精密仪器国际贸易(上海)有限公司 | 直线淀积源 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10128091C1 (de) * | 2001-06-11 | 2002-10-02 | Applied Films Gmbh & Co Kg | Vorrichtung für die Beschichtung eines flächigen Substrats |
| CN100412226C (zh) * | 2004-10-18 | 2008-08-20 | 中华映管股份有限公司 | 等离子体显示器之前基板的制造方法、蒸镀工艺与蒸镀装置 |
| CN100491584C (zh) * | 2005-09-22 | 2009-05-27 | 中国科学院半导体研究所 | 不同折射率膜层的制备方法 |
| EP1788113B1 (de) * | 2005-10-26 | 2011-05-11 | Applied Materials GmbH & Co. KG | Verdampfervorrichtung mit einem Behälter für die Aufnahme von zu verdampfendem Material |
| EP1788112B1 (de) * | 2005-10-26 | 2011-08-17 | Applied Materials GmbH & Co. KG | Vorrichtung zum Bedampfen von Substraten |
| DE102008026001B4 (de) * | 2007-09-04 | 2012-02-16 | Von Ardenne Anlagentechnik Gmbh | Verfahren und Vorrichtung zur Erzeugung und Bearbeitung von Schichten auf Substraten unter definierter Prozessatmosphäre und Heizelement |
| US20100285218A1 (en) * | 2008-12-18 | 2010-11-11 | Veeco Instruments Inc. | Linear Deposition Source |
| WO2011065998A1 (en) * | 2008-12-18 | 2011-06-03 | Veeco Instruments Inc. | Linear deposition source |
| FR2956412B1 (fr) * | 2010-02-16 | 2012-04-06 | Astron Fiamm Safety | Vanne d'obturation a volume constant d'une source de depot en phase vapeur |
| TWI600470B (zh) * | 2016-05-19 | 2017-10-01 | 康廷 熊 | 鍍膜裝置及方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3922187A1 (de) * | 1989-07-06 | 1991-01-17 | Leybold Ag | Vorrichtung zum herstellen von metallfreien streifen bei im vakuum beschichteten folienbahnen, insbesondere fuer kondensatoren |
| DE4309717C2 (de) * | 1993-03-25 | 2002-03-28 | Unaxis Deutschland Holding | Verfahren zum Aufdampfen einer Schicht |
| US5863336A (en) * | 1996-04-08 | 1999-01-26 | General Electric Company | Apparatus for fabrication of superconductor |
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1998
- 1998-10-20 DE DE19848177A patent/DE19848177A1/de not_active Withdrawn
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1999
- 1999-10-06 IT IT1999MI002081A patent/IT1313766B1/it active
- 1999-10-12 KR KR1019990043933A patent/KR100614131B1/ko not_active IP Right Cessation
- 1999-10-18 JP JP29559499A patent/JP4230068B2/ja not_active Expired - Fee Related
- 1999-10-18 GB GB9924608A patent/GB2342929B/en not_active Expired - Lifetime
- 1999-10-19 CN CNB991215710A patent/CN1240872C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325693C (zh) * | 2003-07-04 | 2007-07-11 | 应用材料股份有限两合公司 | 局部涂覆分离剂的方法和装置 |
| CN102686765A (zh) * | 2009-11-30 | 2012-09-19 | 维易科精密仪器国际贸易(上海)有限公司 | 直线淀积源 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000129429A (ja) | 2000-05-09 |
| JP4230068B2 (ja) | 2009-02-25 |
| IT1313766B1 (it) | 2002-09-17 |
| ITMI992081A0 (it) | 1999-10-06 |
| GB9924608D0 (en) | 1999-12-22 |
| CN1240872C (zh) | 2006-02-08 |
| KR20000028990A (ko) | 2000-05-25 |
| GB2342929A (en) | 2000-04-26 |
| ITMI992081A1 (it) | 2001-04-06 |
| GB2342929B (en) | 2003-05-21 |
| KR100614131B1 (ko) | 2006-08-22 |
| DE19848177A1 (de) | 2000-04-27 |
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