CN1247633A - 阻止环氧树脂渗出的试剂和方法 - Google Patents
阻止环氧树脂渗出的试剂和方法 Download PDFInfo
- Publication number
- CN1247633A CN1247633A CN98802475A CN98802475A CN1247633A CN 1247633 A CN1247633 A CN 1247633A CN 98802475 A CN98802475 A CN 98802475A CN 98802475 A CN98802475 A CN 98802475A CN 1247633 A CN1247633 A CN 1247633A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- carboxylic acid
- reagent
- organic compound
- mercaptan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 75
- 239000004593 Epoxy Substances 0.000 title abstract description 5
- 230000000740 bleeding effect Effects 0.000 title abstract 4
- 239000003112 inhibitor Substances 0.000 title abstract 2
- 150000002894 organic compounds Chemical group 0.000 claims abstract description 33
- -1 nitrogenous heterocyclic compounds Chemical class 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims description 81
- 229920000647 polyepoxide Polymers 0.000 claims description 81
- 238000005538 encapsulation Methods 0.000 claims description 40
- 239000003153 chemical reaction reagent Substances 0.000 claims description 34
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 33
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 41
- 230000002411 adverse Effects 0.000 abstract description 4
- 150000001298 alcohols Chemical class 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 150000001735 carboxylic acids Chemical class 0.000 abstract 3
- 150000003573 thiols Chemical class 0.000 abstract 2
- 238000002845 discoloration Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 230000003449 preventive effect Effects 0.000 abstract 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 32
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 16
- 238000011156 evaluation Methods 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 16
- 239000004332 silver Substances 0.000 description 16
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 10
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 6
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 description 4
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 4
- 229940070765 laurate Drugs 0.000 description 4
- 239000006174 pH buffer Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000005642 Oleic acid Substances 0.000 description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZJCZFAAXZODMQT-UHFFFAOYSA-N 2-methylpentadecane-2-thiol Chemical compound CCCCCCCCCCCCCC(C)(C)S ZJCZFAAXZODMQT-UHFFFAOYSA-N 0.000 description 2
- RVBUGGBMJDPOST-UHFFFAOYSA-N 2-thiobarbituric acid Chemical compound O=C1CC(=O)NC(=S)N1 RVBUGGBMJDPOST-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 2
- 235000020778 linoleic acid Nutrition 0.000 description 2
- ISYWECDDZWTKFF-UHFFFAOYSA-N nonadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCCC(O)=O ISYWECDDZWTKFF-UHFFFAOYSA-N 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- TUNFSRHWOTWDNC-UHFFFAOYSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 description 2
- SZHOJFHSIKHZHA-UHFFFAOYSA-N tridecanoic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- ZRKMQKLGEQPLNS-UHFFFAOYSA-N 1-Pentanethiol Chemical compound CCCCCS ZRKMQKLGEQPLNS-UHFFFAOYSA-N 0.000 description 1
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 1
- SLAMLWHELXOEJZ-UHFFFAOYSA-N 2-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1[N+]([O-])=O SLAMLWHELXOEJZ-UHFFFAOYSA-N 0.000 description 1
- FWBHETKCLVMNFS-UHFFFAOYSA-N 4',6-Diamino-2-phenylindol Chemical compound C1=CC(C(=N)N)=CC=C1C1=CC2=CC=C(C(N)=N)C=C2N1 FWBHETKCLVMNFS-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 101150065749 Churc1 gene Proteins 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 102100038239 Protein Churchill Human genes 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- UENWRTRMUIOCKN-UHFFFAOYSA-N benzyl thiol Chemical compound SCC1=CC=CC=C1 UENWRTRMUIOCKN-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- ZADPBFCGQRWHPN-UHFFFAOYSA-N boronic acid Chemical compound OBO ZADPBFCGQRWHPN-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- RYZVSJQWUZPQNI-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au].[Au] RYZVSJQWUZPQNI-UHFFFAOYSA-N 0.000 description 1
- VTXVGVNLYGSIAR-UHFFFAOYSA-N decane-1-thiol Chemical compound CCCCCCCCCCS VTXVGVNLYGSIAR-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- HRKQOINLCJTGBK-UHFFFAOYSA-N dihydroxidosulfur Chemical compound OSO HRKQOINLCJTGBK-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- QUCZBHXJAUTYHE-UHFFFAOYSA-N gold Chemical compound [Au].[Au] QUCZBHXJAUTYHE-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- YAQXGBBDJYBXKL-UHFFFAOYSA-N iron(2+);1,10-phenanthroline;dicyanide Chemical compound [Fe+2].N#[C-].N#[C-].C1=CN=C2C3=NC=CC=C3C=CC2=C1.C1=CN=C2C3=NC=CC=C3C=CC2=C1 YAQXGBBDJYBXKL-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 150000002617 leukotrienes Chemical class 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 150000002885 octadecanoids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
实施例 | ||||||
号码 | 1 | 2 | 3 | 4 | 5 | |
镀膜 | 银点镀 | 银点镀 | 银点镀 | 银点镀 | 银点镀 | |
防脱色处理 | 处理 | 有 | 没有 | 有 | 有 | 没有 |
防脱色液的组成 | 苯并三唑:0.1g/L | - | 苯并三唑:0.1g/L | 苯并三唑:0.1g/L | - | |
pH | 9.0 | - | 9.0 | 9.0 | - | |
浴温(℃) | 25 | - | 25 | 25 | - | |
持续时间(s) | 10 | - | 10 | 10 | - | |
方法 | 浸没 | - | 浸没 | 浸没 | - | |
密封处理 | 没有 | 没有 | 没有 | 没有 | 没有 | |
防环氧树脂渗出剂的组成 | 主要组分 | 丁酸:1g/L | 庚酸:1g/L | 己酸:1g/L | 月桂酸:1g/L | 十七酸:1g/L |
溶剂 | - | 甲醇:100mL/L | 甲醇:100mL/L | 异丙醇:100mL/L | 异丙醇:100mL/L | |
pH缓冲剂 | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | |
表面活性剂 | - | - | - | - | - | |
防止环氧树脂渗出的条件 | pH | 10.0 | 10.0 | 10.0 | 10.0 | 10.0 |
液体温度(℃) | 25 | 25 | 25 | 25 | 25 | |
持续时间(s) | 10 | 10 | 10 | 10 | 10 | |
方法 | 浸没 | 喷淋 | 浸没 | 浸没 | 浸没 | |
评价 | 环氧树脂渗出 | ○ | ○ | ○ | ○ | ○ |
引线焊接(g) | 10.5 | 9.8 | 11.2 | 10.6 | 9.9 | |
模制(kg/cm2) | 15.0 | 16.2 | 17.3 | 15.4 | 16.3 | |
防脱色效果 | ○ | × | ○ | ○ | × | |
密封处理效果 | × | × | × | × | × |
实施例 | ||||||
号码 | 6 | 7 | 8 | 9 | 10 | |
镀膜 | 银点镀 | 银点镀 | 银点镀 | 银点镀 | 银点镀 | |
防脱色处理 | 处理 | 有 | 有 | 有 | 有 | 没有 |
防脱色液的组成 | 苯并三唑:0.1g/L | 苯并三唑:0.1g/L | 苯并三唑:0.1g/L | 苯并三唑:0.1g/L | - | |
pH | 9.0 | 9.0 | 9.0 | 9.0 | - | |
浴温(℃) | 25 | 25 | 25 | 25 | - | |
持续时间(s) | 10 | 10 | 10 | 10 | - | |
方法 | 浸没 | 浸没 | 浸没 | 浸没 | - | |
密封处理 | 处理 | 没有 | 没有 | 没有 | 没有 | 没有 |
防环氧树脂渗出剂的组成 | 主要组分 | 油酸:1g/L | 硫代巴比土酸:1g/L | 巯基乙酸:1g/L | 十六烷基硫醇:1g/L | 丁炔二醇:1g/L |
溶剂 | 异丙醇:100mL/L | - | - | 甲醇:100mL/L | - | |
pH缓冲剂 | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | |
表面活性剂 | 聚氧化乙烯壬基苯基醚:1mg/L | - | - | 聚氧化乙烯壬基苯基醚:1mg/L | - | |
防止环氧树脂渗出的条件 | pH | 10.0 | 10.0 | 10.0 | 10.0 | 10.0 |
液体温度(℃) | 25 | 25 | 25 | 25 | 25 | |
持续时间(s) | 10 | 10 | 10 | 10 | 10 | |
方法 | 喷淋 | 浸没 | 浸没 | 喷淋 | 浸没 |
评价 | 环氧树脂渗出 | ○ | ○ | ○ | ○ | ○ |
引线焊接(g) | 9.7 | 11.3 | 11.5 | 10.6 | 10.0 | |
模制(kg/cm2) | 16.0 | 17.3 | 17.9 | 16.2 | 15.6 | |
防脱色效果 | ○ | ○ | ○ | ○ | × | |
密封处理效果 | × | × | × | ○ | × |
实施例 | ||||||
号码 | 11 | 12 | 13 | 14 | 15 | |
镀膜 | 铜 | 金 | 金 | 钯 | 钯 | |
防脱色处理 | 处理 | 有 | 没有 | 没有 | 没有 | 没有 |
防脱色液的组成 | 苯并三唑:0.1g/L | - | - | - | - | |
pH | 9.0 | - | - | - | - | |
浴温(℃) | 25 | - | - | - | - | |
持续时间(s) | 10 | - | - | - | - | |
方法 | 浸没 | - | - | - | - | |
密封处理 | 处理 | 没有 | 有 | 没有 | 没有 | 有 |
密封处理液的组成 | - | 三乙醇胺:1.0g/L | - | - | 三乙醇胺:1.0g/L | |
pH | - | 9.0 | - | - | 9.0 | |
浴温(℃) | - | 25 | - | - | 25 | |
持续时间(s) | - | 10 | - | - | 10 | |
方法 | - | 浸没 | - | - | 浸没 | |
主要组分 | 丁酸:1g/L | 庚酸:1g/L | 己酸:1g/L | 月桂酸:1g/L | 十七酸:1g/L |
防环氧树脂渗出剂的组成 | 溶剂 | 异丙醇:100mL/L | 丙酮:100mL/L | 异丙醇:100mL/L | 异丙醇:100mL/L | 甲醇:100mL/L |
pH缓冲剂 | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | 焦磷酸钾:5g/L | |
表面活性剂 | - | - | 聚氧化乙烯壬基苯基醚:1mg/L | - | - | |
防止环氧树脂渗出的条件 | pH | 10.0 | 10.0 | 10.0 | 10.0 | 10.0 |
液体温度(℃) | 25 | 25 | 25 | 25 | 25 | |
持续时间(s) | 10 | 10 | 10 | 10 | 10 | |
方法 | 浸没 | 喷淋 | 浸没 | 喷淋 | 浸没 | |
评价 | 环氧树脂渗出 | ○ | ○ | ○ | ○ | ○ |
引线焊接(g) | 5.2 | 10.8 | 11.5 | 9.6 | 9.2 | |
模制(kg/cm2) | 18.1 | 9.5 | 9.0 | 8.9 | 17.3 | |
防脱色效果 | ○ | ○ | ○ | ○ | ○ | |
密封处理效果 | × | ○ | × | × | ○ |
实施例 | ||||||
号码 | 16 | 17 | 18 | 19 | 20 | |
镀膜 | 铜 | 银点镀 | 金 | 钯 | 铜 | |
防脱色处理 | 处理 | 有 | 有 | 没有 | 没有 | 有 |
防脱色液的组成 | 苯并三唑:0.1g/L亚油酸:1g/L异丙醇:100mL/L | 苯并三唑:0.1g/L十六烷硫醇:1g/L异丙醇:100mL/L | - | - | 咪唑硅烷:1.0g/L月桂酸:1g/L异丙醇:100mL/L | |
pH | 9.0 | 9.0 | - | - | 9.0 | |
浴温(℃) | 25 | 25 | - | - | 25 | |
持续时间(s) | 10 | 10 | - | - | 10 | |
方法 | 浸没 | 浸没 | - | - | 浸没 | |
密封处理 | 处理 | 没有 | 没有 | 有 | 有 | 没有 |
密封处理液的组成 | - | - | 三乙醇胺:1.0g/L丁酸:1g/L | 三乙醇胺:1.0g/L油酸:1g/L异丙醇:100mL/L | - | |
pH | - | - | 9.0 | 9.0 | - | |
浴温(℃) | - | - | 25 | 25 | - | |
持续时间(s) | - | - | 10 | 10 | - | |
方法 | - | - | 浸没 | 浸没 | - | |
评价 | 环氧树脂渗出 | ○ | ○ | ○ | ○ | ○ |
引线焊接(g) | 5.3 | 10.1 | 10.3 | 8.9 | 5.7 | |
模制(kg/cm2) | 16.5 | 15.3 | 10.1 | 16.5 | 15.3 | |
防脱色效果 | ○ | ○ | ○ | ○ | ○ | |
密封处理效果 | × | ○ | ○ | ○ | × |
比较例 | ||||||
号码 | 1 | 2 | 3 | 4 | 5 | |
镀膜 | 银点镀 | 银点镀 | 金 | 金 | 钯 | |
防脱色处理 | 处理 | 没有 | 有 | 没有 | 没有 | 没有 |
防脱色液的组成 | - | 苯并三唑:0.1g/L | - | - | - | |
pH | - | 9.0 | - | - | - | |
浴温(℃) | - | 25 | - | - | - | |
持续时间(s) | - | 10 | - | - | - | |
方法 | - | 浸没 | - | - | - | |
密封处理 | 处理 | 没有 | 没有 | 没有 | 有 | 没有 |
密封处理液的组成 | - | - | - | 三乙醇胺:1.0g/L | - | |
pH | - | - | - | 9.0 | - | |
浴温(℃) | - | - | - | 25 | - | |
持续时间(s) | - | - | - | 10 | - | |
方法 | - | - | - | 浸没 | - | |
评价 | 环氧树脂渗出 | △ | × | △ | × | - |
引线焊接(g) | 11.2 | 10.8 | 10.3 | 11.8 | 9.6 | |
模制(kg/cm2) | 15.3 | 16.2 | 9.5 | 8.7 | 16.5 | |
防脱色效果 | × | ○ | ○ | ○ | ○ | |
密封处理效果 | × | × | × | ○ | × |
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36660597A JP3343210B2 (ja) | 1997-12-26 | 1997-12-26 | エポキシブリ−ドアウト防止剤及び防止方法 |
JP366605/97 | 1997-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1247633A true CN1247633A (zh) | 2000-03-15 |
Family
ID=18487198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN98802475A Pending CN1247633A (zh) | 1997-12-26 | 1998-12-25 | 阻止环氧树脂渗出的试剂和方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3343210B2 (zh) |
KR (1) | KR100337396B1 (zh) |
CN (1) | CN1247633A (zh) |
TW (1) | TW396465B (zh) |
WO (1) | WO1999034434A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101542718B (zh) * | 2007-05-21 | 2012-06-13 | 日矿金属株式会社 | 树脂析出防止剂、树脂析出防止方法和基材 |
TWI824045B (zh) * | 2018-10-24 | 2023-12-01 | 日商住友電木股份有限公司 | 導電性樹脂組成物及半導體裝置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY157869A (en) * | 2006-01-17 | 2016-07-29 | Jx Nippon Mining & Metals Corp | Preventing agent for epoxy resin bleeding out |
MY163131A (en) * | 2009-12-17 | 2017-08-15 | Jx Nippon Mining & Metals Corp | Resin-bleedout preventing agent |
KR102190964B1 (ko) | 2014-03-18 | 2020-12-15 | 해성디에스 주식회사 | 블리드 아웃 방지제, 이를 포함하는 블리드 아웃 방지용 조성물 및 블리드 아웃 방지 방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669257A (ja) * | 1992-08-21 | 1994-03-11 | Hitachi Chem Co Ltd | 半導体素子用接着剤および半導体装置 |
JP2726251B2 (ja) * | 1995-12-14 | 1998-03-11 | 住友ベークライト株式会社 | ダイボンディング材 |
-
1997
- 1997-12-26 JP JP36660597A patent/JP3343210B2/ja not_active Expired - Lifetime
-
1998
- 1998-12-23 TW TW087121498A patent/TW396465B/zh not_active IP Right Cessation
- 1998-12-25 CN CN98802475A patent/CN1247633A/zh active Pending
- 1998-12-25 KR KR1019997006125A patent/KR100337396B1/ko not_active IP Right Cessation
- 1998-12-25 WO PCT/JP1998/005897 patent/WO1999034434A1/ja active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101542718B (zh) * | 2007-05-21 | 2012-06-13 | 日矿金属株式会社 | 树脂析出防止剂、树脂析出防止方法和基材 |
TWI824045B (zh) * | 2018-10-24 | 2023-12-01 | 日商住友電木股份有限公司 | 導電性樹脂組成物及半導體裝置 |
Also Published As
Publication number | Publication date |
---|---|
JP3343210B2 (ja) | 2002-11-11 |
JPH11195662A (ja) | 1999-07-21 |
TW396465B (en) | 2000-07-01 |
KR20000069912A (ko) | 2000-11-25 |
WO1999034434A1 (fr) | 1999-07-08 |
KR100337396B1 (ko) | 2002-05-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1309862C (zh) | 非电解的镀金液和方法 | |
CN100340632C (zh) | 糙化结合至基片的铜表面的方法 | |
CN1823181A (zh) | 锡或锡合金材料用表面处理剂 | |
CN1258816C (zh) | 半导体装置及其制造方法 | |
US8819930B2 (en) | Method for improving the adhesion between silver surfaces and resin materials | |
CN1538518A (zh) | 导体衬底,半导体器件及其制造方法 | |
TWI647304B (zh) | 固化焊劑之電路基板之製造方法、搭載電子零件之電路基板之製造方法、及助焊劑用洗淨劑組合物 | |
CN1391618A (zh) | 铜底基的选择性沉积方法 | |
US6395583B1 (en) | Semiconductor device with a coating of Pb-free Sn-base solder and manufacturing method therefor | |
CN1652667A (zh) | 亲水处理方法及形成布线图形的方法 | |
CN1626703A (zh) | 铜剥离电解液和电解剥离方法 | |
CN1247633A (zh) | 阻止环氧树脂渗出的试剂和方法 | |
CN87100440A (zh) | 在不导电材料上刷镀金属的方法 | |
US6432182B1 (en) | Treatment solution for reducing adhesive resin bleed | |
WO2005085498A1 (ja) | 金属の表面処理剤 | |
CN109075150B (zh) | 引线框结构,引线框式表面粘着型电子装置及其制造方法 | |
JP6870245B2 (ja) | 銅製部材の表面処理方法及び半導体実装用基板の製造方法 | |
KR101418194B1 (ko) | Pd 또는 Pd를 주성분으로 하는 합금의 표면처리제, 및 구리표면의 표면 피막층 구조 | |
JP5067948B2 (ja) | レジンブリードアウト防止剤及びレジンブリードアウト防止方法 | |
KR102217484B1 (ko) | 반도체용 기판의 표면 처리 방법, 반도체 패키지의 제조 방법, 및 이들의 방법에 사용하는 수용성 프리플럭스 | |
JP7336491B2 (ja) | プリント配線基板の表面処理方法、およびプリント配線基板の製造方法 | |
WO2007083538A1 (ja) | エポキシブリードアウト防止剤 | |
KR101540144B1 (ko) | 구리 또는 구리 합금용 표면 처리제 및 그 용도 | |
TWI429720B (zh) | 樹脂滲出防止劑 | |
JP5137317B2 (ja) | 電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication | ||
ASS | Succession or assignment of patent right |
Owner name: NIKKO MATERIALS CO. LTD Free format text: FORMER OWNER: JAPAN ENERGY CO., LTD. Effective date: 20040820 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20040820 Address after: Tokyo, Japan, Japan Applicant after: Nikko Materials Company, Limited Address before: Tokyo, Japan, Japan Applicant before: Japan Energy Corp. |
|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1025424 Country of ref document: HK |