CN1243070C - 用于抛光磁记录盘基体的磨料组合物 - Google Patents
用于抛光磁记录盘基体的磨料组合物 Download PDFInfo
- Publication number
- CN1243070C CN1243070C CN 01104631 CN01104631A CN1243070C CN 1243070 C CN1243070 C CN 1243070C CN 01104631 CN01104631 CN 01104631 CN 01104631 A CN01104631 A CN 01104631A CN 1243070 C CN1243070 C CN 1243070C
- Authority
- CN
- China
- Prior art keywords
- polishing
- magnetic recording
- abrasive composition
- silica
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013858A JP3877924B2 (ja) | 2000-01-24 | 2000-01-24 | 磁気ディスク基板研磨用組成物 |
| JP013858/00 | 2000-01-24 | ||
| JP013858/2000 | 2000-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1309160A CN1309160A (zh) | 2001-08-22 |
| CN1243070C true CN1243070C (zh) | 2006-02-22 |
Family
ID=18541393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01104631 Expired - Fee Related CN1243070C (zh) | 2000-01-24 | 2001-01-23 | 用于抛光磁记录盘基体的磨料组合物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3877924B2 (https=) |
| CN (1) | CN1243070C (https=) |
| MY (1) | MY118633A (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4231632B2 (ja) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
| MY133305A (en) * | 2001-08-21 | 2007-11-30 | Kao Corp | Polishing composition |
| JP4462599B2 (ja) * | 2001-08-21 | 2010-05-12 | 花王株式会社 | 研磨液組成物 |
| JP3875156B2 (ja) * | 2002-08-07 | 2007-01-31 | 花王株式会社 | ロールオフ低減剤 |
| JP4202172B2 (ja) * | 2003-03-31 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP4891304B2 (ja) * | 2008-10-23 | 2012-03-07 | 花王株式会社 | メモリーハードディスク基板の製造方法 |
| JP6484894B2 (ja) * | 2014-03-28 | 2019-03-20 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
| MY177370A (en) * | 2014-03-28 | 2020-09-14 | Yamaguchi Seiken Kogyo Co Ltd | Polishing composition and method for polishing magnetic disk substrate |
| JP6480139B2 (ja) * | 2014-09-30 | 2019-03-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2017051770A1 (ja) * | 2015-09-25 | 2017-03-30 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3825827B2 (ja) * | 1996-01-30 | 2006-09-27 | 昭和電工株式会社 | 研磨用組成物、磁気ディスク基板の研磨方法、及び製造方法 |
| JP3653133B2 (ja) * | 1996-01-30 | 2005-05-25 | 昭和電工株式会社 | 研磨用組成物、磁気ディスク基板の研磨方法、及び製造方法 |
| JPH10121034A (ja) * | 1996-03-18 | 1998-05-12 | Showa Denko Kk | 磁気ディスク基板の研磨用組成物 |
| JPH10121035A (ja) * | 1996-08-30 | 1998-05-12 | Showa Denko Kk | 磁気ディスク基板研磨用組成物 |
| JP3457144B2 (ja) * | 1997-05-21 | 2003-10-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US6149696A (en) * | 1997-11-06 | 2000-11-21 | Komag, Inc. | Colloidal silica slurry for NiP plated disk polishing |
-
2000
- 2000-01-24 JP JP2000013858A patent/JP3877924B2/ja not_active Expired - Lifetime
-
2001
- 2001-01-22 MY MYPI20010276 patent/MY118633A/en unknown
- 2001-01-23 CN CN 01104631 patent/CN1243070C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001207161A (ja) | 2001-07-31 |
| JP3877924B2 (ja) | 2007-02-07 |
| CN1309160A (zh) | 2001-08-22 |
| MY118633A (en) | 2004-12-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060222 Termination date: 20160123 |
|
| EXPY | Termination of patent right or utility model |