CN1229200C - 热压接方法和热压接设备 - Google Patents

热压接方法和热压接设备 Download PDF

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CN1229200C
CN1229200C CNB011446005A CN01144600A CN1229200C CN 1229200 C CN1229200 C CN 1229200C CN B011446005 A CNB011446005 A CN B011446005A CN 01144600 A CN01144600 A CN 01144600A CN 1229200 C CN1229200 C CN 1229200C
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compressed
parts
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CN1365871A (zh
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宫本岳彦
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Shibaura Mechatronics Corp
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
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    • B23K20/008—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating pressure combined with radiant energy
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Abstract

在热压接方法和设备中，在执行将形成在覆膜载体52上的外引线54热压接到形成在透明板56上的电极58上之前测量形成在覆膜载体52的第一和第二标记(MA，NB)，覆膜载体52的膨胀量是根据热压接条件而变化。然后获取被测标记(MA，MB)之间距离，根据该距离确定热压接条件，在确定的该条件下完成热压接。

Description

热压接方法和热压接设备
技术领域
本发明涉及一种热压接方法和热压接设备。用于压接第一部件和第二部件，本发明尤其是涉及一种优选的热压接方法和热压接设备，用于在如封装带状载体的电子部件的外引线和如显示屏的底板上形成的电极之间执行热压接。
技术背景
作为显示屏的驱动器，多个电子部件装配在电极上，该电极以很窄的间隙，形成在用作电子装置的显示设备的显示屏的外围部份。
图6A和6B是解释传统用于电子部件外引线的热压接方法的示意图，图6A显示热压接之前的状态而图6B显示热压接以后的状态。
利用将聚酰亚胺树脂和其他材料制作的覆膜载体52压接到无屏蔽的芯片53形成电子部件51。在覆膜载体52的表面，形成多个铜制外引线54，其具有狭窄的间距。
在透明板56的外围部份，形成具有狭窄间距的多个微电极58。在覆膜载体52的两端，以预定距离形成作为定位检测用的第一和第二标记MA和MB。此外，形成于透明板56的微电极带58的两端，形成第一和第二标记NA和NB，其对应于第一第二标记MA和MB。标记MA和NA以及标记MB和NB分别成对使用。
首先，如图6A所示，当处于完成热压接前的状态时，利用摄像机(图中未示)，分别检测第一标记MA和NA之间位置差和第二标记MB和NB之间的位置差。
接着，外引线54和微电极58定位，使第一标记对MA和NA之间的位置差与第二标记对MB和NB之间的位置差相等。然后，将压接组件(图中未示)压到覆膜载体52上，以便在外引线54和相应的微电极58(图6B)之间完成热压接。外引线54依靠热压接与相应的微电极58结合，使电子部件51安装到显示屏的透明板56上。
因为外引线54是以狭窄间距形成在覆膜载体52的表面上，必须在外引线54和显示屏的微电极58之间完成精确定位后才能进行热压接。
然而，因为覆膜载体52是由聚酰亚胺树脂和其他材料制成的，覆膜载体52在热压接过程中会膨胀。在实际应用中，覆膜载体52考虑到热压接过程中的膨胀，在长度上稍短一些。因为制造误差的发生，即使在相同条件下完成热压接，为使外引线54与微电极58在精确位置压接仍然很困难，所以，产生有缺陷的产品。在有关现有技术中，每次产生有缺陷的产品，都要重新审视热压接的条件。将来，可以预测随着更狭窄的间距将造成有缺陷产品的数量的增加。
为了避免上述相关现有技术的缺点，建议使用一种抑制产品废品率的方法，在该方法中，观察热压接状态，根据观察获得的数据对随后工序中执行的热压接的条件进行必要的审视。
然而，覆膜载体在热压接完成后的制造缺陷并不总是等于热压接实施前包含的制造缺陷。因此，存在一个缺点，即根据热压接已完成的覆膜载体所获得的数据确定的热压接条件不能应用于随后的覆膜载体。
发明内容
本发明的一个方面提供了一种热压接方法和热压接设备，可以在零件的制造误差不总是互相一致的条件下，仍能抑制有缺陷产品的发生。
在根据本发明的热压接方法和热压接设备的实施例中，热压接在第一部件和第二部件之间进行，其中，第一部件膨胀量根据热压接条件改变。在执行热压接之前，检测形成在第一部件上的第一和第二标记。获得已检测的第一和第二标记之间的距离。根据获得的距离确定热压接的最佳条件，在所确定的上述最佳条件下，完成第一和第二部件的热压接。
附图说明
图1是用于测量标记之间距离的距离测量部件的部份立体图；
图2是压接部件的部份立体图；
图3是解释确定热压接条件的确定方法的流程图；
图4是显示如图3所示的各种值，如“设计值+X1”之间的不相等关系的示意图；
图5是显示热压接条件具体实例的图表；
图6A和图6B是解释现有技术热压接方法的示意图。
具体实施方式
本发明的各种实施例将参照附图解释。应注意，整个附图中相同或相类似的标号表示相同或相类似的零件和组件，对相同或相类似零件和组件的描述将省略或简化。
实施例
在下面解释中，在图6A和图6B所示的现有技术中相同的部件使用相同的字母和数字，对相同组件的解释在此省略。
图1中，吸嘴1利用真空吸引装置(未示)对电子部件51(作为第一部件)内的覆膜载体52施行真空吸引。摄像机3(作为图像摄取设备)摄取第一标记MA，摄像机4(作为另一个图像摄取设备)摄取第二标记MB。图像处理装置5根据使用摄像机3和4获得的图像获得标记MA和MB之间的距离。
图2是压接部分的部份立体图。在压接头21内的压接工具22安装在具有加热器23的部件24上。部件24固定到圆柱体25的操作轴上，压接头21可利用驱动一个伺服马达26来上下移动。
马达控制部份11控制压接工具22的下移速度，时间控制部份14控制压接时间。压力控制部份12控制压接工具22的压力。温度控制部份控制热压接过程中压接工具22的温度。
控制装置15控制马达控制部份11，压力控制部份12，温度控制部份13和时间控制部份14的全部操作。控制装置15具有存储器用于储存根据如图5所示的覆膜载体52的制造误差量(有关第一标记MA和第二标记MB的实际距离和设计值之间位置的差值)得出的热压接的各种条件。控制装置15也连到一个图像处理装置5上，如下面将要描述的，控制装置15根据从图像处理装置5传来的检测结果，在完成利用压接工具22将电子部件51压接到透明板56(作为第二部件)的过程中，自动确定压接条件。
下面，参照附图3的描述将解释确定热压接最佳条件的确定方法。
图4显示了“设计值+X2”，“设计值+X1”，“设计值”，“设计值-X3”，和“设计值-X4”之间的不相等关系，这里，X1，X2，X3和X4是正数，应满足相对关系“X1＜X2”和“X3＜X4”。
首先，在步骤S301，先核查第一标记MA和第二标记MB之间的距离D1(见图6A)的测量结理是否比“设计值+X1”大，比“设计值+X2”小。当上述关系满足，热压接的当前条件替换为条件2(步骤S305)而且发出在条件2下启动热压接的指令(步骤S310)。
如图5所示，与条件1作为标准热压接条件比较，条件2表明较高的温度，较短时间，重负荷和较高的压接工具22下降速度，当在条件2下完成热压接，相对于在条件1下覆膜载体52的膨胀量变小。
为了在标准条件下完成热压接，在覆膜载体52的长度比设计值要长的情况下，步骤S301的核查结果表示为“是”。然而，因为覆膜载体52的膨胀量可以依靠执行在条件2下的热压接得到抑制，就可以避免任何缺陷产品的产生。
当在步骤S301的核查结果表明为“否”时，在步骤S302进一步核查距离D1是否比“设计值-X4”大而比“设计值X3”小。当满足上述关系，选择条件3进行热压接(步骤S308)，根据条件3发出启动热压接指令(步骤S310)。
如图5所示，与作为标准条件的条件1相比较，条件3表明了较低的温度，较长的时间，较轻的负载和较低的压接工具22下降速度。当在条件3下完成热压接与在条件1的情况相比，覆膜载体52的膨胀量变大。
为了在标准条件下完成热压接，在覆膜载体52的长度比设计值短的情况下，步骤S302的核查结果表示为“是”，然而，因在条件3下完成热压接覆膜载体52的膨胀量可以增加，就可以避免产生任何缺陷产品。
当步骤S302检查结果表示为“否”，在步骤S303进一步核查距离D1的测量结果是否不比“设计值-X3”小且不比“设计值+X1”大。当上述关系满足“是”，条件1选择作为热压接的标准条件(步骤S307)，而且发出在条件1启动热压接的指令(步骤S310)。
当热压接处于标准条件下完成，在步骤S303的核查结果表示“是”，相应的，当热压接在条件1下执行，可以避免产生缺陷产品。
当在步骤S303核查结果表示“否”，热压接被禁止(步骤S306)。
出现步骤S303的核查结果表明“否”的情况仅仅因为覆膜载体52与设计值相比太长或太短。在这种情况下，难以避免缺陷产品的产生。相应的，热压接的工作必须被禁止。
在根据每一种条件执行热压接工作中，覆膜载体52上形成的第一标记MA和在作为热压接目的物的透明板56上形成的第一标记NA(对应第一标记MA)之间的位置差，如图6A所示，以及在覆膜载体52上形成的第二标记MB和在透明板56上形成的第二标记NB(对应第二标记MB)之间的位置差分别利用摄像机3和4检测。外引线54和电极58之间的相对位置的安排，使上述的两种位置差值成为一致，该方式与传统方式相同。
如上所述，覆膜载体上的标记之间的距离在执行热压接之前测定，根据作为测量结果的距离，选择热压接的最佳条件，或者停止热压接，因此可以减小缺陷产品的产生。
在上述的实施例中，只测量覆膜载体上的标记之间的距离，热压接条件按照作为测量结果的距离而改变。其理由如下：透明板56的材料一般是玻璃板，在尺寸上具有很高的准确度，而在电路制造工序以后很难使之变形。
然而，当在热压接中覆膜载体压接到选定的材料是尺寸精度低的材料，或者是电路制造工序后易于变形的树脂，希望除了测量覆膜载体标记间距离之外，热压接的选定材料上的标记之间的距离也被测量。根据覆膜载体上的标记之间距离和选定材料上标记之间距离的比较结果决定热压接的最佳条件。
在具体实施例中，如图6A和6B所示，首先，摄像机3拍摄电子部件51中的覆膜载体52上的第一标记MA和透明板56上对应于第一标记MA的第一标记NA的照片。然后，摄像机4拍摄电子部件51中的覆膜载体52上的第二标记MB和透明板56上对应于第二标记MB的第二标记NB的照片。该工序后，图像处理装置5获取在电子部件51上的第一标记MA和第二标记MB之间的距离D1和透明板56上的第一标记NA和第二标记NB之间的距离D2。然后，控制装置15根据下面的比较程序自动选择示于图5用于热压接的最佳条件(条件1，条件2或条件3中的一个)。
下面描述在覆膜载体52的膨胀量大于透明板56的膨胀量的情况下的比较程序。
即，在距离D1和D2之间的差值“D2-D1”比“标准值+X1”大而比“标准值+X2”(X1＜X2)小时，选择热压接条件3。然后，热压接根据条件3执行。
在差值“D2-D1”比“标准值-X4”大而比“标准值-X3”(X4＜X3)小的情况下，选择热压接条件2。然后，根据条件2执行热压接。
在差值“D2-D1”比“标准值-X3”大而比“标准值+X1”小(在允许值内)，选择热压接条件1。然后，根据条件1执行热压接。
这样，即使电子部件51和透明板56两者都有尺寸误差，仍能够对电子部件51和透明板56进行热压接而不会产生任何缺陷产品。在上述情况下，标准值是根据设计值的“D2-D1”的差值，X1，X2，X3和X4中的每一个都是正值。
按上述的方式，根据距离D1和D2之间位置的差值选择热压接条件，这里D1是标记MA和MB之间的值，而距离D2是标记NA和NB之间的值。
然而，本发明并不限于这种方式，例如，也可以根据标记MA和MB之间距离D1和标记NA和NB之间距离D2的比值来选择热压接条件。即：比值R0(D1/D2×100％)和比值R1比较，这里，R0是距离D1对根据设计的距离D2的比值，而R1是距离D1对实际距离D2的比值。
在这种情况下，当比值R1大于“R0+X1”而小于“R0+X2”(X1＜X2)，选择热压接条件2。而当比值R1大于“R0-X4”而小于“R0-X3”(X4＞X3)选择热压接条件3。当比值R1大于“R0-X3”而小于“R0+X1”(在允许值内)，选择热压接条件1。
在上述中，在第一和第二部件上形成的标记仅用作检测。然而，本发明并不限定于此，不言自明，可以使用在形状上具有结构特征的端点和能相互区别开的标记。
而且，上述实施例中，电子部件51用作第一部件，透明板56用作第二部件，本发明也应用到外引线压接设备。但是本发明并不受实施例的限定，例如，也可以将本发明用于将IC(集成电路)芯片安装到带形零件上的安装设备，其中，带形零件用作第一部件，而IC芯片作第二部件。
而且，上述实施例已经解释了在加热器23安装在压接工具22上的情况。然而，在本发明中，加热器23并不总是装到压接工具22上。例如，也可以将一个加热装置如加热器装到支架上，支撑透明板56抵抗在热压接过程中压接工具22施加的压力。而且也可以用控制加热装置的加热值代替对压接工具22温度的控制。
而且，执行对第一部件和第二部件热压接的热压接条件至少包括压接温度，压接压力，压接时间和压接工具的速度中的一个。
如已详细叙述的，根据本发明，在执行热压接之前，第一部件上的标记之间的距离已被测量，根据作为测量结果的距离，执行热压接或放弃，这样减少缺陷产品的发生。
在不离开本发明精神和基本特征的情况下，还可以有其他特定形式的实施方式，本实施例在所有方面只能认为是说明性的，而不是限定性的，本发明的保护范围由权利要求表明，而不是由前面的描述表明，而且在权利要求的等同的含意和范围内的所有变化也应包括在本发明的范围内。

Claims (8)

1.一种热压接方法，执行将第一部件压接到第二部件的热压接，压接中，第一部件的膨胀量根据热压接条件而变化，包括：
在执行热压接前，对形成在第一部件上的第一和第二标记进行检测；
获取经检测的第一和第二标记之间的距离；
根据所获取的距离确定热压接的条件；
在上述所确定的条件下，执行对第一和第二部件的热压接。
2.一种热压接方法，执行将第一部件压接到第二部份的热压接，压接中，第一部件的膨胀量根据热压接条件而变化，包括：
在执行热压接前，对形成在第一部件上的第一和第二标记进行检测；
获取经检测的形成在第一部件上的第一和第二标记之间的距离；
在执行热压接之前，检测形成在第二部件上的第一和第二标记，该标记对应于形成在第一部件上的第一和第二标记；
获取经检测的位于第二部件上的第一和第二标记之间的距离；
根据上述获取的在第一和第二部件上的标记的距离确定热压接条件；
在上述所确定的条件下，执行对第一和第二部件的热压接。
3.根据权利要求1的热压接方法，其中所述对第一和第二部件执行的热压接的条件至少包括压接工具的压接温度，压接负载，压接时间和压接速度中的一个。
4.根据权利要求2的热压接方法，其中对第一和第二部件执行的热压接的条件至少包括压接工具的压接温度，压接负载，压接时间和压接速度中的一个。
5.一种热压接设备，利用压接工具执行将第一部件压接到第二部件的热压接，在压接中，第一部件的膨胀量根据热压接条件而变化，包括：
一图像摄取装置，摄取形成于第一部件上的第一和第二标记的图像；
一图像处理装置，根据利用图像摄取装置所获得的图像获得第一和第二标记之间的距离；和
一控制装置，根据利用图像处理装置获得的位于第一部件上的标记之间的距离，确定热压接工具的条件，并在所确定的条件下，控制热压接工具的操作。
6.一种热压接设备，利用压接工具执行将第一部件压接到第二部件的热压接，在压接中，第一部件的膨胀量根据热压接条件而变化，包括：
一图像摄取装置，摄取形成在第一部件上的第一和第二标记的图像并摄取对应于形成在第一部件上的第一和第二标记的形成在第二部件的第一和第二标记的图像；
一图像处理装置，根据图像摄取装置获取的图像，获取形成在第一部件上的第一和第二标记之间的距离和在第二部件上的第一第二标记之间的距离，和
一控制装置，根据所获得的在第一和第二部件上的标记之间的距离，确定压接工具的条件，以及在上述所确定的条件下，控制利用压接工具对第一和第二部件的热压接。
7.根据权利要求5的热压接设备，其中对第一和第二部件执行热压接的所述的热压接条件至少包括热压接工具的压接温度，压接负载，压接时间和压接速度中的一个。
8.根据权利要求6的热压接设备，其中对第一和第二部件执行热压接的所述的热压接条件至少包括热压接工具的压接温度，压接负载，压接时间和压接速度中的一个。
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