TW503683B - Heat bonding method and heat bonding device - Google Patents

Heat bonding method and heat bonding device Download PDF

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Publication number
TW503683B
TW503683B TW90131741A TW90131741A TW503683B TW 503683 B TW503683 B TW 503683B TW 90131741 A TW90131741 A TW 90131741A TW 90131741 A TW90131741 A TW 90131741A TW 503683 B TW503683 B TW 503683B
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Taiwan
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pressing
hot
conditions
distance
mark
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TW90131741A
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English (en)
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Takehiko Miyamoto
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Shibaura Mechatronics Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/008—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating pressure combined with radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/30—Electrical means
    • B29C65/305—Electrical means involving the use of cartridge heaters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91421—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/922—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9231—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the displacement of the joining tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/934—Measuring or controlling the joining process by measuring or controlling the speed by controlling or regulating the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
    • B29C66/961—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving a feedback loop mechanism, e.g. comparison with a desired value
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9241—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force or the mechanical power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
    • B29C66/944—Measuring or controlling the joining process by measuring or controlling the time by controlling or regulating the time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
    • B29C66/967—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving special data inputs or special data outputs, e.g. for monitoring purposes
    • B29C66/9672—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving special data inputs or special data outputs, e.g. for monitoring purposes involving special data inputs, e.g. involving barcodes, RFID tags
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

503683
五、發明說明（1) 發明領域 本發明涉及一種熱壓著的方法及其裝置。用於荖 二部件和^二部件，本發明尤其是涉及_種優選的熱壓 外著裝置，用於在如封裝帶狀載體的電子部件的 顯示幕的底板上形成的電極之間執行熱壓著。 配在電極上， 的顯示設備的 作為顯示幕的驅動器，多個電子部件裝 該電極以报窄的間隙，形成在用作電子裝2 顯示幕的週邊部份。 、 圖六Α和六Β是解釋傳統用…％ _ 1 η 71 吟口v 恐/玄考 方法^示思圖，圖六A顯示熱壓著之前的狀態而圖六6顯示 熱壓著以後的狀態。 利用將聚al亞胺樹脂和其他材料製作的覆膜載體52壓 著到無遮罩的晶片53形成電子部件51。在覆膜載體52的表 面，形成多個鋼制外引線54，其具有狹窄的間距。 在透明板5 6的週邊部份，形成具有狹窄間距的多個微 電極58。在覆膜載體52的兩端，以預定距離形成作為定位 檢測用的第一和第二標記MA和MB。此外，形成於透明板56 的微電極帶58的兩端，形成第一和第二標記“和肫，其對 應於第一第二標記MA和MB。標記MA和NA以及標記腿和龍分 別成對使用。 首先，如圖六A所示，當處於完成熱壓著前的狀態 時，利用攝像機（圖中未示），分別檢測第一標記隐“和Μ 之間位置差和第二標記MB和ΝΒ之間的位置差。
503683
五、發明說明（2) 接著，外引線54和微電極58定位，使第一標記對Ma和 NA之間的位置差與第二標記對MB和NB之間的位置差相等口 然後，將壓著元件（圖中未示）壓到覆膜載體5 2上，以 在外引線54和相應的微電極58 (圖六B )之間完成熱.壓便 著。外引線54依靠熱壓著與相應的微電極58結合，使電 部件51安裝到顯示幕的透明板56上。 "子 的表面 精確定 因為外引線54是以狭窄間距形成在覆膜載體52 上’必須在外引線54和顯示幕的微電極58之間完成 位後才能進行熱壓著。 制然而，因為覆膜載體52是由聚f尤亞胺樹脂和其他材 製成的’覆膜載體52在熱壓著過程中會膨脹。在^際應’用 中’覆膜載體52考慮到熱壓著過程中的膨脹，在具二= 一二。因為製造誤差的發生，即使在相同條 & 壓荖，幺你从，丨仏r T丨卞卜几成熱 者為使外引線54與微電極58在精確位置壓著仍然彳 產丄所以，產生有缺陷的產品。在有關現有技術中Γ 2★ 有缺陷的產品，都要重新審視熱壓著的條件。將來^ L ^預測隨著更狹窄的間距將造成有缺陷產品的數量的增 制產，ΐ上述相關現有技術的缺點，建議使用一種抑 據在該方法中，觀察熱壓著狀態，： 必要的^貪枓對隨後工序中執行的熱壓著的條件進行 蓉於也r _載體在熱壓著完成後的製造缺陷並不_ …、有貝麵包含的製造缺陷。因此，存在一個缺
第5頁 @ ’ gp根據熱壓著已# & 熱虔著條件m B =覆膜載體所獲得的資料確定的 發明心隨後的覆膜載體。 備，可以在零件的熱壓著方法和熱壓著設 能抑制有缺陷產品的發:…相-致的條件下，仍 f根據本發明的熱壓著方法 中，熱壓著在第一邮杜4 τ…麼者叹備的貫施例 部件膨脹量根據熱壓著；：：：件=進行1中，第一 測形成在第_部件上°在執行熱㈣之前，檢 一和第二;P卞夕„ 、 和弟一標§己。獲得已檢蜊的第 最佳條件:ϊ據獲得的距離確定熱屋著的 部件的熱壓著。疋的上述最佳條件下，完成第一和第二 具體實施方式 本發月的各種實施例將參 附圖中相同或相類似的尸：：：、’圖τ釋應主思，整個 件，對相同或相類l:;f:相同或相類似的零件和元 實施例 痛似零件和兀件的描述將省略或簡化。. ’在圖六A和圖 的字母和數位 六B所示的現有技術中相 對相同元件的解釋在此 在下面解釋中 同的部件使用相同 省略。 圍 τ _ (作為吸引裝4 (未示）對電子部 像機3 (作為圈：攝件取)二的A膜載體52施行真空吸引。书 诼攝取1又備）攝取第一標記MA，攝像機4
第6頁 五、發明說明（4) (作為另一個圖像攝取技 裝置5根據使用攝像機3和4^\曰攝取第二標記MB。圖像處理 間的贩離。 ^彳于的圖像獲得標記MA和MB之 圖二是壓著部分 工具22安裝在具#純;;=體圖。在壓著賴内的壓著 柱體25的操作轴上，5 ^，部件24上。部件24固定到圓 來上下移動。 考碩21可利用驅動一個伺服馬達26 制部二1 = ϊ〃22的下移速度’時間控 的壓力。溫度控制；：控= !壓著工具22 度。 w…、您耆過私中壓者工具22的溫 、5制裳置15控制馬達控制部份Η，壓力控 服度控制部份丨3和時間控制部份14的全^ C ， 1 5具有兒揞辨田执处士別丨伪丄4的王邛刼作。控制裝置 造誤差量？如圖五所示的覆膜載體52的製 計值之標記ΜΑ和第二標記仙的實際距離和設 置15也、隶: ）得出的熱-著的各種條件。控制裳 連到一個圖像處理裝置5上.，如下面將 裝 控制裝置15根據從圖像處理裝置5傳來的： 成，用壓著工具22將電子部件51屋著到透明匕果(作在;； 一 #件）的過程中，自動確定壓著條件。 第 的確：：法參照附圖三的描述將解釋確定熱㈣最佳條件 圖四顯示了11設計值+ Χ2"，"設計值+ Χ1"，„嗖呀值" "設計值-Χ3"，和"設計值-Χ4"之間的不相等關係"，°這裏，’
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50368J —— ——……丨,嶋 五、發明說明（5) __________ =|?3和X4是正數，應滿足相對關係"XUX2"和 =先，在步驟3301，先核查第一標記Μ 々 之間的距離D1 (見圖六Α )的測量結理二第：私—Β 大’比設計值+ Χ2" j、。a l上 比没計值+ X1" 條件替換為條件丄;30=關係：足’熱壓著的當前 壓著的指令而且發出在條件2下啟動熱 此9 Λ'五所示’與條件1作為標準熱壓著條株㈠政 件2表明較高的溫度，較短 ，條件比較，條 具22下降速度，者在 τ J重負何和較高的壓著工 下覆膜載體52的膨脹量變小。 考相對於在條件1 為了在標準條件下完成熱壓著， ，比7值要長的情況τ ’步驟_的核杳 。然而，因為覆膜載體52的膨脹量可以—''1果祝表不為疋 =·〇1的核*結果表明為"產；m; 小。當滿足上設計值_Χ4"大而比"設計值Χ3,， S30H ίΐ 選擇條件3進行熱壓著（步驟 條件3/出啟動熱壓著指令（步驟二。 表明了較低：：声與Π。條件的條件1相比較， 著工具22下降速二：：：：間’二輕^和_ 情況相比，覆膜載體52的膨脹量：大。熱壓者與在條件1的 為了在標準條件下完成熱壓著，在覆膜载體52的 五、發明說明(6) 比設計值短的情況下，步驟S302的枝杳 二而，：在條件3下完成熱壓栽二果表示為"是"， 增加，就可以避免產生任何缺陷戰體52的膨脹量可以 當步驟S302檢查結果表示為〃否：。 核查距離D1的測量結果是否不比"讲士在步驟S303進一步 計值+ ΧΓ，大。當上述關係 θ，叹叶值〜X3"小且不比"設 著的標準條件（步驟S3〇7)，而1 i條件1選擇作為熱壓 著的指令（步驟S31〇) 〇 發出在條件1啟動熱壓 當熱壓著處於標準條件下完， 果表示"是"，相應的，當熱壓著在J步驟以。3的核查結 免產生缺陷產品。 条件1下執行，可以避 熱壓著被禁止（步 當在步驟S3 03核查結果表示η否 驟S306 ) 〇 出現步驟S30 3的核查結果表明 膜盤# R 9 &机斗庶心，，e 货的情況僅僅因為覆 犋載版52與3“十值相比太長或太短。： 避免缺陷產品的產生。相應的，埶 ：彳：J以 止。 …、奮者的工作必須被禁 妒成m一叉條件執行熱壓著工作中，覆膜載體52上 .^ ^ ^ χΐΑ /牡忭馬熱壓者目的物的透明板56上形 成的弟(對應第-標魏）之間的位置差，如圖 /、Α所示，以及在覆膜載體52上形成的第二標記Μβ和在透 明板56上形成的第二標記ΝΒ (對應第二標記〇 )之間的位 置差分別利用攝像機3和4檢測。外引線54和電極58之間的 相對位置的安排，使上述的兩種位置差值成為一致，該方
第9頁 五、發明說明（7) 式與傳統方式相同。 — 如上所述，覆膜 著之前測定，构戮體上的標記之間的距離在執行熱壓 佳條件，或者停止埶為，量結果的距離，選擇熱壓著的最 生。 "、壓著，因此可以減小缺陷產品的產 在上述的實施例中 距離，熱壓著甲’/、測量覆膜載體上的標記之間的 由如下：透明按照作為測量結果的距離而改變。其理 高的準確声f56的材料一般是玻璃板，在尺寸上具有很 然而二在ί匕製造工序以後很難使之變形。 寸精度低的；覆膜載體壓著到選定的材料是尺 脂，希望除了、11Ϊ疋電路製造工序後易於變形的樹 定材料上的膜載體標記間距離之外’熱1接的選 t;己？距離和選定材料上標記之間距離的比較匕定 熱壓著的最佳條件。 枚心果决疋 3拍’如圖六A和六β所^首先’攝像機 1攝％子邻件51中的覆膜載體52上的第一標記ΜΑ和透 板56上對應於第一標記ΜΑ的第一標記ΝΑ的照片。然 像機4拍攝電子部件51中的覆膜載體52上的第二標記肋和 透明板56上對應於第二標記ΜΒ的第二標記ΝΒ的ρ片該ϋ 义圖像處理裝置5獲取在電子部件51上的第二標記:广 和第二標記MB之間的距離D1和透明板56上的第一姆* pj Jf 第一標記N B之間的距離D 2。然後，控制裝置1 5根據下 比較程式自動選擇示於圖五用於熱壓著的最佳條面的 '、干〔條件
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發明說明（8) 1 ’條下件2或條件3中的-個）。 量的拌面描述在覆膜載體52的膨脹量大於锈明姑以 里的情況下的比較程式。 /脹里大於透明板56的膨脹 即，在距離D1和D2之„从* 大而比"標準值+ X2" f差值"D2-D1"比"標準值+ X1" 然後’熱屢著根據條件3二小時，選擇熱壓著條件3。 在差值"D2-D1”比"隹& v (Was)小的情況下/值_X4"大而比"標準值-Χ3” 件2執行熱壓著。〜擇熱壓著條件2。然後，根據條 (在ί ί rr;Di :，標準值]3"大而比"標準值出"小 行熱壓著。，忠擇熱壓著條件1。然後，根據條件！執 這樣，即使電子部件51和透明板56兩者都有尺 ^乃能夠對電子部件51和透明㈣進行熱壓接而不會） "1)2缺陷產品°在上述情況下，標準值是根據設計值* 的差值，XI，X2，X3和X4中的每一個都是正值。 按上述的方式，根據距離D1和!)2之間位置的差值選才 熱壓著條件，這裏D1是標記MA和MB之間的值，而距離!)2 ) 標記NA和NB之間的值。 '
然而，本發明並不限於這種方式，例如，也可以根據 標記MA和MB之間距離D1和標記NA和NB之間距離D2·的比值來 選擇熱壓著條件。即：比值r〇 (D1/D2 X100% )和比值R1 比較，這裏，R0是距離D1對根據設計的距離D2的比值，而 是距離D1對實際距離D2的比值。
第11頁 ：> 05683 發明說明（9) 五 CXKX2) ‘ = 1，當比值R1 大於+ 而小於"R0+X2I 小於10-X3" a4 f著條件2 °而當比值R1A於"R〇-m "R0-X3”而小二R 3 )" 熱I著條件3。當比值们大於 1。 、反〇 + Xl (在允許值内），選擇熱壓著條件 测。然而：本#第-部件上形成的標記僅用作檢 形狀上具有疋於此，不言自8月’可以使用在 、、。構特徵的端點和能相互區別開的標記。 明板56用作ί述ί :例子部件51用作第-部件，透 :疋本發明並不受實施例的限定，例如，也可以 用於將ic (積體電路） 了以將本發明 :。其中，帶形零件用作第-部件，而1C晶片作第 工JL2而2 i的3實：例已經解釋了在加熱器23安裝在壓著 壓著工具22上，，也可以：一=23並不總是 具22施加的壓力、著過程中麗著工 替對壓著工具22溫度的控制。熱裝置的加熱值代 冰i : ΐ 對第一部件和第二部件熱壓著的埶壓著條 速度中的一個。 者¥間和壓耆工具的 如已詳細敘述的，根據本發明，在執行熱壓著之前， 第一部件 果的距離 生。 在不 其他特定 是說明性 專利範圍 利範圍的 明的範圍 上的標記之間的距論 ，執行熱壓著或放奈 =蕙，根據作為測量結 放棄，延樣減少缺陷產品的發 離開本發明精袖 形式的實施方式f 11徵的情況下，還可以有 的，而不是限I，本貫施例在所有方面只能認為 表明，而不是的本發明的保護範圍由申請 等同的含意和範插述表明，而且在申請專 内。 '所有變化也應包括在本發 503683 圖式簡單說明 附圖說明 圖一是用於測量標記之間距離的距離測量部件的部份立體 圖； 圖二是壓著部件的部份立體圖； * 圖三是解釋確定熱壓著條件的確定方法的流程圖； 画四是顯示如國三所示的各種值，如”設計值+x r之間的 不相等關係的不意圖， 圖五是顯示熱壓著條件具體實例的圖表； 圖六A和國六B是解釋現有技術熱壓著方法的示意圖。
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Claims (1)

  1. 503683 六、申請專利範圍1 一種熱壓著方法，執行將楚_如^ r* 熱壓著，壓著中’第—邻株/ 一 °卩件壓著到第二部侔 弟。卩件的膨脹量根據熱壓。卩件的者條件而變 化，包括： 在執行熱壓著前，對形成在第一部件上 進行檢測； 的第 和第 獲取經檢測的第一和第-庐 ^ 矛—^ §己之間的距錐* 根據所獲取的距離確定熱壓著的條件；離， f上述所確定的條件下，執行對第一 _ 著 e pp — 榡記 件的熱 壓 種熱壓著方法，執行 ，十 W濫者到第一量舻Μ扭 部份的化，包括： ·，，-、I根據熱壓著# #的 6 一喱熟壓者万法，執行將 熱壓著，壓著中，第一立 '牛I者到第 ,^ ^ 4件的膨脹量抱Μ也_ 壓著#，對形成在第-部件上的第 而變 和第 獲取經檢測的形成在第一部件上的第—和距離； 標記 第二標記 =行熱壓著之前，檢測形成在第二 的 私圯，該標記對應于形成在第_部件上的#的弟 二部件上的第—和第二椁 根據上述獲取的在第一和第二部件上 記； 獲取經檢測的位於第離； 壓著條件； 在上述所確定 之間的 和第 和第二標 記之間的趿 的標記的距 的條件下，執行對第一和第 離確定熱 部件的熱 壓 第15頁 申請專利範圍 著 3對宽根_據申請專利範圍第1項所述的熱壓著方法，其中所述 的茂Γ和第二部件執行的熱壓著的條件至少包括壓著工且 4 Λ者/度，a著負載’壓著時間和壓著速度中的-個:、 一 X據申請專利範圍第2項所述的熱壓著方法，其中對 著；Ϊ二部:?執行的熱壓著的條件至少包括壓著工具的壓 5 __又，壓著負載，壓著時間和壓著速度中的一個。 到第—二種裝厂置’利用壓著工具執行將第一部件髮著 一邻件的熱壓著，在壓著中，第一 j壓著條件而變化n 仵㈣脹置根據 圖像攝取裝置，攝取形成於第一 記的圖像； /成於弟邛件上的第一和第二標 ^ f像處理裝置，根據利用圖像攝取裝置所#彳，μ ^ # :第-和第二標記之間的距離；#σ 置所獲侍的圖像獲 用圖像處理裝置獲得的位於第-部件 知記之間的距離，確定熱壓著工且 千 定的條件下，㈣熱壓著卫具㈣作1、的條件，並在所確 6 · —種熱壓著裝置，利用壓著 到第—邱杜认也r 和用靨者工具執打將第一部件壓荖 J弟一邛件的熱壓著，在壓著中， 丨千整者 熱壓著條件而變化，包括： 弟邛件的膨脹量根據 部件上的第_和第二 部件上的第_和第二 標記的圖像 二圖像攝取裝置，攝取形成在第 ，的圖像並攝取對應于形成在第— 記的形成在第二部件的第一和第 503683 六、申請專利範圍 成在第一部件上的第一和第二標記之間的距離和在第二部 件上的第一第二標記之間的距離，和 一控制裝置，根據所獲得的在第一和第二部件上的標記之 間的距離，確定壓著工具的條件，以及在上述所確定的條 件下，控制利用壓著工具對第一和第二部件的熱壓著。 7 ·根據申請專利範圍第5項所述的熱壓著裝置，其中對第 一和第二部件執行熱壓著的所述的熱壓著條件至少包括熱 壓著工·具的壓著溢度，壓著負載，壓著時間和壓著速度中 的一個。
    8 ·根據申請專利範圍第6項所述的熱壓著裝置，其中對第 一和第二部件執行熱壓著的所述的熱壓著條件至少包括熱 壓著工具的壓著温度，壓著負載，壓著時間和壓著速度中 的一個。
    第17頁
TW90131741A 2000-12-21 2001-12-20 Heat bonding method and heat bonding device TW503683B (en)

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