CN1223247C - 制造刻蚀电路的方法 - Google Patents

制造刻蚀电路的方法 Download PDF

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CN1223247C
CN1223247C CNB998110922A CN99811092A CN1223247C CN 1223247 C CN1223247 C CN 1223247C CN B998110922 A CNB998110922 A CN B998110922A CN 99811092 A CN99811092 A CN 99811092A CN 1223247 C CN1223247 C CN 1223247C
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CN1319323A (zh
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K·梅尔
U·拉赫
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VAN DICO AG
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

用于制造印制电路板的一种方法，其特征在于以下的方法步骤：(A)用液体的负电镀抗蚀剂的通孔接触铜层压板的两侧涂层；(B)通过按图案曝光结构化抗蚀剂涂层，在此通过掩膜覆盖接触通孔，并且随后显影；(C)电镀涂敷金属抗蚀剂；(D)除去残留在层压板上的交联的负光致抗蚀剂；(E)借助于刻蚀溶液除去暴露的铜：和(F)借助于剥离溶液除去金属抗蚀剂，提供具有减少了的环形圈的接触通孔。

Description

制造刻蚀电路的方法
本发明涉及用于制造具有接触通孔的印制电路板的一种方法。
在通孔接触铜层压板的结构化时的问题是孔对刻蚀介质的防护。
在M。Hummel著：″印制电路板工艺入门″，98-100页，Eugen G。Lenze出版社股份公司(1991)中，推荐“帐蓬遮盖(Tenting)技术”用于解决此问题。像帐蓬那样放在孔上的固体膜(干膜抗蚀剂)在此用作为防刻蚀剂。这种方法的缺点却是出现围绕接触通孔的铜制的环形圈，由此限制印制电路板的布线密度。按H。Schwab著：“印制电路板用途的光致抗蚀剂的电解沉积“，EIPC冬季会议1992，如果采用借助于电浸漆(电解沉积)敷设的正片光致抗蚀剂作为防刻蚀剂的话，可以减少或甚至于完全消除这样的环形圈。通常在技术中所采用的正片光致抗蚀剂却需要比较长的曝光时间。此外电浸漆是连带着可观的技术工作量的。
本发明的任务曾在于开发用于结构化通孔接触的内和外层的较少费事的一种方法。
现在已发现，在采用负工作的液态电镀抗蚀剂时可以显著地减少或完全避免环形圈的形成。
本发明的对象是用于制造具有接触通孔的印制电路板的一种方法，其特征在于以下的方法步骤：
(A)用液体的负电镀抗蚀剂的通孔接触铜层压板的两侧涂层；
(B)通过按图案曝光结构化抗蚀剂涂层，在此通过掩膜覆盖接触通孔，并且随后显影；
(C)电镀涂敷金属抗蚀剂；
(D)除去残留在层压板上的交联的负光致抗蚀剂；
(E)借助于刻蚀溶液除去暴露的铜：和
(F)借助于剥离溶液除去金属抗蚀剂。
通过所属的图阐明本发明。
图1展示一种铜层压板(具有敷设通孔3的内或外层)，在方法步骤(A)中用例如通过离心、浸渍、刮胶涂层、幕浇铸、丝网印刷、刷笔涂敷、喷涂、静电喷涂或辊压涂层的通常方法用液态负光致抗蚀剂涂敷此铜层压板。
铜层压板一般由在两侧面上用薄铜箔(2，图1，层厚约10-50μm)涂敷的绝缘衬底(1，图1)制成。优先采用玻璃纤维加强的环氧树脂，尤其是用合适的防燃剂配备的环氧树脂作为铜层压板的绝缘衬底(FR-4层压板)。
优先借助于辊压涂层或丝网印刷涂敷层压板。
必要时随后通过在循环空气炉或红外线炉中的干燥来除去溶剂。如此涂敷的已干燥光敏层(4，图2)的厚度合理地为3-30μm，优先为5-15μm。
在方法步骤(B)中通过相应于应安放结构的掩膜按已知的方法曝光涂敷的层压板，在此固化在以后要除去的面积上的抗蚀组合物。必要时接在方法步骤(B)之后进行用于抗蚀组合物中的聚合物完全交联的加热后硬化。
通过用溶剂，优先用水或水状碱溶液的处理，按已知的方法除去未交联的聚合物(图2)。
在从其中通过显影已除去感光聚合物的那些面积上，现在在方法步骤(C)中借助于已知的方法电镀析出金属抗蚀剂(5，图3)。
优先的金属抗蚀剂是锡、镍、铅、银、金或含有这些金属中之一的合金。尤其是优先是锡。
在方法步骤(D)中通过用合适的溶剂(剥离)的处理，优先通过水状氢氧化钠或氢氧化钾，必要时在提高了的温度下除去还残留在板上的交联的光致抗蚀剂。
随后用铜刻蚀溶液，例如用溶液Cu(NH3)4Cl2，KMnO4或(NH4)2S2O8处理层压板，在此完全除去暴露的铜表面(图4)。
然后在最后的过程步骤中将受保护的铜印制导线和接触通孔从金属抗蚀剂中解脱出来。通过用合适的剥离溶液的处理按已知的方法实现这一点，此剥离溶液虽然侵蚀和溶解抗蚀剂的金属，可是不侵蚀和溶解铜(图5)。合适的剥离溶液通常含有例如像盐酸或四氟硼酸那样的稀释的酸。
如果是合理的话，也可以让金属抗蚀剂留在铜上。在采用锡作为金属抗蚀剂的情况下随后优先地连接导至熔化和因此导至包围铜面积的加热步骤。以此方式获得具有接触通孔的双面印制电路板，这些接触通孔可以不具有或只具有很小的环形圈。
实例1：
借助于用Probimage1020(负抗蚀剂，汽巴(Ciba)专门化学品)的辊压涂敷剂来涂敷具有0.25mm接触通孔的0.3mm厚的未结构化的内层。随后在循环空气炉中的80℃下5分钟干燥敷层。因此达到11mm的抗蚀剂的层厚。随后在两侧通过含有应生成导线图案作为正片图的光掩膜曝光。光掩膜在此用0.3mm直径的点覆盖具有0.25mm直径的接触通孔。曝光能量为150mJ/cm2。在40秒钟期间在2巴，35℃的情况下，在喷淋显影剂中用1％的碳酸钠溶液溶解出(显影)未交联的敷层，用去离子水冲洗和热空气干燥之后，将板浸入电镀锡池中。在酸性的锡池中在所显影的位置上阴极地建立约8mm厚的层。在下一个步骤中在喷淋设备中的60℃，喷淋压力3巴的情况下，用3％的氢氧化钾处理和从板中除去光交联的Probimage1020。现在用含氨的氯化铜(II)溶液刻蚀去除暴露出来的铜面。用去离子水冲洗板，并且在最后的步骤中用酸性剥离溶液除去锡。人们获得具有接触通孔的内层，这些接触通孔仅有0.025mm圈厚的小的残余圈。接触通孔没显出表面侵蚀的征兆。

Claims (3)

1.用于制造具有接触通孔的印制电路板的一种方法，其特征在于以下的方法步骤：
(A)用液体的负电镀抗蚀剂涂覆通孔接触铜层压板的两侧；
(B)通过按图案曝光对抗蚀剂涂层进行结构化，在此通过掩膜覆盖接触通孔，并且随后显影；
(C)通过电镀涂敷金属抗蚀剂；
(D)除去残留在层压板上的交联的负光致抗蚀剂；
(E)借助于刻蚀溶液除去暴露的铜：和
(F)借助于剥离溶液除去金属抗蚀剂。
2.按权利要求1的方法，其特征在于，在方法步骤(A)中借助于辊压涂层或丝网印刷涂敷铜层压板。
3.按权利要求1的方法，其特征在于，在方法步骤(C)中采用锡、镍、铅、银、金，或含有这些金属之一的合金作为金属抗蚀剂。
CNB998110922A 1998-09-18 1999-09-09 制造刻蚀电路的方法 Expired - Fee Related CN1223247C (zh)

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JP4624217B2 (ja) * 2005-09-02 2011-02-02 日本メクトロン株式会社 回路基板の製造方法
US20080221590A1 (en) * 2007-03-05 2008-09-11 Intuitive Surgical, Inc. Apparatus for positioning and holding in place a manually manipulated medical device during the performance of a robotically assisted medical procedure
TW200941322A (en) * 2008-03-28 2009-10-01 Tpk Touch Solutions Inc Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit
TWI459436B (zh) * 2008-10-27 2014-11-01 Tpk Touch Solutions Inc The Method of Making Double - sided Graphic Structure of Touch Circuit
KR101041130B1 (ko) * 2008-10-31 2011-06-13 주식회사 심텍 니켈 도금을 이용한 인쇄회로기판 제조방법
CN101932206B (zh) * 2009-06-25 2012-06-13 富葵精密组件(深圳)有限公司 多层电路板的制作方法
US8840077B2 (en) 2011-08-24 2014-09-23 Coopersurgical, Inc. Table-mounted surgical instrument stabilizers
CN103917053A (zh) * 2014-04-22 2014-07-09 上海尚容电子科技有限公司 镍作为碱性蚀刻抗蚀层材料的应用
JP6734785B2 (ja) * 2014-12-08 2020-08-05 三井金属鉱業株式会社 プリント配線板の製造方法
CN105899003B (zh) * 2015-11-06 2019-11-26 武汉光谷创元电子有限公司 单层电路板、多层电路板以及它们的制造方法
CN109069215B (zh) 2016-07-14 2022-07-15 直观外科手术操作公司 用于控制外科器械的系统和方法
CN108243571A (zh) * 2016-12-23 2018-07-03 东莞新科技术研究开发有限公司 柔性电路板的制造方法

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KR20010072343A (ko) 2001-07-31
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AU5861599A (en) 2000-04-10
ATE242590T1 (de) 2003-06-15
WO2000018199A1 (de) 2000-03-30
ES2200552T3 (es) 2004-03-01
CN1319323A (zh) 2001-10-24
TW444526B (en) 2001-07-01
EP1116421A1 (de) 2001-07-18
KR100749444B1 (ko) 2007-08-17
CA2342232C (en) 2008-12-23
CA2342232A1 (en) 2000-03-30
US6653055B1 (en) 2003-11-25
JP2002525880A (ja) 2002-08-13
EP1116421B1 (de) 2003-06-04

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