CN1219838A - 在散热器上固定电子器件封装件 - Google Patents

在散热器上固定电子器件封装件 Download PDF

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Publication number
CN1219838A
CN1219838A CN98119435A CN98119435A CN1219838A CN 1219838 A CN1219838 A CN 1219838A CN 98119435 A CN98119435 A CN 98119435A CN 98119435 A CN98119435 A CN 98119435A CN 1219838 A CN1219838 A CN 1219838A
Authority
CN
China
Prior art keywords
mentioned
underframe
heat
radiator
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN98119435A
Other languages
English (en)
Chinese (zh)
Inventor
D·L·克莱门茨
S·F·埃德瓦德斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermalloy Inc
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Publication of CN1219838A publication Critical patent/CN1219838A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1405—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN98119435A 1997-10-07 1998-10-07 在散热器上固定电子器件封装件 Pending CN1219838A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94616097A 1997-10-07 1997-10-07
US946160 2001-09-04

Publications (1)

Publication Number Publication Date
CN1219838A true CN1219838A (zh) 1999-06-16

Family

ID=25484034

Family Applications (1)

Application Number Title Priority Date Filing Date
CN98119435A Pending CN1219838A (zh) 1997-10-07 1998-10-07 在散热器上固定电子器件封装件

Country Status (7)

Country Link
JP (1) JPH11135693A (it)
KR (1) KR19990036628A (it)
CN (1) CN1219838A (it)
DE (1) DE19846186A1 (it)
FR (1) FR2769457A1 (it)
GB (1) GB9819380D0 (it)
IT (1) IT1302354B1 (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104009009A (zh) * 2013-02-22 2014-08-27 富士通株式会社 电子部件单元和固定结构
CN106068068A (zh) * 2015-04-23 2016-11-02 联合运动集团有限合伙公司 移动式电子设备的封盖

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS59208762A (ja) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ソリツドステ−ト装置を放熱部材に圧接する装置
US4847449A (en) * 1986-07-09 1989-07-11 Thermalloy Incorporated Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards
US4933746A (en) * 1988-09-12 1990-06-12 Aavid Engineering, Inc. Three-legged clip
EP0855089B1 (en) * 1995-10-13 2004-07-07 Aavid Thermalloy LLC Solderable transistor clip and heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104009009A (zh) * 2013-02-22 2014-08-27 富士通株式会社 电子部件单元和固定结构
CN106068068A (zh) * 2015-04-23 2016-11-02 联合运动集团有限合伙公司 移动式电子设备的封盖
CN106068068B (zh) * 2015-04-23 2019-06-04 联盟体育用品有限合股集团 移动式电子设备的封盖

Also Published As

Publication number Publication date
GB9819380D0 (en) 1998-10-28
IT1302354B1 (it) 2000-09-05
ITRM980624A1 (it) 2000-04-02
JPH11135693A (ja) 1999-05-21
KR19990036628A (ko) 1999-05-25
FR2769457A1 (fr) 1999-04-02
DE19846186A1 (de) 1999-05-12

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C06 Publication
PB01 Publication
C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication