IT1302354B1 - Attacco di contenitori di dispositivi elettronici a dissipatoritermici - Google Patents

Attacco di contenitori di dispositivi elettronici a dissipatoritermici

Info

Publication number
IT1302354B1
IT1302354B1 IT1998RM000624A ITRM980624A IT1302354B1 IT 1302354 B1 IT1302354 B1 IT 1302354B1 IT 1998RM000624 A IT1998RM000624 A IT 1998RM000624A IT RM980624 A ITRM980624 A IT RM980624A IT 1302354 B1 IT1302354 B1 IT 1302354B1
Authority
IT
Italy
Prior art keywords
attack
containers
electronic devices
thermal dissipators
dissipators
Prior art date
Application number
IT1998RM000624A
Other languages
English (en)
Inventor
Donald L Clemens
Steven F Edwards
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Publication of ITRM980624A1 publication Critical patent/ITRM980624A1/it
Application granted granted Critical
Publication of IT1302354B1 publication Critical patent/IT1302354B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1405—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT1998RM000624A 1997-10-07 1998-10-02 Attacco di contenitori di dispositivi elettronici a dissipatoritermici IT1302354B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94616097A 1997-10-07 1997-10-07

Publications (2)

Publication Number Publication Date
ITRM980624A1 ITRM980624A1 (it) 2000-04-02
IT1302354B1 true IT1302354B1 (it) 2000-09-05

Family

ID=25484034

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1998RM000624A IT1302354B1 (it) 1997-10-07 1998-10-02 Attacco di contenitori di dispositivi elettronici a dissipatoritermici

Country Status (7)

Country Link
JP (1) JPH11135693A (it)
KR (1) KR19990036628A (it)
CN (1) CN1219838A (it)
DE (1) DE19846186A1 (it)
FR (1) FR2769457A1 (it)
GB (1) GB9819380D0 (it)
IT (1) IT1302354B1 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014165231A (ja) * 2013-02-22 2014-09-08 Fujitsu Ltd 電子部品ユニット及び固定構造
US9467190B1 (en) * 2015-04-23 2016-10-11 Connor Sport Court International, Llc Mobile electronic device covering
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS59208762A (ja) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ソリツドステ−ト装置を放熱部材に圧接する装置
US4847449A (en) * 1986-07-09 1989-07-11 Thermalloy Incorporated Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards
US4933746A (en) * 1988-09-12 1990-06-12 Aavid Engineering, Inc. Three-legged clip
EP0855089B1 (en) * 1995-10-13 2004-07-07 Aavid Thermalloy LLC Solderable transistor clip and heat sink

Also Published As

Publication number Publication date
ITRM980624A1 (it) 2000-04-02
JPH11135693A (ja) 1999-05-21
FR2769457A1 (fr) 1999-04-02
CN1219838A (zh) 1999-06-16
DE19846186A1 (de) 1999-05-12
GB9819380D0 (en) 1998-10-28
KR19990036628A (ko) 1999-05-25

Similar Documents

Publication Publication Date Title
IT1308213B1 (it) Attacco di contenitori di dispositivi elettronici a dissipatoritermici.
DE59811067D1 (de) Wärmeisolierende wandung
DE59804353D1 (de) Wärmeisolierende wandung
DK1025407T3 (da) Varmeisolerende væg
NO20001845L (no) Varmeisolerende belegg
EE200000291A (et) 2-fenüülasendatud imidasotriasinoonid
DE69940203D1 (de) Entfernung einer thermischen isolierbeschichtung
DE59810682D1 (de) Wärmeisolierende wandung
DK1025406T3 (da) Varmeisolerende væg
DE59809589D1 (de) Wärmeisolierende wandung
IT1302354B1 (it) Attacco di contenitori di dispositivi elettronici a dissipatoritermici
FI114753B (fi) Lämpötilan kompensointi elektroniikkalaitteissa
ATA153797A (de) Wärmedämmstoff
TW328390U (en) Heat dissipating structure of a CPU
KR970058315U (ko) 전자 부품 운반 상자
GB9623855D0 (en) Thermal protection of electronic devices
BR7700393U (pt) Construtividade aplicada a tijolo
KR970064081U (ko) 전자제품의 휴즈교환구조
EE00189U1 (et) Kasvualusepakend
IT239455Y1 (it) Dissipatore di calore per componenti elettronici dotato di strutturamodulare
IT1309808B1 (it) Pannello per solaio a cappotto termoisolante
TW440019U (en) Improved structure of CPU modular heat dissipation device
BR7702487U (pt) Disposição introduzida em jarra térmica
BR7703090U (pt) Isolante térmico
NO974756D0 (no) Anordning for utnyttelse av energi

Legal Events

Date Code Title Description
0001 Granted