KR19990036628A - 히트 싱크에 전자 장치 패키지를 부착한 장치 - Google Patents

히트 싱크에 전자 장치 패키지를 부착한 장치 Download PDF

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Publication number
KR19990036628A
KR19990036628A KR1019980037470A KR19980037470A KR19990036628A KR 19990036628 A KR19990036628 A KR 19990036628A KR 1019980037470 A KR1019980037470 A KR 1019980037470A KR 19980037470 A KR19980037470 A KR 19980037470A KR 19990036628 A KR19990036628 A KR 19990036628A
Authority
KR
South Korea
Prior art keywords
heat sink
mounting base
electronic device
base
extending
Prior art date
Application number
KR1019980037470A
Other languages
English (en)
Korean (ko)
Inventor
도날드 엘. 클레멘스
스티븐 에프 에드워드
Original Assignee
존슨 로빈 디.
서말로이 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 존슨 로빈 디., 서말로이 인코퍼레이티드 filed Critical 존슨 로빈 디.
Publication of KR19990036628A publication Critical patent/KR19990036628A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1405—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019980037470A 1997-10-07 1998-09-11 히트 싱크에 전자 장치 패키지를 부착한 장치 KR19990036628A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94616097A 1997-10-07 1997-10-07
US8/946,160 1997-10-07

Publications (1)

Publication Number Publication Date
KR19990036628A true KR19990036628A (ko) 1999-05-25

Family

ID=25484034

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980037470A KR19990036628A (ko) 1997-10-07 1998-09-11 히트 싱크에 전자 장치 패키지를 부착한 장치

Country Status (7)

Country Link
JP (1) JPH11135693A (it)
KR (1) KR19990036628A (it)
CN (1) CN1219838A (it)
DE (1) DE19846186A1 (it)
FR (1) FR2769457A1 (it)
GB (1) GB9819380D0 (it)
IT (1) IT1302354B1 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014165231A (ja) * 2013-02-22 2014-09-08 Fujitsu Ltd 電子部品ユニット及び固定構造
US9467190B1 (en) * 2015-04-23 2016-10-11 Connor Sport Court International, Llc Mobile electronic device covering
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS59208762A (ja) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ソリツドステ−ト装置を放熱部材に圧接する装置
US4847449A (en) * 1986-07-09 1989-07-11 Thermalloy Incorporated Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards
US4933746A (en) * 1988-09-12 1990-06-12 Aavid Engineering, Inc. Three-legged clip
EP0855089B1 (en) * 1995-10-13 2004-07-07 Aavid Thermalloy LLC Solderable transistor clip and heat sink

Also Published As

Publication number Publication date
ITRM980624A1 (it) 2000-04-02
JPH11135693A (ja) 1999-05-21
FR2769457A1 (fr) 1999-04-02
CN1219838A (zh) 1999-06-16
DE19846186A1 (de) 1999-05-12
GB9819380D0 (en) 1998-10-28
IT1302354B1 (it) 2000-09-05

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Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid