CN121729381A - 表面处理氮化铝粉末 - Google Patents

表面处理氮化铝粉末

Info

Publication number
CN121729381A
CN121729381A CN202480052475.7A CN202480052475A CN121729381A CN 121729381 A CN121729381 A CN 121729381A CN 202480052475 A CN202480052475 A CN 202480052475A CN 121729381 A CN121729381 A CN 121729381A
Authority
CN
China
Prior art keywords
aluminum nitride
nitride powder
silane compound
powder
treated aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480052475.7A
Other languages
English (en)
Chinese (zh)
Inventor
稻川寿盛
稻木喜孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of CN121729381A publication Critical patent/CN121729381A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/072—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202480052475.7A 2023-09-06 2024-09-04 表面处理氮化铝粉末 Pending CN121729381A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023144232 2023-09-06
JP2023-144232 2023-09-06
PCT/JP2024/031660 WO2025053161A1 (ja) 2023-09-06 2024-09-04 表面処理窒化アルミニウム粉末

Publications (1)

Publication Number Publication Date
CN121729381A true CN121729381A (zh) 2026-03-24

Family

ID=94924093

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480052475.7A Pending CN121729381A (zh) 2023-09-06 2024-09-04 表面处理氮化铝粉末

Country Status (4)

Country Link
JP (1) JP7854113B2 (https=)
CN (1) CN121729381A (https=)
TW (1) TW202525705A (https=)
WO (1) WO2025053161A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4088768B2 (ja) * 2002-08-27 2008-05-21 東洋アルミニウム株式会社 窒化アルミニウム系粉末
JP4105141B2 (ja) * 2004-10-25 2008-06-25 電気化学工業株式会社 窒化アルミニウム粉末の製造方法
US9711378B2 (en) 2014-01-08 2017-07-18 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
WO2018164123A1 (ja) * 2017-03-07 2018-09-13 株式会社トクヤマ 粗大粒子を含まない窒化アルミニウム粉末
WO2019013325A1 (ja) * 2017-07-14 2019-01-17 富士フイルム株式会社 表面修飾無機窒化物、組成物、熱伝導材料、熱伝導層付きデバイス
CN110799454B (zh) * 2017-07-14 2022-12-30 富士胶片株式会社 表面修饰无机氮化物、组合物、导热材料及带导热层的器件
JP7434818B2 (ja) * 2019-11-12 2024-02-21 株式会社レゾナック 珪素含有酸化物被覆窒化アルミニウム粒子の製造方法および放熱性樹脂組成物の製造方法
JP7393975B2 (ja) * 2020-02-27 2023-12-07 株式会社トクヤマ 複合窒化アルミニウム粉末及びその製造方法
DE112021006805T5 (de) * 2020-12-15 2023-11-02 Tokuyama Corporation Hydrophobes Aluminiumnitridpulver und Verfahren zur Herstellung desselben
JP2023115939A (ja) * 2022-02-09 2023-08-22 株式会社トクヤマ 表面処理窒化アルミニウム粉末

Also Published As

Publication number Publication date
WO2025053161A1 (ja) 2025-03-13
TW202525705A (zh) 2025-07-01
JP7854113B2 (ja) 2026-04-30
JPWO2025053161A1 (https=) 2025-03-13

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