CN1214699C - 用于表面安装的具有锥形壁端的屏蔽外壳和采用该屏蔽外壳的无线电话 - Google Patents

用于表面安装的具有锥形壁端的屏蔽外壳和采用该屏蔽外壳的无线电话 Download PDF

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Publication number
CN1214699C
CN1214699C CNB008035652A CN00803565A CN1214699C CN 1214699 C CN1214699 C CN 1214699C CN B008035652 A CNB008035652 A CN B008035652A CN 00803565 A CN00803565 A CN 00803565A CN 1214699 C CN1214699 C CN 1214699C
Authority
CN
China
Prior art keywords
wall
conductive
tapered end
cavity
equipment according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008035652A
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English (en)
Chinese (zh)
Other versions
CN1340291A (zh
Inventor
G·S·蒙多利尔
R·C·伦德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ericsson Inc
Original Assignee
Ericsson Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Inc filed Critical Ericsson Inc
Publication of CN1340291A publication Critical patent/CN1340291A/zh
Application granted granted Critical
Publication of CN1214699C publication Critical patent/CN1214699C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10803—Tapered leads, i.e. leads having changing width or diameter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
  • Mobile Radio Communication Systems (AREA)
CNB008035652A 1999-02-09 2000-01-12 用于表面安装的具有锥形壁端的屏蔽外壳和采用该屏蔽外壳的无线电话 Expired - Fee Related CN1214699C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/246,971 US6175077B1 (en) 1999-02-09 1999-02-09 Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same
US09/246,971 1999-02-09

Publications (2)

Publication Number Publication Date
CN1340291A CN1340291A (zh) 2002-03-13
CN1214699C true CN1214699C (zh) 2005-08-10

Family

ID=22932974

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008035652A Expired - Fee Related CN1214699C (zh) 1999-02-09 2000-01-12 用于表面安装的具有锥形壁端的屏蔽外壳和采用该屏蔽外壳的无线电话

Country Status (7)

Country Link
US (1) US6175077B1 (enExample)
JP (1) JP2002537640A (enExample)
CN (1) CN1214699C (enExample)
AU (1) AU2608600A (enExample)
DE (1) DE10084137B4 (enExample)
MY (1) MY123494A (enExample)
WO (1) WO2000048441A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720066B (zh) * 2015-12-24 2021-03-01 美商英特爾公司 電子裝置封裝體及其製作方法

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US20070137653A1 (en) * 2000-03-13 2007-06-21 Wood Thomas J Ventilation interface for sleep apnea therapy
NL1016549C2 (nl) * 2000-10-06 2002-04-10 Stork Screens Bv Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
US6552261B2 (en) 2001-04-27 2003-04-22 Bmi, Inc. Push-fit shield
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7084356B2 (en) * 2003-12-08 2006-08-01 Laird Technologies, Inc. Replacement cover for electromagnetic shielding system
JP2006106618A (ja) * 2004-10-08 2006-04-20 Hitachi Ltd 表示装置
US7087835B2 (en) * 2004-10-19 2006-08-08 Bi-Link Metal Specialties Inc. Apparatus and method for shielding printed circuit boards
DE102005017527A1 (de) * 2005-04-15 2006-11-02 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement
US7491899B2 (en) * 2005-10-06 2009-02-17 Laird Technologies, Inc. EMI shields and related manufacturing methods
USD549231S1 (en) 2005-12-16 2007-08-21 Laird Technologies, Inc. Cover for an EMI shield assembly
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
USD548738S1 (en) 2005-12-16 2007-08-14 Laird Technologies, Inc. EMI shield assembly
USD549706S1 (en) 2005-12-16 2007-08-28 Laird Technologies, Inc. Frame for an EMI shield assembly
US7518880B1 (en) 2006-02-08 2009-04-14 Bi-Link Shielding arrangement for electronic device
TWM318903U (en) * 2007-04-03 2007-09-11 Chin-Fu Horng Electromagnetic shielding device
US7504592B1 (en) 2007-08-31 2009-03-17 Laird Technologies, Inc. Electromagnetic interference shields and related manufacturing methods
US20090283318A1 (en) * 2008-05-13 2009-11-19 Honeywell International Inc. Integrated EMI Shield Termination and Cable Support Apparatus
TWM380706U (en) * 2009-12-10 2010-05-11 Wistron Corp Metal shielding casing and the combination thereof with circuit board
JP2010245561A (ja) * 2010-07-13 2010-10-28 Fujitsu Media Device Kk 電子部品の製造方法
KR101046502B1 (ko) * 2010-11-12 2011-07-04 주식회사 케이엠더블유 통신용 함체
US10206317B2 (en) 2015-06-29 2019-02-12 Microsoft Technology Licensing, Llc Modular radio frequency shielding

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4370515A (en) 1979-12-26 1983-01-25 Rockwell International Corporation Electromagnetic interference
US4754101A (en) 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
JPS6427298A (en) * 1987-07-23 1989-01-30 Uniden Kk Shielding structure for circuit device on substrate
US4838475A (en) * 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
US4857668A (en) 1988-04-15 1989-08-15 Schlegel Corporation Multi-function gasket
US4890199A (en) * 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
JPH0582983A (ja) 1991-09-20 1993-04-02 Mitsubishi Electric Corp ケースの保持方法
US5252782A (en) 1992-06-29 1993-10-12 E-Systems, Inc. Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board
US5354951A (en) 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
US5579212A (en) 1993-07-29 1996-11-26 Sun Microsystems, Inc. Protective cover for a silicon chip device and method relating thereto
US5557063A (en) 1994-01-03 1996-09-17 Lucent Technologies Inc. Electronic component enclosure for RF shielding
JPH0818265A (ja) 1994-06-29 1996-01-19 Molex Inc プリント回路基板上での電磁波等のシ−ルド方法 及びその為のシ−ルドカバ−
GB2297868B (en) * 1995-02-07 1999-04-28 Nokia Mobile Phones Ltd A shielding device
DE19730417C1 (de) * 1997-07-16 1998-10-22 Hagenuk Telecom Gmbh I K Befestigungsmittel für Abschirmgehäuse von elektrischen Leiterplatten und Verfahren zu seiner Herstellung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720066B (zh) * 2015-12-24 2021-03-01 美商英特爾公司 電子裝置封裝體及其製作方法

Also Published As

Publication number Publication date
DE10084137T1 (de) 2002-03-07
US6175077B1 (en) 2001-01-16
CN1340291A (zh) 2002-03-13
WO2000048441A1 (en) 2000-08-17
MY123494A (en) 2006-05-31
AU2608600A (en) 2000-08-29
JP2002537640A (ja) 2002-11-05
DE10084137B4 (de) 2009-06-10

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050810

Termination date: 20100212