CN1213081A - 电子器件及为电子器件形成膜的方法 - Google Patents
电子器件及为电子器件形成膜的方法 Download PDFInfo
- Publication number
- CN1213081A CN1213081A CN98116373A CN98116373A CN1213081A CN 1213081 A CN1213081 A CN 1213081A CN 98116373 A CN98116373 A CN 98116373A CN 98116373 A CN98116373 A CN 98116373A CN 1213081 A CN1213081 A CN 1213081A
- Authority
- CN
- China
- Prior art keywords
- semiconductor substrate
- substrate
- layer
- electronic device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
- H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP97401796.4 | 1997-07-25 | ||
| EP97401796A EP0893827B1 (en) | 1997-07-25 | 1997-07-25 | Electronic device and method for forming a membrane for an electronic device |
| US09/120,755 US6022754A (en) | 1997-07-25 | 1998-07-22 | Electronic device and method for forming a membrane for an electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1213081A true CN1213081A (zh) | 1999-04-07 |
Family
ID=26147864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98116373A Pending CN1213081A (zh) | 1997-07-25 | 1998-07-24 | 电子器件及为电子器件形成膜的方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6022754A (https=) |
| EP (1) | EP0893827B1 (https=) |
| JP (1) | JP4271751B2 (https=) |
| CN (1) | CN1213081A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102354659A (zh) * | 2011-11-02 | 2012-02-15 | 上海宏力半导体制造有限公司 | 掩膜成核消除方法以及选择性外延生长方法 |
| CN110797255A (zh) * | 2019-10-14 | 2020-02-14 | 长江存储科技有限责任公司 | 薄膜堆叠结构、三维存储器及其制备方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19817311B4 (de) * | 1998-04-18 | 2007-03-22 | Robert Bosch Gmbh | Herstellungsverfahren für mikromechanisches Bauelement |
| US6387724B1 (en) * | 1999-02-26 | 2002-05-14 | Dynamics Research Corporation | Method of fabricating silicon-on-insulator sensor having silicon oxide sensing surface |
| JP4513161B2 (ja) * | 2000-03-31 | 2010-07-28 | 東亞合成株式会社 | ガスセンサの製造方法及びガスセンサ |
| US6468897B1 (en) * | 2001-05-23 | 2002-10-22 | Macronix International Co., Ltd. | Method of forming damascene structure |
| AU2006351677B2 (en) | 2006-12-14 | 2011-03-10 | Ito En, Ltd. | Process for producing tea drink |
| US9354197B2 (en) * | 2013-04-25 | 2016-05-31 | Wisenstech Ltd. | Micromachined oxygen sensor and method of making the same |
| KR101616959B1 (ko) * | 2013-07-02 | 2016-04-29 | 전자부품연구원 | Fet 이온센서 및 이를 이용한 시스템 |
| KR102142885B1 (ko) * | 2013-10-14 | 2020-08-10 | 한국전자통신연구원 | 어레이형 광검출기를 제조하는 방법 |
| CN103606565B (zh) * | 2013-11-27 | 2016-05-11 | 苏州科技学院 | 压力传感器敏感元件的制造工艺 |
| WO2017205146A1 (en) * | 2016-05-27 | 2017-11-30 | Carrier Corporation | Gas detection device and method of manufacturing the same |
| FR3079616B1 (fr) * | 2018-03-30 | 2021-02-12 | Soitec Silicon On Insulator | Micro-capteur pour detecter des especes chimiques et procede de fabrication associe |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4706493A (en) * | 1985-12-13 | 1987-11-17 | General Motors Corporation | Semiconductor gas sensor having thermally isolated site |
| FR2615287B1 (fr) * | 1987-05-12 | 1989-10-06 | Suisse Electronique Microtech | Micro-capteur a technologie integree pour la detection de la presence de certains gaz |
| JP2582343B2 (ja) * | 1993-12-04 | 1997-02-19 | エルジー電子株式会社 | 低消費電力型薄膜ガスセンサ及びその製造方法 |
| US5635628A (en) * | 1995-05-19 | 1997-06-03 | Siemens Aktiengesellschaft | Method for detecting methane in a gas mixture |
-
1997
- 1997-07-25 EP EP97401796A patent/EP0893827B1/en not_active Expired - Lifetime
-
1998
- 1998-07-22 US US09/120,755 patent/US6022754A/en not_active Expired - Lifetime
- 1998-07-24 JP JP22525298A patent/JP4271751B2/ja not_active Expired - Fee Related
- 1998-07-24 CN CN98116373A patent/CN1213081A/zh active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102354659A (zh) * | 2011-11-02 | 2012-02-15 | 上海宏力半导体制造有限公司 | 掩膜成核消除方法以及选择性外延生长方法 |
| CN102354659B (zh) * | 2011-11-02 | 2016-05-11 | 上海华虹宏力半导体制造有限公司 | 掩膜成核消除方法以及选择性外延生长方法 |
| CN110797255A (zh) * | 2019-10-14 | 2020-02-14 | 长江存储科技有限责任公司 | 薄膜堆叠结构、三维存储器及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11166866A (ja) | 1999-06-22 |
| EP0893827A1 (en) | 1999-01-27 |
| JP4271751B2 (ja) | 2009-06-03 |
| EP0893827B1 (en) | 2004-05-06 |
| US6022754A (en) | 2000-02-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |