CN120898272A - 临时保护材料和临时保护材料溶液 - Google Patents

临时保护材料和临时保护材料溶液

Info

Publication number
CN120898272A
CN120898272A CN202480022573.6A CN202480022573A CN120898272A CN 120898272 A CN120898272 A CN 120898272A CN 202480022573 A CN202480022573 A CN 202480022573A CN 120898272 A CN120898272 A CN 120898272A
Authority
CN
China
Prior art keywords
protective material
temporary protective
weight
polyvinyl alcohol
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480022573.6A
Other languages
English (en)
Chinese (zh)
Inventor
米田义和
山田佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN120898272A publication Critical patent/CN120898272A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
    • C09D129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09D129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN202480022573.6A 2023-07-21 2024-07-18 临时保护材料和临时保护材料溶液 Pending CN120898272A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023119191 2023-07-21
JP2023-119191 2023-07-21
PCT/JP2024/025729 WO2025023133A1 (ja) 2023-07-21 2024-07-18 仮保護材及び仮保護材溶液

Publications (1)

Publication Number Publication Date
CN120898272A true CN120898272A (zh) 2025-11-04

Family

ID=94374460

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480022573.6A Pending CN120898272A (zh) 2023-07-21 2024-07-18 临时保护材料和临时保护材料溶液

Country Status (5)

Country Link
JP (1) JPWO2025023133A1 (https=)
KR (1) KR20260042344A (https=)
CN (1) CN120898272A (https=)
TW (1) TW202509171A (https=)
WO (1) WO2025023133A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5563341B2 (ja) * 2010-03-18 2014-07-30 株式会社クラレ 半導体ウエハーの分割方法
JP6051302B2 (ja) * 2013-05-29 2016-12-27 三井化学東セロ株式会社 半導体ウエハ保護用フィルム及び半導体装置の製造方法
JP5978246B2 (ja) * 2014-05-13 2016-08-24 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JP6533150B2 (ja) * 2015-11-18 2019-06-19 日本酢ビ・ポバール株式会社 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法
JP7036623B2 (ja) * 2018-02-28 2022-03-15 積水化学工業株式会社 積層体
JP7185086B1 (ja) * 2021-09-16 2022-12-06 積水化学工業株式会社 仮保護材

Also Published As

Publication number Publication date
TW202509171A (zh) 2025-03-01
JPWO2025023133A1 (https=) 2025-01-30
KR20260042344A (ko) 2026-03-31
WO2025023133A1 (ja) 2025-01-30

Similar Documents

Publication Publication Date Title
JP6310657B2 (ja) レーザダイシング用ウエハ保護膜組成物
JP5511799B2 (ja) ウエハーダイシング用保護膜組成物
KR101322522B1 (ko) 접착제 조성물 및 접착 필름
JP5020496B2 (ja) 接着剤組成物および接着フィルム
JP5563341B2 (ja) 半導体ウエハーの分割方法
CN120898272A (zh) 临时保护材料和临时保护材料溶液
JP7185086B1 (ja) 仮保護材
TWI769770B (zh) 接著性聚合物之分解洗淨組成物，及接著性聚合物之洗淨方法
WO2022158461A1 (ja) 半導体転写用フラックスシート
CN116875141B (zh) 一种切割保护材料、其制备方法与应用
KR20150016430A (ko) 망상형 고분자 용해용 조성물
KR101539763B1 (ko) 웨이퍼 다이싱용 보호막 조성물
CN117230579B (zh) 一种轻离型力的柔性离型膜及其制备方法
WO2023042840A1 (ja) 仮保護材
JP3514051B2 (ja) シリコンウエハー保護膜用樹脂組成物
US20030190446A1 (en) Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
JP2968879B2 (ja) 半導体ウエハ加工用フィルム
JPH0673347A (ja) ウエハ加工用テープおよびその使用方法
TWI386474B (zh) 黏著劑組成物，及黏著薄膜
JP2012036269A (ja) 接着剤組成物
KR20160070385A (ko) 실리콘계 수지 제거용 조성물
JP2011006595A (ja) 接着剤組成物、および接着フィルム
JP2023043861A (ja) 接着用プライマー、電子部品の製造方法
US20250354035A1 (en) Water-soluble adhesive composition for component capture, water-soluble adhesive sheet for component capture, and method for producing electronic component
JP2023043860A (ja) 仮保護材

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination