TW202509171A - 暫時保護材及暫時保護材溶液 - Google Patents

暫時保護材及暫時保護材溶液 Download PDF

Info

Publication number
TW202509171A
TW202509171A TW113127120A TW113127120A TW202509171A TW 202509171 A TW202509171 A TW 202509171A TW 113127120 A TW113127120 A TW 113127120A TW 113127120 A TW113127120 A TW 113127120A TW 202509171 A TW202509171 A TW 202509171A
Authority
TW
Taiwan
Prior art keywords
protective material
temporary protective
less
polyvinyl alcohol
water
Prior art date
Application number
TW113127120A
Other languages
English (en)
Chinese (zh)
Inventor
米田義和
山田佑
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202509171A publication Critical patent/TW202509171A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
    • C09D129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09D129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW113127120A 2023-07-21 2024-07-19 暫時保護材及暫時保護材溶液 TW202509171A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023119191 2023-07-21
JP2023-119191 2023-07-21

Publications (1)

Publication Number Publication Date
TW202509171A true TW202509171A (zh) 2025-03-01

Family

ID=94374460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113127120A TW202509171A (zh) 2023-07-21 2024-07-19 暫時保護材及暫時保護材溶液

Country Status (5)

Country Link
JP (1) JPWO2025023133A1 (https=)
KR (1) KR20260042344A (https=)
CN (1) CN120898272A (https=)
TW (1) TW202509171A (https=)
WO (1) WO2025023133A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5563341B2 (ja) * 2010-03-18 2014-07-30 株式会社クラレ 半導体ウエハーの分割方法
JP6051302B2 (ja) * 2013-05-29 2016-12-27 三井化学東セロ株式会社 半導体ウエハ保護用フィルム及び半導体装置の製造方法
JP5978246B2 (ja) * 2014-05-13 2016-08-24 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JP6533150B2 (ja) * 2015-11-18 2019-06-19 日本酢ビ・ポバール株式会社 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法
JP7036623B2 (ja) * 2018-02-28 2022-03-15 積水化学工業株式会社 積層体
JP7185086B1 (ja) * 2021-09-16 2022-12-06 積水化学工業株式会社 仮保護材

Also Published As

Publication number Publication date
JPWO2025023133A1 (https=) 2025-01-30
KR20260042344A (ko) 2026-03-31
CN120898272A (zh) 2025-11-04
WO2025023133A1 (ja) 2025-01-30

Similar Documents

Publication Publication Date Title
TWI599627B (zh) 雷射切割用晶圓保護膜組合物及半導體元件製造方法
TW202105088A (zh) 用於自半導體基板去除光阻之剝離組成物
CN109195720A (zh) 用于从半导体基板去除光刻胶的剥离组合物
JP7574798B2 (ja) 組成物、及び接着性ポリマーの洗浄方法
US11268024B2 (en) Etching compositions
TW202509171A (zh) 暫時保護材及暫時保護材溶液
JP2025061778A (ja) エッチング組成物
KR102924922B1 (ko) 조성물, 및 접착성 폴리머의 세정 방법
CN116829298A (zh) 半导体转印用助焊剂片
JP7185086B1 (ja) 仮保護材
TW201833235A (zh) 高熱穩定性之雷射切割保護膜組成物
KR101539763B1 (ko) 웨이퍼 다이싱용 보호막 조성물
JP3514051B2 (ja) シリコンウエハー保護膜用樹脂組成物
KR20160070385A (ko) 실리콘계 수지 제거용 조성물
WO2023042840A1 (ja) 仮保護材
KR20160070386A (ko) 실리콘계 수지 제거용 조성물
US20250354035A1 (en) Water-soluble adhesive composition for component capture, water-soluble adhesive sheet for component capture, and method for producing electronic component
JP2023043861A (ja) 接着用プライマー、電子部品の製造方法
JP2024135994A (ja) 樹脂組成物、ウエハ保護膜、ウエハ保護部材及びウエハ保護膜の除去方法
KR20220083217A (ko) 고분자 처리용 공정액
WO2019059219A1 (ja) 誘電性シート
KR20160070387A (ko) 실리콘계 수지 제거용 조성물
KR20170120398A (ko) 편광판 및 이를 포함하는 액정표시장치