CN120752287A - 苯硫醚-苯醚共聚物 - Google Patents

苯硫醚-苯醚共聚物

Info

Publication number
CN120752287A
CN120752287A CN202480016758.6A CN202480016758A CN120752287A CN 120752287 A CN120752287 A CN 120752287A CN 202480016758 A CN202480016758 A CN 202480016758A CN 120752287 A CN120752287 A CN 120752287A
Authority
CN
China
Prior art keywords
phenylene
ether copolymer
formula
phenylene ether
sulfide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480016758.6A
Other languages
English (en)
Chinese (zh)
Inventor
石川慎介
井上庆三
伊藤大祐
小柳津研一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Waseda University
Original Assignee
Daicel Corp
Waseda University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp, Waseda University filed Critical Daicel Corp
Publication of CN120752287A publication Critical patent/CN120752287A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/0204—Polyarylenethioethers
    • C08G75/0236—Polyarylenethioethers containing atoms other than carbon or sulfur in a linkage between arylene groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/0204—Polyarylenethioethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/0204—Polyarylenethioethers
    • C08G75/0209—Polyarylenethioethers derived from monomers containing one aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN202480016758.6A 2023-03-07 2024-02-29 苯硫醚-苯醚共聚物 Pending CN120752287A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023034440 2023-03-07
JP2023-034440 2023-03-07
PCT/JP2024/007495 WO2024185634A1 (ja) 2023-03-07 2024-02-29 フェニレンスルフィド－フェニレンオキシド共重合体

Publications (1)

Publication Number Publication Date
CN120752287A true CN120752287A (zh) 2025-10-03

Family

ID=92675016

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480016758.6A Pending CN120752287A (zh) 2023-03-07 2024-02-29 苯硫醚-苯醚共聚物

Country Status (6)

Country Link
EP (1) EP4678682A1 (https=)
JP (1) JPWO2024185634A1 (https=)
KR (1) KR20250158771A (https=)
CN (1) CN120752287A (https=)
TW (1) TW202446844A (https=)
WO (1) WO2024185634A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4627255B1 (https=) * 1967-04-25 1971-08-07
JPS6433128A (en) * 1987-07-29 1989-02-03 Seitetsu Kagaku Co Ltd Production of poly (p-phenoxyphenyl sulfide)
JPH0598157A (ja) 1991-10-03 1993-04-20 Sumitomo Bakelite Co Ltd 熱可塑性電気絶縁基板
JP2001310911A (ja) * 2000-04-28 2001-11-06 Sumitomo Seika Chem Co Ltd 誘電体形成物質及び誘電体フィルム
JP2002225029A (ja) 2001-01-30 2002-08-14 Toray Ind Inc 熱可塑性樹脂含浸繊維シートおよび回路基板
JP2005060635A (ja) 2003-08-20 2005-03-10 Mitsubishi Gas Chem Co Inc 積層板用樹脂組成物およびプリプレグおよび金属張積層板

Also Published As

Publication number Publication date
WO2024185634A1 (ja) 2024-09-12
KR20250158771A (ko) 2025-11-06
EP4678682A1 (en) 2026-01-14
TW202446844A (zh) 2024-12-01
JPWO2024185634A1 (https=) 2024-09-12

Similar Documents

Publication Publication Date Title
JP2021181531A (ja) 熱硬化性マレイミド樹脂組成物並びにこれを用いた接着剤、基板材料、プライマー、コーティング材及び半導体装置
KR102338982B1 (ko) 열경화성 수지 조성물, 이를 이용한 프리프레그 및 기판
CN109748998B (zh) 呋喃改性的化合物及低聚物
JP7552037B2 (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板、半導体パッケージ及び樹脂組成物の製造方法
CN117836346A (zh) 烯丙基醚化合物、树脂组合物及其固化物
CN114051502B (zh) 末端由不饱和基团封端的含磷树脂、其制备方法、以及包含末端由不饱和基团封端的含磷树脂的树脂组合物
TW201437247A (zh) 一種無鹵難燃及高玻璃轉移溫度之酚醛樹脂硬化劑及其製法
TWI880524B (zh) 取代型聚苯硫醚樹脂
JP7849888B2 (ja) 低誘電材料用の樹脂組成物、積層基板用フィルム、積層基板、低誘電材料用の樹脂組成物の製造方法、積層基板用フィルムの製造方法及び積層基板の製造方法
JP4988218B2 (ja) 低誘電損失樹脂の製造方法
JP2008115280A (ja) 低誘電損失樹脂組成物、その硬化物およびそれを用いた電子部品
CN120752287A (zh) 苯硫醚-苯醚共聚物
CN112239460B (zh) 芳香族双马来酰亚胺化合物及其制造方法、及含该化合物的热固性环状酰亚胺树脂组合物
TW201516070A (zh) 環氧樹脂組成物及其硬化物
JP7527577B2 (ja) 置換型ポリフェニレンサルファイド樹脂
CN115637020A (zh) 一种超支化环氧树脂热固性树脂组合物及其应用
CN112745503B (zh) 改性双马来酰亚胺树脂及其制备方法、预浸材、铜箔基板及印刷电路板
JP5475214B2 (ja) ポリ（フェニレンエーテル）の製造方法およびポリ（フェニレンエーテル）
KR102734116B1 (ko) 저유전 특성을 갖는 신규 비스말레이미드계 열경화성 수지 및 이를 포함하는 복합수지
TW202212416A (zh) 改性雙馬來醯亞胺樹脂、其製備方法、預浸材、銅箔基板及電路板
TW202538018A (zh) 含取代型聚苯硫醚樹脂之樹脂組成物
CN103665764A (zh) 绝缘用环氧树脂组合物、绝缘薄膜、半固化片以及印刷电路基板
JP3525745B2 (ja) エポキシ樹脂組成物およびこのエポキシ樹脂組成物を用いた絶縁基板
JP2026047174A (ja) メソゲン骨格を有する化合物、硬化性組成物、封止材、プリント基板材料、及び電気電子部品
JP2021181505A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ並びに多層プリント配線板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination