KR20250158771A - 페닐렌술피드-페닐렌옥시드 공중합체 - Google Patents
페닐렌술피드-페닐렌옥시드 공중합체Info
- Publication number
- KR20250158771A KR20250158771A KR1020257032192A KR20257032192A KR20250158771A KR 20250158771 A KR20250158771 A KR 20250158771A KR 1020257032192 A KR1020257032192 A KR 1020257032192A KR 20257032192 A KR20257032192 A KR 20257032192A KR 20250158771 A KR20250158771 A KR 20250158771A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- phenylene
- oxide copolymer
- formula
- phenylene sulfide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/0204—Polyarylenethioethers
- C08G75/0236—Polyarylenethioethers containing atoms other than carbon or sulfur in a linkage between arylene groups
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0333—Organic insulating material consisting of one material containing S
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/0204—Polyarylenethioethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/0204—Polyarylenethioethers
- C08G75/0209—Polyarylenethioethers derived from monomers containing one aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
- C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
- C09J181/02—Polythioethers; Polythioether-ethers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2023-034440 | 2023-03-07 | ||
| JP2023034440 | 2023-03-07 | ||
| PCT/JP2024/007495 WO2024185634A1 (ja) | 2023-03-07 | 2024-02-29 | フェニレンスルフィド-フェニレンオキシド共重合体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250158771A true KR20250158771A (ko) | 2025-11-06 |
Family
ID=92675016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257032192A Pending KR20250158771A (ko) | 2023-03-07 | 2024-02-29 | 페닐렌술피드-페닐렌옥시드 공중합체 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4678682A1 (https=) |
| JP (1) | JPWO2024185634A1 (https=) |
| KR (1) | KR20250158771A (https=) |
| CN (1) | CN120752287A (https=) |
| TW (1) | TW202446844A (https=) |
| WO (1) | WO2024185634A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0598157A (ja) | 1991-10-03 | 1993-04-20 | Sumitomo Bakelite Co Ltd | 熱可塑性電気絶縁基板 |
| JP2002225029A (ja) | 2001-01-30 | 2002-08-14 | Toray Ind Inc | 熱可塑性樹脂含浸繊維シートおよび回路基板 |
| JP2005060635A (ja) | 2003-08-20 | 2005-03-10 | Mitsubishi Gas Chem Co Inc | 積層板用樹脂組成物およびプリプレグおよび金属張積層板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4627255B1 (https=) * | 1967-04-25 | 1971-08-07 | ||
| JPS6433128A (en) * | 1987-07-29 | 1989-02-03 | Seitetsu Kagaku Co Ltd | Production of poly (p-phenoxyphenyl sulfide) |
| JP2001310911A (ja) * | 2000-04-28 | 2001-11-06 | Sumitomo Seika Chem Co Ltd | 誘電体形成物質及び誘電体フィルム |
-
2024
- 2024-02-29 JP JP2025505263A patent/JPWO2024185634A1/ja active Pending
- 2024-02-29 CN CN202480016758.6A patent/CN120752287A/zh active Pending
- 2024-02-29 WO PCT/JP2024/007495 patent/WO2024185634A1/ja not_active Ceased
- 2024-02-29 EP EP24767004.5A patent/EP4678682A1/en active Pending
- 2024-02-29 KR KR1020257032192A patent/KR20250158771A/ko active Pending
- 2024-03-07 TW TW113108374A patent/TW202446844A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0598157A (ja) | 1991-10-03 | 1993-04-20 | Sumitomo Bakelite Co Ltd | 熱可塑性電気絶縁基板 |
| JP2002225029A (ja) | 2001-01-30 | 2002-08-14 | Toray Ind Inc | 熱可塑性樹脂含浸繊維シートおよび回路基板 |
| JP2005060635A (ja) | 2003-08-20 | 2005-03-10 | Mitsubishi Gas Chem Co Inc | 積層板用樹脂組成物およびプリプレグおよび金属張積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024185634A1 (ja) | 2024-09-12 |
| CN120752287A (zh) | 2025-10-03 |
| EP4678682A1 (en) | 2026-01-14 |
| TW202446844A (zh) | 2024-12-01 |
| JPWO2024185634A1 (https=) | 2024-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021181531A (ja) | 熱硬化性マレイミド樹脂組成物並びにこれを用いた接着剤、基板材料、プライマー、コーティング材及び半導体装置 | |
| CN109306171B (zh) | 一种热固性树脂组合物、由其制作的半固化片、覆金属箔层压板及高频电路板 | |
| KR102728399B1 (ko) | 알케닐기 함유 화합물, 경화성 수지 조성물 및 그 경화물 | |
| WO2023032534A1 (ja) | アリルエーテル化合物、樹脂組成物及びその硬化物 | |
| KR102816815B1 (ko) | 치환형 폴리페닐렌술피드 수지 | |
| TW201437247A (zh) | 一種無鹵難燃及高玻璃轉移溫度之酚醛樹脂硬化劑及其製法 | |
| Su et al. | Preparation, characterization and curing properties of epoxy-terminated poly (alkyl-phenylene oxide) s | |
| JP4988218B2 (ja) | 低誘電損失樹脂の製造方法 | |
| KR102230098B1 (ko) | 에폭시 수지 조성물 및 그 경화물 | |
| KR20210033803A (ko) | 말단이 불포화기로 캡핑된 인 함유 수지, 이의 제조방법 및 상기 말단이 불포화기로 캡핑된 인 함유 수지를 포함하는 수지 조성물 | |
| KR20250158771A (ko) | 페닐렌술피드-페닐렌옥시드 공중합체 | |
| KR20220141151A (ko) | 폴리 페닐렌 에테르계 수지 혼합물 | |
| JP7527577B2 (ja) | 置換型ポリフェニレンサルファイド樹脂 | |
| KR20250103607A (ko) | 열경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판 | |
| TWI775052B (zh) | 聚苯醚中間體、聚苯醚衍生物及其製備方法和應用 | |
| US20220081514A1 (en) | Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board | |
| CN115637020A (zh) | 一种超支化环氧树脂热固性树脂组合物及其应用 | |
| US8912293B2 (en) | Resin composition, and prepeg and laminate prepared using the same | |
| JP5339318B2 (ja) | 多層配線基板用低誘電損失樹脂、樹脂組成物、プリプレグ及び多層配線基板 | |
| JP5475214B2 (ja) | ポリ(フェニレンエーテル)の製造方法およびポリ(フェニレンエーテル) | |
| JP2023120458A (ja) | 樹脂組成物、プリプレグ、樹脂付き金属箔、樹脂付きフィルム、金属張積層板、及び配線基板、並びに、変性ポリフェニレンエーテルの製造方法 | |
| JP2006291125A (ja) | 新規共重合体、樹脂組成物、その硬化物及び電子部品 | |
| CN103665764A (zh) | 绝缘用环氧树脂组合物、绝缘薄膜、半固化片以及印刷电路基板 | |
| KR102754827B1 (ko) | 에폭시계 수지 경화제용 고내열성, 저유전성 활성 에스테르 화합물 및 이의 제조방법 | |
| TW202538018A (zh) | 含取代型聚苯硫醚樹脂之樹脂組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |